Optical gyroscopes and methods of manufacturing of optical gyroscopes
The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing of the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises depositing a first cladding layer on an upper surface of a silicon substrate; depositing a core layer; depositing a resist mask pattern to define a form of a ring resonator core and a form of a waveguide core; etching the core layer outside of the resist mask pattern; and stripping the resist mask pattern off.
1. A chip for an optical gyroscope, the chip comprising:
a substrate having an upper surface;
a waveguide on the upper surface of the substrate, the waveguide comprising:
a first waveguide cladding layer immovably attached to the substrate; and
a waveguide core immovably attached to the first waveguide cladding layer; and
a ring resonator on the upper surface of the substrate and spaced from the waveguide, the ring resonator comprising:
a first ring cladding layer immovably attached to the substrate; and
a ring resonator core disposed on and immovably attached to the first ring cladding layer and having a side wall, the side wall of the ring resonator core forming an obtuse angle with the upper surface of the substrate, the ring resonator core having a trapezoidal cross-sectional form.
2. The chip of claim 1 , wherein the waveguide core is located in the same plane as the ring resonator core.
3. The chip of claim 1 , wherein the waveguide further comprises a second waveguide cladding layer on the waveguide core, and the ring resonator further comprises a second resonator cladding layer on the ring resonator core, the waveguide core being located between the first waveguide cladding layer and the second waveguide cladding layer; and the ring resonator core being located between the first resonator cladding layer and the second resonator cladding layer.
4. The chip of claim 3 , wherein a width of the waveguide core is larger than a width of the second waveguide cladding layer.
5. The chip of claim 3 , wherein a width of the waveguide increases going from the second waveguide cladding layer to the waveguide core, and to the first waveguide cladding layer.
6. The chip of claim 3 , wherein the second waveguide cladding layer and the second ring cladding layer are made of silicon dioxide.
7. The chip of claim 3 , wherein a width of the ring resonator increases going from the second ring cladding layer to the waveguide core, and to the first ring cladding layer.
8. The chip of claim 1 , wherein:
the waveguide further comprises a second waveguide cladding layer that is immovably attached to and covers the first waveguide cladding layer and the waveguide core;
the ring resonator core is located in a ring plane;
the first ring cladding layer is immovably attached to the second waveguide cladding layer,
and the waveguide core is located in a waveguide plane that is parallel to the ring plane such that the light transfers its energy from the waveguide plane to the ring plane.
9. The chip of claim 8 , wherein the first ring cladding layer has a width that is less than a width of the ring resonator core.
10. The chip of claim 1 , wherein a side wall of the waveguide core forms an obtuse angle with the upper surface of the substrate.
11. The chip of claim 10 , wherein the obtuse angle is between about 100 degrees and about 170 degrees.
12. The chip of claim 1 , further comprising a coating layer immovably attached to and covering the ring resonator and the waveguide.
13. The chip of claim 12 , wherein the coating layer is made of silicon dioxide.
14. The chip of claim 1 , wherein the ring resonator core and the waveguide core are made of silicon nitride.
15. The chip of claim 1 , wherein the substrate is made of silicon.
16. The chip of claim 1 , wherein the first waveguide cladding layer and the first ring cladding layer are made of silicon dioxide.
17. The chip of claim 1 , wherein the ring resonator core and the waveguide core are made of silicon dioxide.
18. The chip of claim 1 , wherein the ring resonator core is made of silicon dioxide and the waveguide core is made of silicon nitride.
19. The chip of claim 1 , wherein the first waveguide cladding layer and the first ring cladding layer is made of a thermal dioxide.
20. A method of manufacturing a chip for an optical gyroscope, the method comprising:
depositing a first cladding layer on an upper surface of a substrate;
depositing a core layer on the first cladding layer;
depositing a resist mask pattern above the core layer to define:
a form of a ring resonator core, and
a form of a waveguide core spaced from the ring resonator core;
etching the core layer outside of the resist mask pattern to form an obtuse angle of a side wall of the ring resonator core with the upper surface of the substrate; and
stripping the resist mask pattern off.
21. The method of claim 20 further comprising:
prior to depositing the resist mask pattern, depositing a second cladding layer on the core layer;
depositing a resist mask pattern on the second cladding layer; and,
in addition to etching the core layer, etching the second cladding layer outside of the resist mask pattern.
22. The method of claim 20 , further comprising:
in addition to etching the core layer, etching the first cladding layer outside of the resist mask pattern.
23. The method of claim 20 , further comprising:
after stripping the resist mask, depositing a coating layer to cover the first cladding layer, the ring resonator core, and the waveguide core.
24. The method of claim 20 , wherein etching the core layer outside of the resist mask pattern further comprises forming an obtuse angle between a side wall of the waveguide core and the upper surface of the substrate.
25. A method of manufacturing a chip for an optical gyroscope, the method comprising:
depositing a first cladding layer on an upper surface of a substrate;
depositing a core layer on the first cladding layer;
depositing a resist mask pattern to define a form of a ring resonator core;
etching the core layer outside of the resist mask pattern to form an obtuse angle of a side wall of the ring resonator core with the upper surface of the substrate;
stripping the resist mask pattern off,
depositing a waveguide core positioned tangentially to the ring resonator core and located at a gap distance from the ring resonator core.
26. The method of claim 25 , further comprising
depositing a coating layer to cover the first cladding layer, the ring resonator core, and the waveguide core.
27. A method of manufacturing a chip for an optical gyroscope, the method comprising:
depositing a first waveguide cladding layer on a substrate;
depositing a first waveguide core layer and etching the first waveguide core layer to obtain a waveguide core;
depositing a second waveguide cladding layer to cover the waveguide core and the first waveguide cladding layer;
depositing a ring supporting layer and etching it to obtain a first ring cladding layer; and
depositing a ring resonator core layer and etching the ring resonator core layer to obtain a ring resonator core and to form an obtuse angle of a side wall of the ring resonator core with the upper surface of the substrate.
28. The method of manufacturing the chip of claim 27 , further comprising depositing a coating layer on the ring resonator core and the second waveguide cladding layer.
29. An optical gyroscope comprising the chip of claim 1 .