Patent Application
Provisional
App. No. 63/203,433
· Confirmation No. 7657
POWER MODULE DESIGN
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2021-08-02 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2021-07-22 | SPEC |
Specification | 8 | View | |
| 2021-07-22 | CLM |
Claims | 1 | View | |
| 2021-07-22 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2021-07-22 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2021-07-22 | ADS |
Application Data Sheet | 9 | View | |
| 2021-07-22 | SPEC |
Specification | 8 | View | |
| 2021-07-22 | CLM |
Claims | 1 | View | |
| 2021-07-22 | SPEC |
Specification | — | View |
Inventors
Yushuang YAO
Shenzhen, CHINA
Chee Hiong CHEW
Seremban, MALAYSIA
Vemmond Jeng Hung NG
Senawang, MALAYSIA
Chuncao NIU
Wuhan City, CHINA
Sravan VANAPARTHY
Phoenix, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 64296
- Docket No.
- ONS04432L01US
- Confirmation No.
- 7657
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/203,433
- Filed
- 2021-07-22
External Links