IP Library Granted Patent US 12,490,540
Granted Patent B2
US 12,490,540 · App. 17/283,901 · Granted Dec 2, 2025

Optical semiconductor array

Inventor: Takehito Satoh (Kyoto, JP)
Assignee: Dexerials Corporation
H10F39/811H10F30/20H10F39/024
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Quick Facts
Patent No.
US 12,490,540
App. No.
17/283,901
Granted
Dec 2, 2025
Kind
B2
Abstract

In an optical semiconductor array ( 1 A) having a semiconductor substrate ( 10 ) and a plurality of mesa-shaped optical semiconductor elements ( 11 a to 11 d ) separated by grooves ( 12 a, 12 b ) on the semiconductor substrate ( 10 ), each of the plurality of optical semiconductor elements ( 11 a to 11 d ) comprises a semiconductor laminated part ( 20 ) including a first semiconductor layer ( 20 a ) in contact with the semiconductor substrate ( 10 ), and a connecting hole ( 21 a ) formed at a portion separated from the groove ( 12 a, 12 b ) in the semiconductor laminated part ( 20 ) so as to extend from a surface of the semiconductor laminated part ( 20 ) to the first semiconductor layer ( 20 a ).

Claims (6)

1 . An optical semiconductor array having a semiconductor substrate and a plurality of mesa-shaped optical semiconductor elements separated by grooves on the semiconductor substrate, wherein

each of the plurality of optical semiconductor elements comprises a semiconductor laminated part including a first semiconductor layer in contact with the semiconductor substrate,

a connecting hole formed at a portion separated from the groove in the semiconductor laminated part so as to extend from a surface of the semiconductor laminated part to the first semiconductor layer, and

a protective film having an insulating property covering the surface of the semiconductor laminated part and a cylindrical inner wall of the connecting hole; wherein

there are provided with an embedded protective film embedded in a whole of the groove so as to continue from the protective film, and a wiring for connecting, through the connecting hole of one of the adjacent optical semiconductor elements and a wiring connection portion formed through the protective film so as to expose a portion of the surface of the semiconductor laminated part of the other of the adjacent optical semiconductor elements, the first semiconductor layer of the one optical semiconductor element and a surface of the semiconductor laminated part of the other optical semiconductor element; wherein

a portion of the wiring is formed on a surface of the embedded protective film at a position passing the groove.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2024
From: DEXERIALS PHOTONICS SOLUTIONS CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 068013/0329 →
CHANGE OF NAME Recorded Jun 26, 2024
From: KYOTO SEMICONDUCTOR CO., LTD.
To: DEXERIALS PHOTONICS SOLUTIONS CORPORATION
Reel/Frame 067877/0479 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2021
From: SATOH, TAKEHITO
To: KYOTO SEMICONDUCTOR CO., LTD.
Reel/Frame 055869/0407 →
Continuity (1)
Related Publication 20230215895A1 · Jul 6, 2023
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