Patent Assignment
Reel/Frame 058828/0123
Security Interest
Recorded: 2021-11-05
Pages: 10
Assignor
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2021-10-28
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties
(49)
Flexible Interconnect Sensing Devices and Related Methods
Application:
17/305,168 →
Publication:
US US20210325252A1
Concealed Gate Terminal Semiconductor Packages and Related Methods
Anti-Flare Semiconductor Packages and Related Methods
Substrate Processing Carrier
Semiconductor Substrate Crack Mitigation Systems and Related Methods
High Electron Mobility Transistor
Image Sensor with Multi-Gain Readout
Semiconductor Device Package with Clip Interconnect and Dual Side Cooling
High Power Module Package Structures
Micromachined Multi-Axis Gyroscopes with Reduced Stress Sensitivity
Internal Power Supply for Amplifiers
Application:
17/444,888 →
Publication:
US US20210376806A1
Semiconductor Substrate Processing Methods
Power Supply Driver with Power Saving Circuitry
Backside Metal Removal Die Singulation Systems and Related Methods
Reverse Recovery Charge Reduction in Semiconductor Devices
Power Mosfet with Improved Safe Operating Area
Imaging Systems with Improved Circuitry to Provide Boosted Control Signals
Leadframe Spacer for Double-Sided Power Module
Semiconductor Device Having a Super Junction Structure and Method of Manufacturing the Same
Methods and Systems Related to Operation of a Switching Power Converter
Battery Management System for Gauging with Low Power
Power Converter with Voltage-Selective Skip Mode Entry Load Compensation
Imaging Devices with Single-Photon Avalanche Diodes Having Sub-Exposures for High Dynamic Range
Interface Circuit, System and Method
Application:
17/448,752 →
Publication:
US US20220158674A1
Silicon Carbide Field-Effect Transistors
Sensor-Less Circuits and Related Methods for Back Emf Zero Crossing Detection
Semiconductor Device and Package
Semiconductor Device Having a Resistor and Structure Therefor
Acoustic Obstacle Detection with Enhanced Resistance to Systematic Interference
Application:
17/479,557 →
Publication:
US US20220187451A1
Dual Side Direct Cooling Power Module Package
Application:
63/203,235 →
Power Module Design
Application:
63/203,433 →
Isolated Temperature Monitoring and Protection
Application:
63/219,876 →
Power Semiconductor Module
Application:
63/260,171 →
Field Stop Optimization for High Power Semiconductors
Application:
63/260,239 →
Unified Low-Noise Amplifier (LNA) and Receive Signal Strength Indicator (RSSI) Circuit for Intermediate-Frequency Communication Systems
Application:
63/260,428 →
Fast Tracking, Low-Power Envelope Detector Based Receive Signal Strength Indicator (RSSI) with Fast Decision Method
Application:
63/260,429 →
Error Correction Overwrite For Audio Communication
Application:
63/260,430 →
Transmission Error Robust Adaptive Quantization Step Adjustment With Rapid and Optimum Response
Application:
63/260,431 →
Crystal Oscillator Based Divider Clock Throttling
Application:
63/260,432 →
Dynamic Antenna Tuning Method and Apparatus
Application:
63/260,458 →
Wide Range Level Shifter with Retention and Set/Reset Functionalities
Application:
63/260,459 →
Self-Clocked Low Power Doubling Charge Pump
Application:
63/260,460 →
Constant Drive Wide Voltage Range IOs
Application:
63/260,461 →
Wide Input Voltage Range Low-Power Charge Pump Based LDO
Application:
63/260,462 →
Very High PSRR Low-Noise Amplifier
Application:
63/260,464 →
Apparatus and Method for Adjusting the DC Offset Voltage in Pierce Crystal Oscillator and the Duty Cycle of the Generated Digital Clock
Application:
63/260,468 →
Molded Image Sensor Package
Application:
63/260,701 →
Wire Free iBGA and ieBGA Package
Application:
63/260,702 →
Multi-Input Downconversion Mixer
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 1, 2021
From: RAHIM, IRFAN; SKEETE, OSWALD L.; JATOU, ROSS F.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056731/0746 →
Assignment of Assignor's Interest
Jul 7, 2021
From: ALMAGRO, ERWIN IAN VAMENTA; QUINONES, MARIA CLEMENS YPIL; MANATAD, ROMEL N.; ESTACIO, MARIA CRISTINA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056771/0803 →
Assignment of Assignor's Interest
Jul 12, 2021
From: HSU, SHOU-CHIAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056824/0308 →
Assignment of Assignor's Interest
Jul 12, 2021
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056825/0536 →
Assignment of Assignor's Interest
Jul 12, 2021
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056824/0988 →
Assignment of Assignor's Interest
Jul 22, 2021
From: INNOCENT, MANUEL H.; BECK, JEFFERY
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056951/0297 →
Assignment of Assignor's Interest
Jul 22, 2021
From: ESTACIO, MARIA CRISTINA; CABAHUG, ELSIE AGDON; MANATAD, ROMEL N.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056950/0626 →
Assignment of Assignor's Interest
Jul 23, 2021
From: LIN, YUSHENG; TEYSSEYRE, JEROME
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 056967/0341 →
Assignment of Assignor's Interest
Aug 9, 2021
From: ACAR, CENK; SIMON, BRENTON; MAITY, SANDIPAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057124/0943 →
Assignment of Assignor's Interest
Aug 11, 2021
From: PETROIANU, ALEXANDRA-OANA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057152/0276 →
Assignment of Assignor's Interest
Aug 12, 2021
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057161/0278 →
Assignment of Assignor's Interest
Aug 20, 2021
From: ZOU, HAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057238/0721 →
Assignment of Assignor's Interest
Aug 23, 2021
From: SEDDON, MICHAEL J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057255/0277 →
Assignment of Assignor's Interest
Aug 27, 2021
From: DENG, SHENGLING; PROBST, DEAN E.; HOSSAIN, ZIA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057313/0107 →
Assignment of Assignor's Interest
Sep 1, 2021
From: VENKATRAMAN, PRASAD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057358/0090 →
Assignment of Assignor's Interest
Sep 2, 2021
From: GURINDAGUNTA, SUNDARAIAH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057373/0092 →
Assignment of Assignor's Interest
Sep 7, 2021
From: CHENG, TZU-HSUAN; LIU, YONG; CHEN, LIANGBIAO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057401/0474 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
Release of Security Interest in Patents Previously Recorded at Reel 058828, Frame 0123
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0449 →
Assignment of Assignor's Interest
May 3, 2024
From: ZAMAN, MOHAMMAD SHAWKAT; TRESCASES, OLIVIER
To: THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO
Reel/Frame 067313/0425 →
Assignment of Assignor's Interest
May 3, 2024
From: DE VLEESCHOUWER, HERBERT; ROIG-GUITART, JAUME; MOENS, PETER
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 067313/0251 →
Assignment of Assignor's Interest
May 3, 2024
From: THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 067310/0715 →