Led filament arrangement with heat sink structure

1. A light emitting diode, LED, filament arrangement, comprising

at least one LED filament extending along a longitudinal axis, A, wherein the at least one LED filament comprises:

an array of a plurality of light emitting diodes, LEDs, and

an encapsulant comprising a translucent material, wherein the encapsulant at least partially encloses the plurality of LEDs,

and

a heat sink structure, comprising an elongated thermally conducting element extending in the direction of the longitudinal axis A, said at least one LED filament being connected to the elongated thermally conducting element wherein the encapsulant of the at least one LED filament is forming a thermal connection between the heat sink structure and the LED filament for a dissipation of heat from the at least one LED filament, and

wherein the heat sink structure comprises a reflective surface for reflecting the incident light from the at least one LED filament, and

wherein the LED filament arrangement is comprising a clamp for pressing the encapsulant of the at least one LED filament to the heat sink structure.

2. The LED filament arrangement according to claim 1 , wherein the heat sink structure comprises a reflective coating.

3. The LED filament arrangement according to claim 1 , wherein the encapsulant of the at least one LED filament is glued to the heat sink structure.

4. The LED filament arrangement according to claim 1 , further comprising a translucent and heat-conductive substrate arranged between the encapsulant of the at least one LED filament and the heat sink structure.

5. The LED filament arrangement according to claim 4 , wherein the translucent and heat-conductive substrate comprises a material selected from the group consisting of glass, sapphire, quartz.

6. The LED filament arrangement according to claim 4 , wherein the translucent and heat-conductive substrate extends along the longitudinal axis, and is longer than the at least one LED filament along the longitudinal axis.

7. The LED filament arrangement according to claim 6 , wherein the collimator arrangement comprises the translucent and heat-conductive substrate, and wherein the translucent and heat-conductive substrate is configured to provide total internal reflection for the incident light from the at least one LED filament.

8. The LED filament arrangement according to claim 1 , further comprising a collimator arrangement configured to collimate the light emitted from the at least one LED filament.

9. The LED filament arrangement according to claim 8 , wherein the collimator arrangement comprises at least one reflector at least partially enclosing the at least one LED filament, and wherein the collimator arrangement, via the at least one reflector, is configured to collimate the light emitted from the at least one LED filament.

10. The LED filament arrangement according to claim 9 , wherein the at least one reflector comprises at least one mirror for specular reflection of the light emitted from the at least one LED filament.

11. The LED filament arrangement according to claim 1 , wherein the plurality of LEDs of the at least one LED filament is configured to emit light from a respective surface of each LED of the plurality of LEDs, and wherein at least one LED of the plurality of LEDs is arranged in the at least one LED filament such that the respective surface of the at least one LED of the plurality of LEDs is facing the heat sink structure.

12. The LED filament arrangement according to claim 1 , wherein the at least one LED filament is configured to emit light omnidirectionally in the plane perpendicular to the longitudinal axis.

13. Lighting device, comprising:

a LED filament arrangement according to claim 1 ,

a cover comprising an at least partially transparent material, wherein the cover at least partially encloses the LED filament arrangement, and

an electrical connection connected to the LED filament arrangement for a supply of power to the plurality of LEDs of the LED filament arrangement.