IP Library Granted Patent US 11,499,693
Granted Patent B2
US 11,499,693 · App. 17/314,433 · Granted Nov 15, 2022

Stainless steel LED power switch

Inventors: Keith Rollinson (Margate, FL); John Paul Santana (Boca Raton, FL)
F21S41/645F21V23/006F21V23/04F21V31/005H05B45/30F21W2107/20F21Y2115/10H05B45/395
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Quick Facts
Patent No.
US 11,499,693
App. No.
17/314,433
Granted
Nov 15, 2022
Kind
B2
Abstract

An encapsulated LED switch that incorporates a MOSFET power drivers, high current transistors, or other suitable power drivers in a PCB that attaches to the LED switch such that a low power LED switch controls the output of a high-power driver. The selected power driver PCB can be adapted to different load requirements by making simple changes. The PCB's can be interchanged to provide for a predetermined output power required for a particular application. In addition, the wire gauge size of the wires attached to the MOSFET power driver PCB can also be varied to match intended load requirements. For applications in which the LED switch is used in hostile environments, such as marine applications, the LED switch and its associated power driver PCB are encapsulated to protect the circuitry from environmental factors such as high humidity, salt water, etc.

Claims (37)

1. A high-power switch assembly comprising:

an LED switch having an on and an off position,

a PCB driver electrically connected to said LED switch and having at least one output line,

said PCB driver comprising a switch debouncer electrically connected to said LED switch,

said PCB driver comprising a Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET, driver electrically connected to said switch debouncer, and

said PCB driver outputting an amperage sufficient to power a marine pump on said output line when said LED switch is in the on position.

2. The high-power switch assembly of claim 1 , wherein said PCB driver further comprises a MOSFET, said MOSFET comprising a gate electrically connected to said MOSFET driver, and a source operatively connected to said output of said PCB driver.

3. The high-power switch assembly of claim 1 , wherein said LED switch is a momentary switch.

4. The high-power switch assembly of claim 3 wherein said LED switch comprises a reset table thermal breaker.

5. The high-power switch assembly of claim 1 , wherein said LED switch is an on/off switch.

6. The high-power switch assembly of claim 5 , wherein said LED switch comprises a resettable thermal breaker.

7. The high-power switch assembly of claim 1 , further comprising an encapsulation sleeve, and said LED switch and PCB driver are disposed within said encapsulation sleeve.

8. The high-power switch assembly of claim 7 , wherein said encapsulation sleeve comprises epoxy.

9. The high-power switch assembly of claim 7 , wherein said encapsulation sleeve is sealed to isolate said PCB driver and LED switch from the environment.

10. The high-power switch assembly of claim 1 , wherein said PCB driver comprises a MOSFET.

11. A high-power switch assembly comprising:

an encapsulation sleeve,

a PCB driver with at least one output line, said PCB driver being disposed within said encapsulation sleeve,

an LED switch operatively connected to said PCB driver and having an on and an off position,

said PCB driver comprising a switch debouncer electrically connected to said LED switch,

said PCB driver comprising a Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET, driver electrically connected to said switch debouncer, and

said PCB driver outputting an amperage sufficient to power a marine pump on said output line.

12. The high-power switch assembly of claim 11 , wherein said PCB driver further comprises a MOSFET, said MOSFET comprising a gate electrically connected to said MOSFET driver, and a source operatively connected to said output line.

13. The high-power switch assembly of claim 11 , wherein said LED switch is a momentary switch.

14. The high-power switch assembly of claim 13 wherein said LED switch comprises a resettable thermal breaker.

15. The high-power switch assembly of claim 11 , wherein said LED switch is an on/off switch.

16. The high-power switch assembly of claim 15 , wherein said LED switch comprises a reset table thermal breaker.

17. A high-power switch assembly comprising:

an encapsulation sleeve comprising an epoxy material of construction,

a PCB driver disposed within said encapsulation and comprising at least one output line,

an LED switch having an on and an off position, said LED switch being electrically connected to said PCB driver,

said PCB driver comprising a switch debouncer electrically connected to said LED switch,

said PCB driver comprising a Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET, driver electrically connected to said switch debouncer,

said PCB driver comprising a MOSFET, said MOSFET comprising a gate electrically connected to said MOSFET driver, and a source operatively connected to said output line of said PCB driver, and

said PCB driver outputting an amperage sufficient to power a marine pump on said output line when said LED switch is in the on position.

18. The high-power switch assembly of claim 17 , wherein said LED switch comprises a resettable thermal breaker.

19. The high-power switch assembly of claim 17 , wherein said encapsulation sleeve is sealed from the environment.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2023
From: ROLLINSON, KEITH
To: BOCATECH, INC.
Reel/Frame 063630/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2023
From: SANTANA, JOHN PAUL
To: BOCATECH, INC.
Reel/Frame 063630/0718 →
Continuity (4)
Continuation 17026677 · Sep 21, 2020
Division 15013999 · Feb 2, 2016
Provisional Application 62111083 · Feb 2, 2015
Related Publication 20210262633A1 · Aug 26, 2021