IP Library › Granted Patent US 11,908,887
Granted Patent B2
US 11,908,887 · App. 17/307,592 · Granted Feb 20, 2024

Capacitor and semiconductor device including the same

Inventors: Jaeho Lee (Seoul, KR); Boeun Park (Hwaseong-si, KR); Younggeun Park (Suwon-si, KR); Jooho Lee (Hwaseong-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01L28/56H01L28/75H10B53/00
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Quick Facts
Patent No.
US 11,908,887
App. No.
17/307,592
Granted
Feb 20, 2024
Kind
B2
Abstract

Provided are a capacitor and a semiconductor device including the capacitor. The capacitor includes a first electrode; a plurality of dielectric films on the first electrode in a sequential series, the plurality of dielectric layers having different conductances from each other; and a second electrode on the plurality of dielectric films, wherein the capacitor has a capacitance which converges to a capacitance of one of the plurality of dielectric films.

Claims (31)

1. A capacitor comprising:

a first electrode;

a plurality of dielectric films on the first electrode in a sequential series, the plurality of dielectric films having different conductances from each other; and

a second electrode on the plurality of dielectric films,

wherein the plurality of dielectric films are configured such that

the capacitor has a first capacitance,

a capacitance across a dielectric film having the smallest conductance, among the plurality of dielectric films, is a second capacitance,

the smallest conductance is less than or equal to a tenth ( 1/10) a conductance of each of a remainder of the plurality of dielectric films, and

a difference in capacitance between the first capacitance and the second capacitance is less than a difference in capacitance between the first capacitance and a capacitance of each of the remainder of the plurality of dielectric films.

2. The capacitor of claim 1 , wherein a dielectric constant of the dielectric film having the smallest conductance is greater than a dielectric constant of at least one of the remainder of the plurality of dielectric films.

3. The capacitor of claim 1 , wherein a dielectric constant of the dielectric film having the smallest conductance among the plurality of dielectric films is 30 or more.

4. The capacitor of claim 1 , wherein the dielectric film having the smallest conductance includes at least one of a perovskite structure, a ferroelectric material, a paraelectric material, or an antiferroelectric material.

5. The capacitor of claim 1 , wherein the capacitance of the capacitor is 10% or greater than the second capacitance across the dielectric film having the smallest conductance among the plurality of dielectric films.

6. The capacitor of claim 1 , wherein a thickness of the dielectric film having the smallest conductance has a greater effect on the capacitance of the capacitor than a thickness of a dielectric film having the largest conductance among the plurality of dielectric films.

7. The capacitor of claim 1 , wherein a thickness of the dielectric film having the smallest conductance is 4 nm or less.

8. The capacitor of claim 1 , wherein a thickness of a dielectric film having the largest conductance among the plurality of dielectric films is 2 nm or less.

9. The capacitor of claim 1 , wherein a thickness of the capacitor is 5 nm or less.

10. The capacitor of claim 1 , wherein a difference in conductance between a dielectric film having a largest conductance and the dielectric film having the smallest conductance is 100 times or more.

11. The capacitor of claim 1 , further comprising:

a first insertion film,

wherein the plurality of dielectric films include a first, second, and third dielectric film, and

the first insertion film is between the second and the third dielectric film.

12. The capacitor of claim 11 , wherein the second and the third dielectric films directly contact the first insertion film.

13. The capacitor of claim 11 , wherein a thickness of the first insertion film is less than twice a thickness of an atomic layer included in the first insertion film.

14. The capacitor of claim 11 , wherein the second and the third dielectric films comprise the same material.

15. The capacitor of claim 11 , wherein the first and the second dielectric films are in direct contact and include different materials from each other.

16. The capacitor of claim 11 , further comprising:

a second insertion film between the first and the second dielectric films.

17. A semiconductor device comprising:

a transistor; and

the capacitor according to claim 1 electrically connected to the transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2021
From: LEE, JAEHO; PARK, BOEUN; PARK, YOUNGGEUN; LEE, JOOHO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 056159/0540 →
Priority Claims (1)
KR 10-2020-0142528 · Oct 29, 2020 · national
Continuity (1)
Related Publication 20220140066A1 · May 5, 2022