IP Library › Granted Patent US 11,987,184
Granted Patent B2
US 11,987,184 · App. 17/289,189 · Granted May 21, 2024

Vehicle-mounted camera

Inventor: Toshihiro Tokito (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
B60R11/04H04N23/57H05K1/118B60R2300/10B60R2300/30H05K2201/10151
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Quick Facts
Patent No.
US 11,987,184
App. No.
17/289,189
Granted
May 21, 2024
Kind
B2
Abstract

[Object] To provide a vehicle-mounted camera capable of successfully absorbing stress applied to a flexible board that connects a main board and an imaging device board to each other. [Solving Means] The vehicle-mounted camera includes an imaging device board, a main board, and a flexible board. The imaging device board includes a first terminal. The main board includes a second terminal. The flexible board includes a first connection portion to be connected to the first terminal, a second connection portion to be connected to the second terminal, and a first bending portion and a second bending portion that are located between the first connection portion and the second connection portion and are bent along a first bending axis and a second bending axis intersecting with each other in a developed state of the flexible board. The vehicle-mounted camera is capable of absorbing stress in any direction applied to the flexible board.

Claims (19)

1. A vehicle-mounted camera, comprising:

an imaging device board including a first terminal;

a main board including a second terminal; and

a flexible board including

a first connection portion to be connected to the first terminal,

a second connection portion to be connected to the second terminal, and

a first bending portion located adjacent to the first connection portion and between the first connection portion and the second connection portion and a second bending portion located adjacent to the second connection portion and between the first connection portion and the second connection portion, wherein the first bending portion is bent along a first bending axis and the second bending portion is bent along a second bending axis, and the first bending axis and the second bending axis intersect each other at an angle.

2. The vehicle-mounted camera according to claim 1 , wherein

the flexible board further includes

a first extension portion including the first bending portion, and

a second extension portion including the second bending portion, and

the first extension portion extends in a direction orthogonal to the first bending axis, and the second extension portion extends in a direction orthogonal to the second bending axis.

3. The vehicle-mounted camera according to claim 1 , wherein

the first bending axis and the second bending axis are orthogonal to each other.

4. The vehicle-mounted camera according to claim 1 , further comprising

an optical unit having an optical axis extending in a thickness direction of the imaging device board.

5. The vehicle-mounted camera according to claim 1 , wherein

the imaging device board further includes a crystal oscillator, and

the flexible board is not located above the crystal oscillator.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2021
From: TOKITO, TOSHIHIRO
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 057031/0971 →
Priority Claims (1)
JP 2018-214503 · Nov 15, 2018 · national
Continuity (1)
Related Publication 20220009425A1 · Jan 13, 2022
Cited By (1)
US 12,545,193