Thermal conductive silicone composition and semiconductor device
Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains: (A) an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm 2 /s at 25° C., and is represented by the following average composition formula (1) R 1 a SiO (4-a)/2 (1) wherein R 1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8≤a≤2.2; (B) a silver powder having a tap density of not lower than 3.0 g/cm 3 , a specific surface area of not larger than 2.0 m 2 /g and an aspect ratio of 1 to 30; (C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C. and being present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and (D) a catalyst.
1. A thermal conductive silicone composition comprising:
(A) 100 parts by mass of an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm 2 /s at 25° C., and is represented by the following average composition formula (1)
R 1 a SiO (4-a)/2 (1)
wherein R 1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8≤a≤2.2;
(B) a silver powder having a tap density of not lower than 3.0 g/cm 3 , a specific surface area of not larger than 2.0 m 2 /g and an aspect ratio of 8 to 30, the component (B) being in an amount of 300 to 11,000 parts by mass per 100 parts by mass of the component (A);
(C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C., the component (C) being in an amount of 1 to 1,200 parts by mass per 100 parts by mass of the component (A) and present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.09; and
(D) a catalyst selected from the group consisting of a platinum-based catalyst, an organic peroxide and a catalyst for condensation reaction, the component (D) being in a catalytic amount.
2. The thermal conductive silicone composition according to claim 1 , wherein part of or the whole component (A) is:
an organopolysiloxane containing in one molecule at least two silicon atom-bonded alkenyl groups; and/or
an organohydrogenpolysiloxane containing in one molecule at least two silicon atom-bonded hydrogen atoms.
3. The thermal conductive silicone composition according to claim 1 , further comprising:
(G) an organosilane that is in an amount of 0 to 20 parts by mass per 100 parts by mass of the component (A), and is represented by the following general formula (2)
R 2 b Si(OR 3 ) 4-b (2)
wherein R 2 represents a saturated or unsaturated monovalent hydrocarbon group that may have a substituent group(s), an epoxy group, an acryl group or a methacryl group; R 3 represents a monovalent hydrocarbon group; b satisfies 1≤b≤3.
4. A semiconductor device comprising a heat-generating electronic part and a heat dissipator wherein the thermal conductive silicone composition according to claim 1 is interposed between the heat-generating electronic part and the heat dissipator.
5. A method for manufacturing a semiconductor device, comprising a step of heating the thermal conductive silicone composition according to claim 1 to 80° C. or higher with the thermal conductive silicone composition being sandwiched between a heat-generating electronic part and a heat dissipator, and with a pressure of 0.01 MPa or higher being applied thereto.