Patent Assignment
Reel/Frame 056950/0626
Assignment of Assignor's Interest
Recorded: 2021-07-22
Pages: 3
Assignors
ESTACIO, MARIA CRISTINA
Executed: 2018-06-25
CABAHUG, ELSIE AGDON
Executed: 2018-06-25
MANATAD, ROMEL N.
Executed: 2018-06-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Device Package with Clip Interconnect and Dual Side Cooling
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 5, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058828/0123 →
Release of Security Interest in Patents Previously Recorded at Reel 058828, Frame 0123
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0449 →