Electronic device and manufacturing method of electronic device
An electronic device comprising: an array substrate having a first electrode and a second electrode; a first connecting member arranged on the first electrode; a first LED chip mounted on the first connecting member; a second connecting member arranged on the second electrode and being thicker than the first connecting member; and a second LED chip mounted on the second connecting member. A distance from a reference surface of the array substrate to a top surface of the second connecting member is larger than a distance from the reference surface to a top surface of the first connecting member.
1. An electronic device comprising:
an array substrate having a first electrode and a second electrode;
a first connecting member arranged on the first electrode;
a first LED chip mounted on the first connecting member;
a second connecting member arranged on the second electrode and being thicker than the first connecting member; and
a second LED chip mounted on the second connecting member,
wherein a distance from a reference surface of the array substrate to a top surface of the second connecting member is larger than a distance from the reference surface to a top surface of the first connecting member, and
the first connecting member and the second connecting member include an organic substance.
2. The electronic device according to claim 1 ,
wherein the first LED chip emits light in different emitting color from the second LED chip.
3. The electronic device according to claim 2 ,
further comprising:
a third connecting member thicker than each of the first connecting member and the second connecting member; and
a third LED chip mounted on the third connecting member, the third LED chip emitting light in different emitting color from each of the first LED chip and the second LED chip,
wherein
the array substrate further has a third electrode, and
the third connecting member is provided on the third electrode.
4. The electronic device according to claim 3 ,
wherein the third connecting member is thicker than the second connecting member 1 micro meter or more.
5. The electronic device according to claim 3 ,
wherein
the array substrate further has an insulating layer, and
each of the first electrode, the second electrode and the third electrode is in contact with the insulating layer.
6. The electronic device according to claim 1 ,
wherein the second connecting member is thicker than the first connecting member 1 micro meter or more.
7. The electronic device according to claim 1 ,
wherein an amount of organic substance included in the first connecting member and the second connecting member is larger than an amount of organic substance included in the first electrode and the second electrode.
8. The electronic device according to claim 1 ,
wherein
the array substrate further has an insulating layer, and
each of the first electrode and the second electrode is in contact with the insulating layer.