IP Library › Granted Patent US 11,979,117
Granted Patent B2
US 11,979,117 · App. 17/296,747 · Granted May 7, 2024

High frequency semiconductor amplifier

Inventor: Yoshinobu Sasaki (Tokyo, JP)
Assignee: Mitsubishi Electric Corporation
H03F3/193H01L27/06H03F1/26H03F1/565H03F3/60
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Quick Facts
Patent No.
US 11,979,117
App. No.
17/296,747
Granted
May 7, 2024
Kind
B2
Abstract

A high frequency semiconductor amplifier according to the present disclosure includes: a transistor formed on a semiconductor substrate and including a gate electrode, a source electrode, and a drain electrode; a matching circuit for input-side fundamental wave matching of the transistor; a first inductor formed on the semiconductor substrate and having one end connected to the gate electrode of the transistor and the other end connected to the matching circuit; a capacitor formed on the semiconductor substrate and having one end being short-circuited; and a second inductor formed on the semiconductor substrate and having one end connected to the gate electrode of the transistor and the other end connected to the other end of the capacitor, wherein the second inductor resonates in series with the capacitor at second harmonic frequency, has a mutual inductance of subtractive polarity with the first inductor, and the first inductor and the second inductor form mutual inductive circuits for input-side second harmonic matching.

Claims (15)

1. A high frequency semiconductor amplifier comprising:

a transistor formed on a semiconductor substrate and including a gate electrode, a source electrode, and a drain electrode;

a matching circuit for input-side fundamental wave matching of the transistor;

a first inductor formed on the semiconductor substrate and having one end connected to the gate electrode of the transistor and the other end connected to the matching circuit;

a capacitor formed on the semiconductor substrate and having one end being short-circuited; and

a second inductor formed on the semiconductor substrate and having one end connected to the gate electrode of the transistor and the other end connected to the other end of the capacitor,

wherein the second inductor resonates in series with the capacitor at second harmonic frequency, has a mutual inductance of subtractive polarity with the first inductor, and

the first inductor and the second inductor form a mutual inductive circuit for input-side second harmonic matching.

2. The high frequency semiconductor amplifier according to claim 1 , wherein the mutual inductive circuit for input-side second harmonic matching is symmetrically disposed with respect to a straight line extending in a gate width direction.

3. The high frequency semiconductor amplifier according to claim 1 , wherein the transistor is a GaN-based HEMT.

4. The high frequency semiconductor amplifier according to claim 2 , wherein the transistor is a GaN-based HEMT.

5. The high frequency semiconductor amplifier according to claim 1 , wherein

the matching circuit is configured to match a fundamental wave at an input side of the transistor,

the first inductor is separate from the matching circuit, and

the mutual inductive circuit for input-side second harmonic matching is configured to match a second harmonic at the input side of the transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: SASAKI, YOSHINOBU
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 056343/0988 →
Continuity (1)
Related Publication 20220029591A1 · Jan 27, 2022