Semiconductor device having modified profile metal gate
A semiconductor device has a semiconductor substrate with a dielectric layer disposed thereon. A trench is defined in the dielectric layer. A metal gate structure is disposed in the trench. The metal gate structure includes a first layer and a second layer disposed on the first layer. The first layer extends to a first height in the trench and the second layer extends to a second height in the trench; the second height is less than the first height.
1. A semiconductor device, comprising:
a semiconductor substrate having a top surface; and
a gate structure disposed over the semiconductor substrate, wherein the gate structure includes:
a gate dielectric layer of a substantially U-shaped configuration and extending to a first height above the top surface, wherein the substantially U-shaped configuration has a bottom portion, a first side portion extending up from a first end of the bottom portion and a second side portion extending up from a second end of the bottom portion;
a first metal layer directly on the gate dielectric layer, wherein the first metal layer interfaces a top surface of the bottom portion, a first portion of a sidewall of the first side portion, and a second portion of a sidewall of the second side portion; and
a second metal layer over the first metal layer and extending to a second height above the top surface, wherein the second height is greater than the first height, and wherein the second metal layer interfaces a top surface of the first side portion and a top surface of the second side portion of the gate dielectric layer.
2. The semiconductor device of claim 1 , wherein the first metal layer has a U-shaped configuration.
3. The semiconductor device of claim 1 , wherein the first metal layer extends to a third height above the top surface, the third height less than the first height.
4. The semiconductor device of claim 1 , further comprising: a dielectric layer abutting another sidewall of the first side portion of the gate dielectric layer.
5. The semiconductor device of claim 4 , wherein the dielectric layer abuts a sidewall of the second metal layer.
6. The semiconductor device of claim 5 , wherein the dielectric layer abuts the sidewall of the second metal layer above the another sidewall of the first side portion of the gate dielectric layer.
7. The semiconductor device of claim 4 , wherein the dielectric layer extends to a third height above the top surface, wherein the third height is greater than the first height.
8. The semiconductor device of claim 1 , wherein the second metal layer interfaces a top surface of the first side portion and a top surface of the second side portion of the first metal layer.
9. The semiconductor device of claim 1 , wherein the second metal layer interfaces a second portion of a sidewall of the first side portion, and a second portion of a sidewall of the second side portion of the gate dielectric layer.
10. A semiconductor device comprising:
a gate structure disposed on a semiconductor substrate, the gate structure having:
a gate dielectric layer having a bottom portion and two side portions extending vertically above the bottom portion of the gate dielectric layer;
a first metal layer directly on the gate dielectric layer and having a bottom portion and two side portions extending vertically above the bottom portion of the first metal layer;
a second metal layer directly on the first metal layer and including a bottom portion and two side portions extending vertically above the bottom portion of the second metal layer; and
a third metal layer directly on the second metal layer and interfacing a top surface of the two side portions of the gate dielectric layer.
11. The device of claim 10 , wherein the first metal layer has a U-shaped configuration.
12. The device of claim 10 , wherein the two side portions of the gate dielectric layer extend vertically to a first height above the top surface of the semiconductor substrate and the two side portions of the first metal layer extend to a second height above the top surface of the semiconductor substrate, wherein the second height is less than the first height.
13. The device of claim 12 , wherein the third metal layer extends to a third height above the top surface of the semiconductor substrate, the third height being greater than the first height.
14. The device of claim 10 , further comprising:
another dielectric layer abutting the two side portions of the gate dielectric layer.
15. The device of claim 14 , wherein the third metal layer abuts the another dielectric layer.
16. The device of claim 10 , wherein the third metal layer directly interfaces a top surface of the bottom portion of the second metal layer and top surfaces of each of the two side portions of the second metal layer.
17. A semiconductor device comprising:
a gate structure disposed on a semiconductor substrate, the gate structure having:
a gate dielectric layer having a U-shaped configuration, wherein the gate dielectric layer has an upper most surface at a first height from a top surface of the semiconductor substrate;
a first metal-containing layer directly on the gate dielectric layer, wherein the first metal-containing layer has an uppermost surface at a second height from the top surface of the semiconductor substrate, wherein the second height is less than the first height; and
a second metal-containing layer over the first metal-containing layer; and
a dielectric layer abutting the gate dielectric layer and the second metal-containing layer, wherein the dielectric layer has a different composition than the gate dielectric layer.
18. The device of claim 17 , wherein the dielectric layer is silicon oxide layer (SiO 2 ) or silicon oxynitride (SiON).
19. The device of claim 17 , wherein the dielectric layer extends to a third height greater than the first height.
20. The device of claim 17 , further comprising: a spacer element adjacent the dielectric layer.