Implantable medical device with two or more encapsulated components
Implants must protect against implant contamination and corrosion of electronics. However, when electrical components are fitted to flexible substrates, failure can occur at electrical connections. An implant comprises: a flexible substrate; a first and second electrical component at a first and second position, electrically connected through an interconnect layer; a first and second component cover, separately encapsulating the first and second component to resist the ingress of body fluids into the component positions; wherein the flexible substrate allows a relative change in disposition between the first component cover and the second component cover. One or more electrodes are provided at a third position. By encapsulating each component separately, the position of force/tension is moved away from the component attachment position to a point somewhere between the component positions. By disposing one or more electrode away from the components, the ingress is further restricted.
1. An implantable medical device, comprising:
a flexible substrate having one or more electrical interconnect layers interposed between a first flexible substrate layer and a second flexible substrate layer;
a first electrical component disposed at a first component position;
a second electrical component disposed at a second component position, the first and second component positions being disposed and separated along a longitudinal axis;
the first electrical component being electrically connected with the second electrical component through the one or more electrical interconnect layers;
a first component cover, configured and arranged to encapsulate the first component and to resist the ingress of fluids from a human or animal body into the first component position;
a second component cover, configured and arranged to separately encapsulate the second component and to resist the ingress of fluids from a human or animal body into the second component position;
wherein the flexible substrate is further configured and arranged to allow a relative change in disposition between the first component cover and the second component cover;
the device further comprising:
a stimulation electrode, configured to transmit energy to human or animal tissue, disposed at a third component position further along the longitudinal axis from the first and/or second component positions;
the stimulation electrode being electrically connected with the first and/or second electrical component through the one or more electrical interconnect layers.
2. The device according to claim 1 , wherein the change in disposition comprises:
a change in separation along the longitudinal axis between the first component cover and the second component cover; and/or
a change in rotation about a transverse axis disposed between the first component cover and the second component cover, the transverse axis being substantially perpendicular to the longitudinal axis; and/or
a change in rotation about the longitudinal axis.
3. The device of according to claim 1 , wherein the device comprises a Liquid Crystal Polymer LCP and/or a Polyimide in:
the first flexible substrate layer; and/or
the second flexible substrate layer; and/or
the first component cover; and/or
the second component cover.
4. The device according to claim 1 , wherein
the first electrical component is an analog component and
the second electrical component is a digital component.
5. The device according to claim 1 , wherein
the first electrical component is a discrete electrical component and
the second electrical component is an integrated circuit.
6. The device according to claim 1 , wherein the first component position and/or second component position further comprises a fluid detector, the fluid detector encapsulated by the first component cover or the second component cover, respectively.
7. The device according to claim 6 , wherein the fluid detector comprises two or more electrical conductors, disposed around at least a part of the perimeter of the encapsulated component at the respective component position.
8. The device according to claim 7 , wherein the two or more electrical conductors are disposed around substantially the whole of the perimeter of the encapsulated component at the respective component position.
9. The device according to claim 6 , wherein a first fluid detector at the first component position is electrically connected to a second fluid detector at the second component position through an interconnection.
10. The device according to claim 6 , wherein the fluid detector is comprised in the first component position and provides information to the second component position through an interconnection.
11. The device according to claim 1 , wherein the first electrical component and/or second electrical component have a cross-sectional shape in a plane approximately parallel to a plane comprising the first substrate layer, the shape being circular, oval, elliptical, square, rectangular, or trapezoidal.
12. The device according to claim 1 , wherein the first component cover and/or second component cover have a cross-sectional shape in a plane approximately parallel to a plane comprising the first substrate layer, the shape being circular, oval, elliptical, square, rectangular, or trapezoidal.
13. The device according to claim 1 , wherein the first electrical component and/or second electrical component have substantially larger dimensions along a transverse axis than along the longitudinal axis.
14. The device according to claim 1 , wherein the first component cover and/or second component cover have substantially larger dimensions along a transverse axis than along the longitudinal axis.
15. The device according to claim 1 , wherein the first component position and/or second component position comprises a plurality of electrical components, electrically connected to each other with the one or more electrical interconnect layers, and encapsulated by the first component cover or the second component cover, respectively.
16. The device according to claim 1 , wherein the one or more electrical components are selected from the group consisting of: an active component, a passive component, an electronic component, an integrated circuit IC, an application-specific integrated circuit ASIC, a field-programmable gate array FPGA, an analog component, a digital component, a surface-mount device SMD, a through-hole package, a chip carrier, a pin grid array, a fat package, a small outline package, a chip scale package, a ball grid array, a small-pin-count package, a flexible silicon device, a thin-film transistor TFT, and combinations thereof.
17. The device according to claim 1 , wherein the first electrical component is selected from the group consisting of: an active component, a passive component, an electronic component, an analog component, a digital component, a surface-mount device SMD, a flexible silicon device, a thin-film transistor TFT, and combinations thereof.
18. The device according to claim 1 , wherein the second electrical component is selected from the group consisting of: an active component, an electronic component, an integrated circuit IC, an application-specific integrated circuit ASIC, a field-programmable gate array FPGA, an analog component, a digital component, a surface-mount device SMD, a through-hole package, a chip carrier, a pin grid array, a flat package, a small outline package, a chip scale package, a ball grid array, a small-pin-count package, and combinations thereof.
19. The device according to claim 1 , wherein the one or more electrical components comprises a component configured and arranged to perform a function selected from the group consisting of: resist, store charge, induct, sense, stimulate, amplify, process data, detect, compare, switch, time, store data, count, oscillate, perform logic, add, generate stimulation pulses, and combinations thereof.
20. The device according to claim 1 , wherein the first component cover fully encapsulates the first component and the second component cover fully encapsulates the second component.
21. The device according to claim 1 , wherein the first component cover is larger than the first component such that a distance of at least 300 microns exists between one or more sides of the first component and the first component cover, and/or the second component cover is larger than the second component such that a distance of at least 300 microns exists between one or more sides of the second component and the second component cover.
22. The device according to claim 1 , wherein the first and second electrical components are each configured to control electron flow.
23. The device according to claim 1 , wherein the first and second component covers do not touch or overlap.