Robotic bone preparation for increasing implant contact surface area
A bone implant includes at least one bone-engaging surface designed to mate with an implant-engaging surface of a bone. In the preferred embodiment, the bone-engaging surface of the implant includes a wave pattern comprising at least one peak extending in a proximal direction or at least one valley extending in a distal direction. The implant-engaging surface of the bone also includes a matching wave pattern having at least one peak and valley. Upon mating the engaging surfaces, a bone-implant interface may be created wherein the peaks and valleys of the wave patterns are aligned. As a result, there is good surface contact area at the bone-implant interface which helps prevent loosening or rotating of the implant.
1. A method of maximizing surface contact between an implant and an outer surface of a bone comprising:
using a cutting tool to produce a wave pattern on the outer surface of the bone, the wave pattern having alternating curved peaks and curved valleys, each valley connecting adjacent peaks, each peak extending in a proximal direction and each valley extending in a distal direction; and
positioning the implant such that a distal surface of the implant engages the outer surface of the bone.
2. The method of claim 1 , wherein the positioning step includes disposing an adhesive on either the outer surface of the bone, the distal surface of the implant, or both.
3. The method of claim 1 , further comprising producing a wave pattern on the distal surface of the implant.
4. The method of claim 3 , wherein the wave pattern on the distal surface of the implant matches the wave pattern on the outer surface of the bone, and wherein the positioning step includes aligning the respective wave patterns.
5. The method of claim 3 , further comprising producing a wave pattern on a proximal surface of the implant.
6. The method of claim 3 , further comprising inserting a stem portion extending in the distal direction from the distal surface of the implant into a medullary canal of the bone, the stem having a smaller diameter than a diameter of the distal surface of the implant.
7. The method of claim 6 , wherein the wave pattern spans only a circumferential perimeter of the distal surface of the implant.
8. The method of claim 1 , further comprising engaging a head portion of a proximal surface of the implant with another modular implant component.
9. The method of claim 1 , wherein the distal surface of the implant is porous such that the positioning step allows for bone in-growth.
10. The method of claim 1 , further comprising planning the configuration of the wave pattern before the step of using the cutting tool.
11. A method of maximizing surface contact between an implant and an outer surface of a bone comprising:
producing a wave pattern on a distal surface of the implant, wherein the wave pattern includes alternating curved peaks and curved valleys, each valley connecting adjacent peaks, each peak extending in a proximal direction and each valley extending in a distal direction; and
positioning the implant such that the distal surface of the implant engages the outer surface of the bone.
12. The method of claim 11 , further comprising determining relative densities of areas of the bone, wherein the wave pattern on the distal surface of the implant is preoperatively planned such that peaks align with relatively high density bone areas and valleys align with relatively low density bone areas.
13. The method of claim 11 , wherein the positioning step includes disposing an adhesive on either the outer surface of the bone, the distal surface of the implant, or both.
14. The method of claim 11 , further comprising producing a wave pattern on the outer surface of the bone, wherein the wave pattern on the distal surface of the implant matches the wave pattern on the outer surface of the bone, and wherein the positioning step includes aligning the respective wave patterns.
15. The method of claim 14 , further comprising producing a wave pattern on a proximal surface of the implant.
16. The method of claim 11 , further comprising inserting a stem portion extending in the distal direction from the distal surface of the implant into a medullary canal of the bone, the stem having a smaller diameter than a diameter of the distal surface of the implant.
17. The method of claim 16 , wherein the wave pattern spans only a circumferential perimeter of the distal surface of the implant.
18. The method of claim 11 , further comprising engaging a head portion of a proximal surface of the implant with another modular implant component.
19. The method of claim 11 , wherein the distal surface is porous such that the positioning step allows for bone in-growth.
20. A method of maximizing surface contact between an implant and an outer surface of a bone comprising:
planning a configuration of a wave pattern on a distal surface of the implant and a configuration of a wave pattern on the outer surface of the bone, wherein each wave pattern includes alternating curved peaks and curved valleys, each valley connecting adjacent peaks;
producing the wave pattern on the distal surface of the implant after the planning step;
using a robotic cutting tool to produce the wave pattern on the outer surface of the bone after the planning step; and
positioning the implant such that the distal surface of the implant engages the outer surface of the bone and the respective wave patterns align.