Shield package
The present invention aims to provide a shield package having a highly distinctive patterned portion formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a sealing material, and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal (autocorrelation length) of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0.
1. A shield package comprising:
a package in which an electronic component is sealed with a sealing material; and
a shield layer covering the package,
wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
a ratio of Sal of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0, where Sal represents an autocorrelation length.
2. The shield package according to claim 1 ,
wherein a surface of the sealing material comprises a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area,
multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and
the depressions are aggregated to draw the patterned portion with lines and/or dots.
3. The shield package according to claim 2 , wherein at least some of the multiple grooves each have a line shape.
4. The shield package according to claim 3 , wherein at least some of the multiple grooves are formed linearly and in parallel to each other.
5. The shield package according to claim 4 , wherein the grooves adjacent to each other are arranged at an interval of 10 to 100 μm.
6. The shield package according to claim 2 , wherein at least some of the multiple grooves are formed in a grid shape.
7. The shield package according to claim 6 , wherein each cell of the grid formed by the grooves has a width of 10 to 100 μm.
8. The shield package according to claim 2 , wherein each groove has a width of 5 to 100 μm.
9. The shield package according to claim 2 , wherein each groove has a depth of 5 μm or more.
10. The shield package according to claim 1 , wherein the patterned portion is a two-dimensional code.
11. A shield package comprising:
a package in which an electronic component is sealed with a sealing material; and
a shield layer covering the package,
wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
a ratio of Smr1 of the non-patterned portion to Smr1 of the patterned portion is as follows: (Smr1 of non-patterned portion)/(Smr1 of patterned portion)>1.0, where Smr1 represents a ratio of the area of the material at the intersection line which separates the protruding hills from the core surface to the evaluation area.
12. A shield package comprising:
a package in which an electronic component is sealed with a sealing material; and
a shield layer covering the package,
wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and
a ratio of Ssk of the non-patterned portion to Ssk of the patterned portion is as follows: (Ssk of non-patterned portion)/(Ssk of patterned portion)<5.0, where Ssk represents skewness.