IP Library › Granted Patent US 11,830,967
Granted Patent B2
US 11,830,967 · App. 17/304,938 · Granted Nov 28, 2023

Light emitting module and liquid crystal display device

Inventor: Takeshi Tamura (Tokushima, JP)
Assignee: NICHIA CORPORATION
H01L33/60G02F1/133603G02F1/133611H01L33/46H01L33/50H01L33/54H01L33/58H01L33/62G02F1/133606H01L2933/0091
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Quick Facts
Patent No.
US 11,830,967
App. No.
17/304,938
Granted
Nov 28, 2023
Kind
B2
Abstract

A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

Claims (30)

1. A light emitting module comprising:

a substrate;

at least one light emitting device each comprising:

at least one light emitting element each comprising:

a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and

electrodes on the lower surface of the semiconductor layered structure;

a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, wherein at least one recessed portion is formed in the lower surface of the light-reflecting part;

a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure;

an electrically conductive bonding member bonding the substrate and the electrodes of each of the at least one light emitting device; and

a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.

2. The light emitting module according to claim 1 , wherein the at least one recessed portion is formed in an outer periphery of the lower surface of the light-reflecting part.

3. The light emitting module according to claim 2 , wherein the at least one recessed portion is formed with inclined surfaces each with increasing distance from the substrate toward an outer edge of a corresponding one of the at least one light emitting device.

4. The light emitting module according to claim 3 , wherein the covering resin covers the inclined surfaces and extending on the substrate, with a height of the covering resin decreasing with an increasing distance from the light emitting device.

5. The light emitting module according to claim 2 , wherein an upper edge of each of the inclined surfaces is at a substantially same height with respect to a surface of the substrate at a light emitting device side, in a direction normal to the surface of the substrate at the light emitting device side.

6. The light emitting module according to claim 1 , wherein the at least one recessed portion is formed in the lower surface of the light-reflecting part in a circular shape at an outer side with respect to a forming region of the electrodes.

7. The light emitting module according to claim 1 , wherein each of the at least one light emitting device is mounted in an opening of a light-reflecting electrically insulating resin member disposed on the substrate, and the covering resin covers the opening.

8. The light emitting module according to claim 1 , further comprising a light-adjusting member covering an upper surface side of the light emitting device and being in contact with the light-transmitting part.

9. The light emitting module according to claim 1 , further comprising a fluorescent material layer covering an upper surface of a corresponding one of the at least one light emitting element.

10. The light emitting module according to claim 9 , wherein the light-reflecting part covers an upper surface of the fluorescent material layer.

11. The light emitting module according to claim 1 , wherein the light-reflecting part comprises a resin material containing a light-scattering agent.

12. The light emitting module according to claim 1 , wherein a plurality of the light emitting devices are disposed on the substrate.

13. A liquid crystal display comprising the light emitting module according to claim 1 .

14. The light emitting module according to claim 2 , wherein each of the at least one light emitting device is mounted in an opening of a light-reflecting electrically insulating resin member disposed on the substrate, and the covering resin covers the opening.

15. The light emitting module according to claim 2 , further comprising a light-adjusting member covering an upper surface side of the light emitting device and being in contact with the light-transmitting part.

16. The light emitting module according to claim 2 , further comprising a fluorescent material layer covering an upper surface of a corresponding one of the at least one light emitting element.

17. The light emitting module according to claim 16 , wherein the light-reflecting part covers an upper surface of the fluorescent material layer.

18. The light emitting module according to claim 2 , wherein the light-reflecting part comprises a resin material containing a light-scattering agent.

19. The light emitting module according to claim 2 , wherein a plurality of the light emitting devices are disposed on the substrate.

20. A liquid crystal display comprising the light emitting module according to claim 2 .

21. The light emitting module according to claim 1 , wherein the covering resin is disposed around each of the at least one light emitting device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2021
From: TAMURA, TAKESHI
To: NICHIA CORPORATION
Reel/Frame 056700/0197 →
Priority Claims (1)
JP 2020-113624 · Jun 30, 2020 · national
Continuity (1)
Related Publication 20210408347A1 · Dec 30, 2021
Cited By (1)
US 12,635,317