IP Library › Granted Patent US 12,183,551
Granted Patent B2
US 12,183,551 · App. 17/296,052 · Granted Dec 31, 2024

Gas nozzle, manufacturing method of gas nozzle, and plasma treatment device

Inventors: Yukio Noguchi (Koka, JP); Tomoya Sahashi (Omihachiman, JP)
Assignee: KYOCERA CORPORATION
H01J37/3244B24C1/04B24C1/08C04B35/505C04B35/64C23C16/45578C04B2235/3217H01J2237/3321H01J2237/334
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,183,551
App. No.
17/296,052
Granted
Dec 31, 2024
Kind
B2
Abstract

A gas nozzle according to the present disclosure includes a supply hole having a tubular shape and configured to guide a gas and an injection hole connecting to the supply hole. The gas nozzle configured to inject the gas from the injection hole is made from ceramics or single crystal including an oxide, a fluoride, or an oxyfluoride of a rare earth element or an yttrium aluminum composite oxide as a primary component. An arithmetic mean roughness Ra of an inner circumferential surface forming the supply hole is smaller on an outflow side than on an inflow side of the gas.

Claims (14)

1. A gas nozzle, comprising:

a supply hole having a tubular shape and configured to guide a gas; and

an injection hole connecting to the supply hole,

wherein a central axis of the injection hole extends in a different direction from a central axis of the supply hole,

wherein the gas nozzle configured to inject the gas from the injection hole is made from ceramics or single crystal including an oxide, a fluoride, or an oxyfluoride of a rare earth element or an yttrium aluminum composite oxide as a primary component, and

an arithmetic mean roughness Ra of an inner circumferential surface of the supply hole on an outflow side of the supply hole is smaller than an arithmetic mean roughness Ra of an inner circumferential surface of the supply hole on an inflow side.

2. The gas nozzle according to claim 1 , wherein the arithmetic mean roughness Ra of the inner circumferential surface gradually decreases from the inflow side toward the outflow side of the gas.

3. The gas nozzle according to claim 2 , wherein the gradual decrease of the arithmetic mean roughness Ra from the inflow side toward the outflow side of the gas is exponential or linear.

4. The gas nozzle according to claim 1 , wherein the arithmetic mean roughness Ra on the inflow side of the gas is not greater than 2.5 μm.

5. The gas nozzle according to claim 1 , wherein a skewness Sk of the arithmetic mean roughness Ra of the inner circumferential surface is not less than 0.

6. The gas nozzle according to claim 1 , wherein an annular storage portion configured to temporarily store the gas is provided between the supply hole and the injection hole.

7. A plasma treatment device comprising:

the gas nozzle according to claim 1 .

8. The gas nozzle according to claim 1 , wherein a diameter of the injection hole is smaller than a diameter of the supply hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2021
From: NOGUCHI, YUKIO; SAHASHI, TOMOYA
To: KYOCERA CORPORATION
Reel/Frame 056314/0865 →
Priority Claims (1)
JP 2018-220559 · Nov 26, 2018 · national
Continuity (1)
Related Publication 20220020563A1 · Jan 20, 2022