Inlet sheet for a book-like electronic identification document

1. An inlay sheet configured to be used in a book-like identification document, the inlay sheet comprising:

a first hinge layer comprising polycarbonate;

a second hinge layer comprising polyurethane, the second hinge layer being attached to the first hinge layer;

all components of an RFID embedded in the second hinge layer;

a first datapage layer; and

a second datapage layer;

wherein the first datapage layer and the second datapage layer are attached to the first hinge layer and the second hinge layer, such that the first and second hinge layers are positioned between the first and second datapage layers forming a datapage section having a datapage thickness (tdp), the first and second datapage layers forming a datapage inner front edge;

wherein the first and second hinge layers extend beyond the datapage inner front edge such that a hinge section is formed having a hinge thickness (th) smaller than the datapage thickness (tdp).

2. The inlay sheet of claim 1 , further comprising a third hinge layer comprising polycarbonate, the second hinge layer being positioned between and attached to the first and third hinge layers.

3. The inlay sheet of claim 2 , further comprising a common front edge for the hinge layers formed by at least one of a polycarbonate strip or a strip formed during lamination of the hinge layers made of polycarbonate by at least one of pressing or squeezing.

4. The inlay sheet of claim 2 , wherein at least one of:

the hinge thickness (th) is at least 30% smaller than the datapage thickness (tdp); or

a hinge layer thickness (thl) of at least one of the first or third hinge layers is at least 80% smaller than a datapage layer thickness (tdp 1 ) of at least one of the first or second datapage layers.

5. The inlay sheet of claim 2 , wherein at least one of:

the datapage thickness (tdp) is smaller than 600 μm;

the hinge thickness (th) is smaller than 300 μm;

respective datapage thicknesses (tdp 1 , tdp 2 ) of the first and second datapage layers are smaller than 300 μm; or

respective hinge layer thicknesses (thl) of the first and third hinge layers are smaller than 100 μm.

6. The inlay sheet of claim 1 , wherein at least a component of the RFID extends at least in part in the datapage section.

7. The inlay sheet of claim 1 , wherein at least one printed or laser engraved pattern is provided in the hinge section.

8. The inlay sheet of claim 1 , wherein the second hinge layer consists essentially of polyurethane.

9. The inlay sheet of claim 8 , wherein at least one printed or laser engraved pattern is provided in the hinge section.

10. The inlay sheet of claim 8 , further comprising a third hinge layer comprising polycarbonate, the second hinge layer being positioned between and attached to the first and third hinge layers.

11. A method for manufacturing an inlay sheet, the method comprising:

providing a first hinge layer comprising polycarbonate;

providing a second hinge layer comprising polyurethane, the second hinge layer having all components of an RFID embedded therein;

providing a first datapage layer forming a part of a datapage section;

providing a second datapage layer forming another part of the datapage section; and

bonding together the first and second hinge layers and the first and second datapage layers such that the first and second hinge layers are positioned between the first and second datapage layers and the first and second hinge layers extend beyond an inner front edge of the datapage section, forming a hinge section having a hinge section thickness (th) smaller than a datapage section thickness (tdp).

12. The method of claim 11 , further comprising:

providing a third hinge layer comprising polycarbonate;

positioning the second hinge layer between the first and third hinge layers; and

bonding the first, second, and third hinge layers to each other.

13. The method of claim 12 , further comprising laminating the hinge layers made of polycarbonate to form a closed front edge for the hinge layers.

14. The method of claim 12 , wherein at least one of:

the hinge section thickness (th) is at least 30% smaller than the datapage section thickness (tdp); or

a hinge layer thickness (thl) of at least one of the first or third hinge layers is at least 80% smaller than a datapage layer thickness (tdp 1 ) of at least one of the first or second datapage layers.

15. The method of claim 12 , wherein at least one of:

the datapage section thickness (tdp) is smaller than 600 μm,

the hinge section thickness (th) is smaller than 300 μm;

respective datapage thicknesses (tdp 1 , tdp 2 ) of the first and second datapage layers are smaller than 300 μm; or

respective hinge layer thicknesses (thl) of the first and third hinge layers are smaller than 100 μm.

16. The method of claim 11 , wherein at least a component of the RFID is embedded such that it extends at least partly in the datapage section.

17. The method of claim 11 , further comprising at least one of printing or laser engraving a pattern in the hinge section.

18. The method of claim 11 , wherein the second hinge layer consists essentially of polyurethane.

19. The method of claim 18 , further comprising:

providing a third hinge layer comprising polycarbonate;

positioning the second hinge layer between the first and third hinge layers; and

bonding the first, second, and third hinge layers to each other.