Thermally enhanced FCBGA package
A semiconductor device has a heat spreader with an opening formed through the heat spreader. The heat spreader is disposed over a substrate with a semiconductor die disposed on the substrate in the opening. A thermally conductive material, e.g., adhesive or an elastomer plug, is disposed in the opening between the heat spreader and semiconductor die. A conductive layer is formed over the substrate, heat spreader, and thermally conductive material.
1. A method of making a semiconductor device, comprising:
providing a substrate;
providing a heat spreader including an opening formed through the heat spreader;
disposing a semiconductor die over the substrate;
disposing the heat spreader over the substrate with the semiconductor die in the opening; and
disposing a thermally conductive material in the opening between the heat spreader and semiconductor die, wherein the thermally conductive material is a preformed elastomer plug.
2. The method of claim 1 , further including forming a conductive layer over the substrate, heat spreader, and thermally conductive material.
3. The method of claim 1 , further including disposing the thermally conductive material with a surface of the thermally conductive material that is substantially coplanar to a surface of the semiconductor die and a surface of the heat spreader.
4. The method of claim 1 , further including:
disposing a semiconductor package over the substrate; and
disposing the heat spreader over the semiconductor package.
5. A method of making a semiconductor device, comprising:
providing a heat spreader including an opening formed through the heat spreader;
disposing a semiconductor die in the opening;
disposing a preformed elastomer plug around the semiconductor die between the semiconductor die and heat spreader; and
forming a conductive layer over the heat spreader, preformed elastomer plug, and semiconductor die, wherein the conductive layer completely covers the semiconductor die.
6. The method of claim 5 , wherein the preformed elastomer plug includes a thermally conductive material.
7. The method of claim 5 , wherein the conductive layer is sputtered to extend from a surface of the heat spreader to a surface of the semiconductor die.
8. The method of claim 5 , further including disposing the heat spreader over a semiconductor package.
9. The method of claim 5 , further including disposing a thermally conductive adhesive in contact with a side surface of the semiconductor die prior to disposing the semiconductor die in the opening of the heat spreader.
10. A semiconductor device, comprising:
a substrate;
a heat spreader including an opening disposed over the substrate;
a semiconductor die disposed over the substrate in the opening; and
a thermally conductive material disposed in the opening between the heat spreader and semiconductor die, wherein the thermally conductive material is a preformed elastomer plug.
11. The semiconductor device of claim 10 , further including a conductive layer formed over the substrate, heat spreader, and thermally conductive material.
12. The semiconductor device of claim 10 , wherein a surface of the thermally conductive material is substantially coplanar to a surface of the semiconductor die and a surface of the heat spreader.
13. The semiconductor device of claim 10 , further including a semiconductor package disposed between the heat spreader and substrate.
14. A semiconductor device, comprising:
a heat spreader including an opening;
a semiconductor die disposed in the opening;
a preformed elastomer plug disposed around the semiconductor die between the semiconductor die and heat spreader; and
a conductive layer formed over the heat spreader, preformed elastomer plug, and semiconductor die, wherein the conductive layer completely covers the semiconductor die.
15. The semiconductor device of claim 14 , wherein the preformed elastomer plug includes a thermally conductive material.
16. The semiconductor device of claim 14 , further including an electrical component disposed in a cavity of the heat spreader.
17. The semiconductor device of claim 16 , wherein the electrical component is a semiconductor package.