Barrier ruthenium chemical mechanical polishing slurry
A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further include abrasive, acid(s), and, optionally, an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper removal rate ratio.
1. A method for removing ruthenium from a semiconductor device, wherein the semiconductor device comprises ruthenium and copper, the method comprising:
applying a polishing composition to the semiconductor device, wherein the polishing composition comprises:
an alkali hydroxide;
an oxygenated halogen, wherein the oxygenated halogen compound is present in an amount of about 0.1 wt % to about 10 wt %, based on the total weight of the composition;
a halogen alkyl benzotriazole present in an amount of about 0.001 wt % to about 0.08 wt %, based on the total weight of the composition;
an abrasive; and
an acid,
wherein the method further comprises the steps of:
polishing the semiconductor device with a polishing pad; and
removing ruthenium and copper from the semiconductor device at a selectivity ratio of ruthenium to copper that is greater than 1.2.
2. The method of claim 1 , wherein ruthenium and copper are removed from the semiconductor device at a selectivity ratio of ruthenium to copper that is greater than 2.5.
3. The method of claim 1 , further comprising a pH adjuster present in an amount of about 0.01 wt % to about 10 wt %, based on the total weight of the polishing composition.
4. The method of claim 1 , wherein the oxygenated halogen compound comprises at least one halogen selected from the group consisting of iodine, bromine, chlorine, and any combinations thereof.
5. The method of claim 1 , wherein the oxygenated halogen is hydrogen periodate.
6. The method of claim 1 , wherein the alkyl in the halogen alkyl benzotriazole is selected from the group consisting of methyl, ethyl, propyl, isopropyl, butyl, isobutyl, and any combinations thereof.
7. The method of claim 1 , wherein the abrasive is selected from the group consisting of alumina, silica, titania, ceria, zirconia, co-formed products thereof, and any combinations thereof.
8. The method of claim 1 , wherein the abrasive is silica.
9. The method of claim 1 , wherein the abrasive is present in an amount of about 0.01 wt % to about 12 wt %, based on the total weight of the polishing composition.
10. The method of claim 1 , wherein the acid is selected from the group consisting of carboxylic acids, amino acids, sulfonic acids, phosphoric acids, phosphonic acids, and any combination thereof.
11. The method of claim 10 , wherein the sulfonic acid is present and is at least one organic sulfonic acid selected from the group consisting of 1,2-ethanedisulfonic acid, 4-amino-3-hydroxy-1-naphthalenesulfonic acid, 8-hydroxyquinoline-5-sulfonic acid, aminomethane sulfonic acid, benzenesulfonic acid, hydroxylamine o-sulfonic acid, methanesulfonic acid, m-xylene-4-sulfonic acid, poly(4-styrenesulfonic acid), polyanetholesulfonic acid, p-toluenesulfonic acid, and trifluoromethane-sulfonic acid.
12. The method of claim 10 , wherein said phosphoric acid is present and is at least one organic phosphoric acid selected from the group consisting of ethyl phosphoric acid, cyanoethyl phosphoric acid, phenyl phosphoric acid and vinyl phosphoric acid.
13. The method of claim 10 , wherein said phosphonic acid is present and is at least one organic phosphonic acid consisting of poly(vinylphosphonic acid), 1-hydroxyethane-1,1-diphosphonic acid, nitrilotri(methylphosphonic acid), diethylenetriaminepentakis (methylphosphonic acid), N,N,N′N′-ethylenediaminetetrakis(methylene phosphonic acid), n-hexylphosphonic acid, benzylphosphonic acid and phenylphosphonic acid.
14. The method of claim 1 , wherein the acid is at least one acid selected from the group consisting of: malonic acid, propionic acid, an organic sulfonic acid, and any combinations thereof.
15. The method of claim 1 , wherein the acid is present in an amount of about 0.01 wt % to about 10 wt %, based on the total weight of the polishing composition.
16. The method of claim 1 , wherein the polishing composition further comprises a surfactant.
17. The method of claim 16 , wherein the surfactant is at least one surfactant selected from the group consisting of cationic surfactants, anionic surfactants, non-ionic surfactants, and amphoteric surfactants.
18. The method of claim 16 , wherein the surfactant is an alkoxylated alcohol non-ionic surfactant.
19. The method of claim 16 , wherein the surfactant is present in an amount of about 0.01 wt % to about 10 wt %, based on the total weight of the polishing composition.
20. The method of claim 1 , wherein the pH of the polishing composition is from about 5 to about 11.
21. The method of claim 1 , wherein the pH of the polishing composition is from about 7 to about 11.
22. A method for removing ruthenium from a semiconductor device, wherein the semiconductor device comprises ruthenium and copper, the method comprising:
applying a polishing composition to the semiconductor device, wherein the composition comprises:
potassium hydroxide, present in an amount of about 0.01 wt % to about 10 wt %, based on the total weight of the composition;
hydrogen periodate, present in an amount of about 0.1 wt % to about 10 wt %, based on the total weight of the composition;
chloro methyl benzotriazole, present in an amount of about 0.001 wt % to about 0.08 wt %, based on the total weight of the composition;
silica, present in an amount of about 0.01 wt % to about 12 wt %, based on the total weight of the composition; and
malonic acid, present in an amount of about 0.01 wt % to about 10 wt %, based on the total weight of the composition,
wherein the method further comprises the steps of:
polishing the semiconductor device with a polishing pad; and
removing ruthenium and copper from the semiconductor device at a selectivity ratio of ruthenium to copper that is greater than 2.5.
23. The method of claim 22 , wherein the composition further comprises an alkoxylated alcohol non-ionic surfactant, present in an amount of about 0.01 wt % to about 10 wt %, based on the total weight of the composition.
24. The method of claim 22 , wherein the composition has a pH of about 5 to about 11.
25. A method for removing ruthenium from a semiconductor device, wherein the semiconductor device comprises ruthenium and copper, the method comprising:
applying a polishing composition to the semiconductor device, wherein the polishing composition comprises:
an alkali hydroxide;
an oxygenated halogen, wherein the oxygenated halogen compound comprises at least one halogen selected from the group consisting of: iodine, bromine, chlorine, and any combinations thereof, and wherein the oxygenated halogen is present in an amount of about 0.1 wt % to about 10 wt %, based on the total weight of the composition;
a halogen alkyl benzotriazole, present in an amount of about 0.001 wt % to about 0.08 wt %, based on the total weight of the composition;
an abrasive; and
an acid,
wherein the method further comprises the steps of:
polishing the semiconductor device with a polishing pad; and
removing ruthenium and copper from the semiconductor device at a selectivity ratio of ruthenium to copper that is greater than 1.2.