Sintering press for sintering electronic components on a substrate
A sintering press for sintering electronic components on a substrate includes at least one reaction element extending along an element axis parallel to a pressing axis of the sintering press between a first element end and a second element end, the first element end forming a support plane for a respective substrate, at least one load cell operatively connected to the second element end, and an element plate slidably supporting the at least one reaction element and equipped with a heating circuit. The reaction element has a heating portion passing through the element plate and transmitting by conduction heat of the element plate to the substrate. The reaction element has a cooling portion ending with the second element end and shaped to dissipate the heat transmitted from the element plate to the heating portion.
1. A sintering press for sintering electronic components on at least a substrate, the sintering press comprising:
at least one reaction element extending along an element axis parallel to a pressing axis of the sintering press between a first element end and a second element end, wherein the first element end forms a support plane for a respective substrate;
at least one load cell operatively connected to the second element end, so that said load cell detects, by the reaction element, a sum of forces exerted by one or more presser members of the sintering press on respective electronic components to be sintered placed on the substrate, the load cell being housed in a cell holder plate operatively connected to a cooling circuit;
an element plate suitable for slidably supporting the at least one reaction element, the element plate comprising a heating circuit; and
a reaction base, said reaction base comprising both the heating circuit and the cooling circuit, wherein the heating circuit and the cooling circuit are positioned on a same side with respect to the support plane for the substrate, wherein:
the at least one reaction element comprises a heating portion passing through the element plate, and suitable for transmitting by conduction heat of the element plate to the substrate; and
the at least one reaction element further comprises a cooling portion ending with the second element end and shaped to dissipate the heat transmitted from the element plate to the heating portion and, characterized in that said load cell being configured to operate at temperatures much lower than the sintering temperature.
2. The sintering press of claim 1 , wherein the heating portion is prism-shaped.
3. The sintering press of claim 1 , wherein the cooling portion comprises an axial succession of dissipating disks that extend coaxially to the element axis so as to dissipate the heat transmitted from the element plate to the heating portion.
4. The sintering press of claim 1 , wherein the second element end of the reaction element is equipped with an infrared screen facing the load cell.
5. The sintering press of claim 1 , wherein the heating circuit heats the element plate to a working temperature between 240° C. and 290° C.
6. The sintering press of claim 1 , wherein the cooling circuit keeps the cell holder plate at a temperature of 25° C. to 60° C.
7. The sintering press of claim 1 , comprising a plurality of reaction elements slidably supported by the element plate, a load cell being associated with each reaction element.