IP Library › Granted Patent US 11,553,281
Granted Patent B2
US 11,553,281 · App. 17/303,460 · Granted Jan 10, 2023

Electrostatic headphone with integrated amplifier

Inventors: Roger Stephen Grinnip, III (Lake Zurich, IL); Arjun Krishnakumar (Chicago, IL)
Assignee: Shure Acquisition Holdings, Inc.
H04R19/02H04R1/1008H04R1/1066H04R2201/028H04R2420/07
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Quick Facts
Patent No.
US 11,553,281
App. No.
17/303,460
Granted
Jan 10, 2023
Kind
B2
Abstract

An electrostatic headphone is provided, comprising a first ear cup assembly, a second ear cup assembly, and a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly. Each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the transducer, and a high voltage power supply electrically coupled to the high voltage amplifier. At least one of the ear cup assemblies further comprises a power source for providing electric power to the high voltage power supply included in the at least one ear cup assembly. In some cases, one or more of the ear cup assemblies further comprises a wireless communication module for receiving audio signals from an audio source.

Claims (30)

1. An electrostatic headphone, comprising:

a first ear cup assembly;

a second ear cup assembly; and

a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly,

wherein each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the electrostatic transducer, and a high voltage power supply electrically coupled to the high voltage amplifier, at least one of the ear cup assemblies further comprising a power source configured to provide electric power to the high voltage power supply included in the at least one ear cup assembly.

2. The electrostatic headphone of claim 1 , wherein one or more of the ear cup assemblies further comprises a wireless communication module configured to wirelessly receive audio signals from an external audio source.

3. The electrostatic headphone of claim 2 , wherein the one or more ear cup assemblies further comprises a digital signal processor for processing the received audio signals.

4. The electrostatic headphone of claim 2 , further comprising a cable included within the headband assembly for electrically connecting the first and second ear cup assemblies, wherein the wireless communication module is included in the first ear cup assembly, and the cable is configured to transport the audio signals from the first ear cup assembly to the second ear cup assembly.

5. The electrostatic headphone of claim 2 , wherein each ear cup assembly comprises a separate wireless communication module.

6. The electrostatic headphone of claim 5 , wherein the wireless communication module in the first ear cup assembly is configured to receive the audio signals from the external audio source and transmit the audio signals to the wireless communication module in the second ear cup assembly.

7. The electrostatic headphone of claim 5 , wherein the wireless communication module in each ear cup assembly is configured to receive the audio signals from the external audio source.

8. The electrostatic headphone of claim 1 , further comprising a cable included within the headband assembly for electrically connecting the first and second ear cup assemblies, wherein the power source is included in the second ear cup assembly, and the cable is configured to transport the electric power from the power source to the first ear cup assembly.

9. The electrostatic headphone of claim 1 , wherein each ear cup assembly comprises a separate power source for providing the electric power to the high voltage power supply included in the respective ear cup assembly.

10. The electrostatic headphone of claim 1 , wherein at least one of the ear cup assemblies further comprises at least one audio port for receiving analog audio signals from an external audio source.

11. The electrostatic headphone of claim 1 , wherein each ear cup assembly further comprises a low voltage amplifier electrically coupled to the high voltage amplifier, and a low voltage power supply electrically coupled to the low voltage amplifier, the low voltage power supply receiving electric power from the power source.

12. The electrostatic headphone of claim 1 , wherein the high voltage power supply in each ear cup assembly is a switching power supply.

13. The electrostatic headphone of claim 1 , wherein the power source comprises a battery.

14. An electrostatic headphone, comprising:

a first ear cup assembly;

a second ear cup assembly; and

a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly,

wherein each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the electrostatic transducer, and a high voltage power supply electrically coupled to the high voltage amplifier, and

wherein the first ear cup assembly further comprises a power source configured to provide electric power to the high voltage power supply included in the first ear cup assembly, and the second ear cup assembly further comprises a wireless communication module configured to wirelessly receive audio signals from an external audio source.

15. The electrostatic headphone of claim 14 , wherein the second ear cup assembly further comprises a digital signal processor for processing the received audio signals.

16. The electrostatic headphone of claim 14 , further comprising a cable included within the headband assembly for electrically connecting the first and second ear cup assemblies, the cable being configured to transport the audio signals from the second ear cup assembly to the first ear cup assembly.

17. The electrostatic headphone of claim 14 , wherein the first ear cup assembly further comprises a second wireless communication module.

18. The electrostatic headphone of claim 17 , wherein the second wireless communication module is configured to receive the audio signals from the wireless communication module of the second ear cup assembly.

19. The electrostatic headphone of claim 17 , wherein the second wireless communication module is configured to receive the audio signals from the external audio source.

20. The electrostatic headphone of claim 14 , further comprising a cable included within the headband assembly for electrically connecting the first and second ear cup assemblies, the cable being configured to transport the electric power from the first ear cup assembly to the second ear cup assembly.

21. The electrostatic headphone of claim 1 , wherein the second ear cup assembly further comprises a second power source for providing the electric power to the high voltage power supply of the second ear cup assembly.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2021
From: GRINNIP, ROGER STEPHEN, III; KRISHNAKUMAR, ARJUN
To: SHURE ACQUISITION HOLDINGS, INC.
Reel/Frame 056387/0802 →
Continuity (2)
Provisional Application 63032357 · May 29, 2020
Related Publication 20210377672A1 · Dec 2, 2021
Cited By (1)
US 12,689,411