IP Library Granted Patent US 12,035,547
Granted Patent B2
US 12,035,547 · App. 17/276,963 · Granted Jul 9, 2024

Image pickup element, stacked image pickup element, and solid-state image pickup apparatus that exel in characteristics of transferring an electric charge accmlarted in photoelectric conversion layer

Inventors: Yoichiro Iino (Tokyo, JP); Hiroshi Nakano (Tokyo, JP); Toshiki Moriwaki (Tokyo, JP)
Assignee: SONY CORPORATION
H10K30/10H10K39/32H10K85/211
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Quick Facts
Patent No.
US 12,035,547
App. No.
17/276,963
Granted
Jul 9, 2024
Kind
B2
Abstract

An image pickup element 10 includes a first electrode 21 , a charge accumulation electrode 24 that is arranged apart from the first electrode 21 , a photoelectric conversion unit 23 that contacts the first electrode 21 and is formed above the charge accumulation electrode 24 via an insulation layer 82 , and a second electrode 22 formed on the photoelectric conversion unit 23 . The photoelectric conversion unit 23 includes, from the second-electrode side, a photoelectric conversion layer 23 A, and an inorganic oxide semiconductor material layer 23 B including In a Ga b Sn c O d , and 0.30≤b/(a+b+c)≤0.50 and b≥c are satisfied.

Claims (41)

1. An image pickup element, comprising:

a first electrode;

a charge accumulation electrode arranged apart from the first electrode;

a photoelectric conversion unit that contacts the first electrode and is formed above the charge accumulation electrode via an insulation layer; and

a second electrode formed on the photoelectric conversion unit, wherein

the photoelectric conversion unit includes, from a second-electrode side, a photoelectric conversion layer, and an inorganic oxide semiconductor material layer including a composite oxide of an indium oxide, a gallium oxide, and a tin oxide,

the composite oxide is In a Ga b Sn c O d ,

a indicates an atomic ratio of indium (In) atoms,

b indicates an atomic ratio of gallium (Ga) atoms,

c indicates an atomic ratio of tin (Sn) atoms, and

0.30≤b/(a+b+c)≤0.50 and b≥c are satisfied.

2. The image pickup element according to claim 1 , wherein 0.40≤b/(a+b+c)≤0.50 is satisfied.

3. The image pickup element according to claim 1 , wherein b≥1.2c is satisfied.

4. The image pickup element according to claim 1 , wherein

an energy average value of a maximum energy value in a conduction band of the inorganic oxide semiconductor material layer is E11,

an energy average value of a LUMO value of the photoelectric conversion layer is E12, and

E12≥E11 is satisfied.

5. The image pickup element according to claim 1 , wherein

an energy average value of a minimum energy value in a valence band of the inorganic oxide semiconductor material layer is E21,

an energy average value of a HOMO value of the photoelectric conversion layer is E22, and

E22≥E21 is satisfied.

6. The image pickup element according to claim 1 , wherein

an energy average value of a maximum energy value in a conduction band of the inorganic oxide semiconductor material layer is E11, and

E11≤−4.5 eV is satisfied.

7. The image pickup element according to claim 1 , wherein

the photoelectric conversion layer includes an n-type organic semiconductor.

8. The image pickup element according to claim 7 , wherein

the photoelectric conversion layer includes a fullerene or a fullerene derivative.

9. The image pickup element according to claim 1 , wherein

the photoelectric conversion layer includes an electron transport material.

10. The image pickup element according to claim 1 , wherein

the photoelectric conversion layer is configured to generate an electric charge, and

the electric charge is transferred to the first electrode via the inorganic oxide semiconductor material layer.

11. The image pickup element according to claim 10 , wherein

the electric charge is electrons.

12. A stacked image pickup element, comprising:

at least one of the image pickup element according to claim 1 .

13. A solid-state image pickup apparatus, comprising:

a plurality of the image pickup elements according to claim 1 .

14. A solid-state image pickup apparatus, comprising:

a plurality of the stacked image pickup elements according to claim 12 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2021
From: IINO, YOICHIRO; NAKANO, HIROSHI; MORIWAKI, TOSHIKI
To: SONY CORPORATION
Reel/Frame 057257/0466 →
Priority Claims (1)
JP 2018-183617 · Sep 28, 2018 · national
Continuity (1)
Related Publication 20220037602A1 · Feb 3, 2022