Air-stable conductive ink
A low temperature sinterable copper nanoparticle or nanowire, comprising gold, zinc, nickel, tin, or aluminum as an alloying metal, and a capping agent. The nanoparticles or nanowires may be deposited on porous or fibrous substrates, the capping agent desorbed, and sintered at low temperature to form conductive traces or sensing elements. The nanoparticles or nanowires may be deposited by aerosol jet, inkjet or dispenser printers, for example.
1. A sinterable conductive coating composition, comprising:
nanowires decorated with capped nanoparticles, each capped nanoparticle comprising an alloy of at least 1% copper and at least 1% gold, nickel, aluminum, zinc or tin, capped with a capping agent comprising at least one of an amine, a thiolate and an acrylate
the decorated nanowires being configured to sinter in a buffer solution on a substrate that desorbs the capping agent at a temperature below 100° C.
2. The sinterable conductive coating composition according to claim 1 , wherein the capped nanoparticles have a diameter between 2 to 20 nm, and comprise an alloy of at least 50% copper and at least 1% gold, nickel, aluminum, zinc, or tin.
3. The sinterable conductive coating composition according to claim 1 , wherein the capped nanoparticles comprise copper-gold alloy nanoparticles comprising at least 50% copper, having a bimodal distribution of diameter having a first peak between 1-2 nanometers and a second peak between 5-10 nanometers.
4. The sinterable conductive coating composition according to claim 1 , wherein the decorated nanowires are sinterable at a temperature below 30° C.
5. The sinterable conductive coating composition according to claim 1 , wherein the nanowires comprise at least one of copper and a copper-nickel alloy, and the nanoparticles comprise a copper-gold alloy.
6. The sinterable conductive coating composition according to claim 1 , wherein the decorated nanowires are suspended in the buffer solution which preserves the capping agent on the capped nanoparticles.
7. The sinterable conductive coating composition according to claim 1 , wherein the decorated nanowires sinter by surface-mediated Ostwald ripening.
8. A sinterable composition, comprising:
a plurality of nanowires;
a plurality of nanoparticles having a diameter between 2 to 20 nm, comprising an alloy of at least 1% copper and at least 1% of gold, zinc, nickel, aluminum, or tin, the nanoparticles being capped with a capping agent, wherein the plurality of nanoparticles decorate the plurality of nanowires, and
a buffer solution in which the decorated nanowires are suspended and free to move,
wherein the sinterable composition is adapted to initiate sintering to form a conductive layer of sintered overlapping nanowires by desorption of the capping agent from the plurality of nanoparticles by contact with a substrate in the buffer solution at a sintering temperature below 100° C.
9. The sinterable composition according to claim 8 , wherein the plurality of nanowires comprise at least 50% copper.
10. The sinterable composition according to claim 9 , wherein the plurality of nanowires comprise between 1-10% nickel.
11. The sinterable composition according to claim 9 , wherein the plurality of nanoparticles comprise a copper-gold alloy.
12. The sinterable composition according to claim 8 , wherein the decoration of the nanowires by the nanoparticles is in dendritic pattern.
13. The sinterable composition according to claim 8 , wherein the capping agent comprises at least one of an amine, a thiolate and an acrylate.
14. A sinterable conductive coating composition, comprising:
a plurality of nanowires;
a plurality of nanoparticles adherent to the plurality of nanowires, the plurality of nanoparticles comprising at least 1% metallic copper and at least 1% of metallic gold, zinc, nickel, aluminum, or tin, capped with a capping agent; and
a buffer solution;
the plurality of nanoparticles being configured to form a sintered coating bridging the nanowires in an overlapping array to form a conductive path between respective overlapping nanowires on a substrate which desorbs the capping agent in the buffer solution to initiate sintering,
wherein the capping agent is configured to:
maintain the plurality of nanowires in a freely suspended state in the buffer solution before deposition on the substrate, and
permit sintering of the plurality of nanoparticles at a temperature of less than 100° C. after deposition of the plurality of nanowires in the freely suspended state in the buffer solution on the substrate, and desorption of the capping agent from the nanoparticles to initiate sintering, to form the overlapping array.
15. The sinterable conductive coating composition according to claim 14 , wherein the plurality of nanoparticles are configured to form the sintered coating with the plurality of nanowires through surface-mediated Ostwald ripening after the desorption of the capping agent.
16. The sinterable conductive coating composition according to claim 14 , wherein:
the plurality of nanowires comprise at least 50% copper and have a diameter between 2 to 20 nm; and
the plurality of nanoparticles comprise at least 50% copper.
17. The sinterable conductive coating composition according to claim 14 , wherein the sintered coating has a conductivity which reversibly varies by at least 2% in dependence on an external condition.
18. The sinterable conductive coating composition according to claim 14 , wherein the capping agent comprises at least one of an amine, a thiolate and an acrylate.
19. The sinterable conductive coating composition according to claim 14 , wherein the nanowires comprise at least one of copper and a copper-nickel alloy, and the nanoparticles comprise a copper-gold alloy.
20. The sinterable conductive coating composition according to claim 14 , wherein the plurality of nanoparticles comprise at least 50% copper and the plurality of nanowires comprise at least 50% copper and between 1-10% nickel.