IP Library Patent Application 17305168
Patent Application
App. No. 17/305,168

FLEXIBLE INTERCONNECT SENSING DEVICES AND RELATED METHODS

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Quick Facts
Patent No.
US None
App. No.
17/305,168
Abstract

Implementations of sensing devices may include a plurality of electromagnetic radiation sensing sections coupled to a flexible interconnect and one or more digital sections coupled to the flexible interconnect. The plurality of electromagnetic radiation sensing sections may be self-aligned through the flexible interconnect.

Claims (31)

1 . A sensing device comprising:

a plurality of electromagnetic radiation (EMR) sensing sections coupled to a flexible interconnect; and

one or more digital sections coupled to the flexible interconnect;

wherein the plurality of EMR sensing sections are self-aligned through the flexible interconnect.

2 . The sensing device of claim 1 , wherein the plurality of EMR sensing sections comprise a plurality of image sensing sections.

3 . The sensing device of claim 2 , wherein the plurality of EMR sensing sections comprise a plurality of pixel arrays coupled an analog circuit.

4 . The sensing device of claim 1 , wherein the one or more digital sections is only one digital section.

5 . An electromagnetic radiation (EMR) sensing device comprising:

a plurality of EMR sensing sections coupled to a flexible interconnect comprising a piecewise linear curve; and

at least one digital section coupled to the flexible interconnect;

wherein each EMR sensing section of the plurality of EMR sensing sections is coupled over a substantially straight portion of the flexible interconnect; and

wherein the flexible interconnect is bent only at portions of the flexible interconnect between the substantially straight portions of the flexible interconnect.

6 . The sensing device of claim 5 , wherein each EMR sensing section is stacked over a corresponding digital section.

7 . The sensing device of claim 5 , wherein the EMR sensing section comprises an analog section and a pixel array.

8 . The sensing device of claim 7 , wherein the pixel array is hybrid bonded to the analog section.

9 . The sensing device of claim 5 , wherein the plurality of EMR sensing sections are self-aligned through the flexible interconnect.

10 . The sensing device of claim 5 , wherein the plurality of EMR sensing sections form a concave surface.

11 . The sensing device of claim 5 , wherein the at least one digital section comprises only one digital section.

12 . A sensing device comprising:

a plurality of electromagnetic radiation (EMR) sensing sections coupled to a flexible interconnect;

one or more digital sections coupled to the flexible interconnect; and

one or more bends in the flexible interconnect between the plurality of EMR sensing sections;

wherein the plurality of EMR sensing sections are self-aligned through the flexible interconnect.

13 . The sensing device of claim 12 , wherein the plurality of EMR sensing sections comprise a plurality of image sensing sections.

14 . The sensing device of claim 13 , wherein the plurality of EMR sensing sections comprise a plurality of pixel arrays coupled an analog circuit.

15 . The sensing device of claim 12 , wherein the one or more digital sections is only one digital section.

16 . The sensing device of claim 12 , wherein each EMR sensing section is stacked over a corresponding digital section.

17 . The sensing device of claim 12 , wherein the EMR sensing section comprises an analog section and a pixel array.

18 . The sensing device of claim 17 , wherein the pixel array is hybrid bonded to the analog section.

19 . The sensing device of claim 12 , wherein the plurality of EMR sensing sections form a concave surface.

20 . The sensing device of claim 12 , wherein the one or more digital sections comprises only one digital section.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 058828, FRAME 0123 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0449 →
SECURITY INTEREST Recorded Nov 5, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058828/0123 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2021
From: RAHIM, IRFAN; SKEETE, OSWALD L.; JATOU, ROSS F.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056731/0746 →