Assembly of network switch ASIC with optical transceivers
The invention relates to a switch system comprising one or more optical transceiver assemblies ( 14 ) connected to a switch ASIC ( 29 ).
1. A switch system comprising:
an optical transceiver assembly connected to a switch ASIC;
wherein a digital signal processing chip of the optical transceiver assembly is located next to a transceiver chip on a primary high-speed substrate,
wherein the primary high-speed substrate is electrically and mechanically connected to a second high-speed substrate;
wherein the switch ASIC is electrically and mechanically connected to the second high-speed substrate;
wherein a distance from the digital signal processing chip to the switch ASIC is smaller than a distance from the transceiver chip to the switch ASIC;
wherein a pluggable optical connector of the optical transceiver assembly comprises a first heat spreader, wherein the first heat spreader is integral to and movable together with the pluggable connector; and
wherein the heat spreader comprises an overlap section, wherein the overlap section overlaps with both the digital signal processing chip and the transceiver chip when the pluggable optical connector is plugged in;
wherein the digital signal processing chip and the transceiver chip are sandwiched between the first heat spreader of the pluggable optical connector and the primary high-speed substrate when the pluggable optical connector is plugged to a transceiver receptacle.
2. The switch system of claim 1 ,
wherein the switch ASIC is configured to switch electrical signals,
wherein the optical transceiver assembly comprises a layer stack, and
wherein the layer stack includes the following:
the transceiver chip,
a plurality of optical beam forming layers, wherein each of the plurality optical beam forming layers contain lenses or lens arrays etched into the layers' material and which are configured to form an optical beam,
a pluggable optical interface including mechanical guide pins located inside the layer stack, and
an optical imaging system expanding and collimating the optical beam.
3. The switch system of claim 2 ,
wherein the digital signal processing chip is located between the switch ASIC and the transceiver chip, and
wherein the transceiver chip is located between the digital signal processing chip and a fiber ribbon.
4. The switch system of claim 1 , wherein a second heat spreader is located on top of the transceiver assembly.
5. The switch system of claim 4 , wherein the first heat spreader is located above both the digital signal processing chip and the transceiver chip when the pluggable optical connector is plugged to the transceiver receptacle.
6. The switch system of claim 4 , wherein the first heat spreader is configured to hold the pluggable optical connector in position and to dissipate heat.
7. The switch system of claim 1 , wherein the pluggable optical connector encompasses a stack of silicon pieces configured so that heat can be very efficiently dissipated away from the transceiver chip.
8. The switch system of claim 1 , wherein the switch ASIC is configured to switch electrical signals.
9. The switch system of claim 1 , wherein the primary high-speed substrate is electrically and mechanically connected to the second high-speed substrate via a ball grid array or a land grid array on the bottom of the primary high-speed substrate.
10. The switch system of claim 1 , wherein the primary high-speed substrate is rectangularly shaped and has dimensions in the range of 7-10 mm by 20-40 mm.
11. The switch system of claim 1 , wherein the optical transceiver assembly comprises eight optical transceiver assemblies, and wherein four optical transceiver assemblies are arranged on each side of the switch ASIC and are located in the same plane as the switch ASIC.
12. The switch system of claim 1 , wherein the optical transceiver assembly includes one alignment feature for coarse alignment and a second alignment feature for fine alignment.
13. The switch system of claim 12 , wherein the second alignment feature is implemented in a layer stack of one or both of the pluggable optical connector and the transceiver receptacle.
14. The switch system of claim 1 , wherein the primary high speed substrate is a circuit board.
15. The switch system of claim 1 , wherein the pluggable optical connector comprises silicon.
16. The switch system of claim 1 , wherein the first heat spreader of the pluggable optical connector comprises silicon.
17. A switch system comprising:
an optical transceiver assembly;
wherein the optical transceiver assembly is connected to a switch ASIC;
wherein the switch ASIC switches electrical signals;
wherein the optical transceiver assembly includes a layer stack; and
wherein the layer stack comprises:
a transceiver chip,
optical beam forming layers, which each layer includes lenses or lens arrays etched into the layers' material and which are configured to form an optical beam,
a pluggable optical interface including mechanical guide pins, and
an optical imaging system expanding and collimating the optical beam;
wherein a digital signal processing chip of the optical transceiver assembly is located next to the transceiver chip on a primary high-speed substrate,
wherein the primary high-speed substrate is electrically and mechanically connected to a second high-speed substrate;
wherein the switch ASIC is electrically and mechanically connected to the second high-speed substrate;
wherein a distance from the digital signal processing chip to the switch ASIC is smaller than a distance from the transceiver chip to the switch ASIC;
wherein a pluggable optical connector of the optical transceiver assembly comprises a first heat spreader, wherein the first heat spreader is integral to and movable together with the pluggable connector; and
wherein the heat spreader comprises an overlap section, wherein the overlap section overlaps with both the digital signal processing chip and the transceiver chip when the pluggable optical connector is plugged in;
wherein the digital signal processing chip and the transceiver chip are sandwiched between the first heat spreader of the pluggable optical connector and the primary high-speed substrate when the pluggable optical connector is plugged to a transceiver receptacle.
18. The switch system of claim 17 ,
wherein the digital signal processing chip is located between the switch ASIC and the transceiver chip, and
wherein the transceiver chip is located between the digital signal processing chip and a fiber ribbon.
19. The switch system of claim 17 , wherein a second heat spreader is placed on top of the transceiver assembly.
20. The switch system of claim 19 , wherein the first heat spreader is located above both the digital signal processing chip and the transceiver chip when the pluggable optical connector is plugged to the transceiver receptacle.
21. The switch system of claim 19 , wherein the first heat spreader is configured to hold the pluggable optical connector into position and to dissipate heat.
22. The switch system of claim 17 , wherein the pluggable optical connector encompasses a stack of silicon pieces configured so that heat can be very efficiently dissipated away from the transceiver chip.
23. The switch system of claim 17 , wherein the primary high-speed substrate is electrically and mechanically connected to the second high-speed substrate via a ball grid array or a land grid array on the bottom of the primary high-speed substrate.
24. The switch system of claim 17 , wherein the optical transceiver assembly comprises eight optical transceiver assemblies, and wherein four optical transceiver assemblies are arranged on each side of the switch ASIC and are located in the same plane as the switch ASIC.
25. The switch system of claim 24 , wherein the optical transceiver assembly includes one alignment feature for coarse alignment and a second alignment feature for fine alignment.
26. The switch system of claim 17 , wherein the primary high speed substrate is a circuit board.