Semiconductor device packaging leadframe assembly and method therefor

1. A method comprising:

forming a package leadframe assembly comprising:

providing a leadframe including a plurality of leads, the plurality of leads having a first major side and a second major side;

applying an adhesive on a portion of the first major side of the plurality of leads;

providing a die pad having a first major surface, a second major surface, and a length, wherein the first major surface is substantially flat across the length of the die pad;

placing the first major surface of the die pad onto the adhesive, a portion of the die pad overlapping the portion of the first major side of the plurality of leads;

attaching a semiconductor die to the first major surface of the die pad; and

encapsulating with a molding compound the semiconductor die and a portion of the package leadframe assembly;

wherein each lead of the plurality of leads includes a first portion at a first end of the lead proximate to an outer perimeter of the leadframe and a second portion extending from the first portion to a second end of the lead, the first portion having a first thickness and the second portion having a second thickness less than the first thickness,

wherein the second portion of each lead of the plurality of leads is etched on the first major side to form the second thickness.

2. The method of claim 1 , wherein applying the adhesive on the portion of the first major side of the plurality of leads is applying the adhesive on the second portion of the first major side of the plurality of leads.

3. The method of claim 1 , wherein after placing the first major surface of the die pad onto the adhesive, the second major surface of the die pad is substantially coplanar with the first portion of each lead at the first major side of the plurality of leads.

4. The method of claim 1 , further comprising connecting a bond pad on the semiconductor die with a lead of the plurality of leads by way of a bond wire.

5. The method of claim 1 , further comprising after encapsulating with the molding compound, plating exposed surfaces of the plurality of leads and the die pad with a tin material.

6. The method of claim 1 , wherein the plurality of leads and the die pad are formed from a copper or copper alloy material.

7. The method of claim 1 , wherein the package leadframe assembly is configured for a quad flat no-lead (QFN) type package.

8. A semiconductor device comprising:

a leadframe including a plurality of leads having a top side and a bottom side, an inner portion of each lead of the plurality of leads half etched at the bottom side;

an adhesive applied on the inner portion of the plurality of leads at the bottom side;

a die pad having a top surface, a bottom surface, and a length, the top surface of the die pad being substantially flat across the length of the die pad and attached to the plurality of leads by way of the adhesive;

a semiconductor die attached to the top surface of the die pad; and

a molding compound encapsulating the semiconductor die, a portion of the plurality of leads, and a portion of the die pad.

9. The semiconductor device of claim 8 , wherein each lead of the plurality of leads further includes an outer portion adjacent to the inner portion and proximate to an outer perimeter of the leadframe, the outer portion having first thickness and the inner portion having a second thickness less than the first thickness.

10. The semiconductor device of claim 9 , wherein the bottom surface of the die pad is substantially coplanar with the outer portion of each lead at the bottom side of the plurality of leads.

11. The semiconductor device of claim 9 , wherein the bottom surface of the die pad and the outer portion of each lead at the bottom side of the plurality of leads are exposed through the molding compound.

12. The semiconductor device of claim 11 , wherein the exposed surfaces of the die pad and outer portion of each lead at the bottom side of the plurality of leads are plated with a tin material.

13. The semiconductor device of claim 8 , further comprising a bond wire configured to conductively connect a bond pad on the semiconductor die with a lead of the plurality of leads.

14. The semiconductor device of claim 8 , wherein the plurality of leads and the die pad are formed from a copper or copper alloy material.

15. A semiconductor device comprising:

a leadframe including a plurality of leads having a top side and a bottom side, each lead of the plurality of leads including an outer portion and an inner portion, the outer portion proximate to an outer perimeter of the leadframe, the inner portion half etched at the bottom side;

an adhesive applied on the inner portion of the plurality of leads at the bottom side;

a die pad having a top surface, a bottom surface, and a length, the top surface of the die pad being substantially flat across the length of the die pad and attached to the plurality of leads by way of the adhesive;

a semiconductor die attached to the top surface of the die pad by way of a die attach material; and

a molding compound encapsulating the semiconductor die, a portion of the plurality of leads, and a portion of the die pad.

16. The semiconductor device of claim 15 , wherein the outer portion has a first thickness and the inner portion has a second thickness, the second thickness being less than the first thickness.

17. The semiconductor device of claim 15 , wherein the outer portion has a first length and the inner portion has a second length, the first length being less than the second length.

18. The semiconductor device of claim 15 , wherein the bottom surface of the die pad and the outer portion of each lead at the bottom side of the plurality of leads are substantially coplanar and exposed through the molding compound.