Semiconductor device and method of coating a semiconductor wafer with high viscosity liquid photoresist using N2 purge
A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.
1. A semiconductor manufacturing device, comprising:
an outer cup;
an inner cup disposed within the outer cup, wherein the inner cup includes a wafer suction mount adapted for mounting a semiconductor wafer;
a gas purge port disposed on the inner cup for dispensing a gas into an area between the inner cup and a bottom side of the semiconductor wafer to move contamination into an outlet disposed between the inner cup and outer cup; and
an inner cup rinse port disposed on the inner cup to dispense a rinse solution into the inner cup to perform an inner cup rinse, wherein the gas from the gas purge port with the inner cup rinse move the contamination into the outlet disposed between the inner cup and outer cup.
2. The semiconductor manufacturing device of claim 1 , wherein the inner cup rinse port dispenses the rinse solution selected from the group consisting of containing propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, or a mixture thereof, to perform an inner cup rinse.
3. The semiconductor manufacturing device of claim 1 , wherein the gas includes a stable or inert gas.
4. The semiconductor manufacturing device of claim 1 , wherein the gas includes nitrogen.
5. The semiconductor manufacturing device of claim 1 , further including a source of air flow through the outlet disposed between the inner cup and outer cup to remove contamination from the bottom side of the semiconductor wafer.
6. The semiconductor manufacturing device of claim 1 , further including a wafer backside rinse port disposed on the inner cup.
7. A semiconductor manufacturing device, comprising:
an outer cup;
an inner cup including a wafer suction mount disposed within the outer cup;
a gas purge port disposed on the inner cup for dispensing a gas into an area between the inner cup and a bottom side of the semiconductor wafer to move contamination into an outlet disposed between the inner cup and outer cup; and
an inner cup rinse port disposed on the inner cup to dispense a rinse solution into the inner cup to perform an inner cup rinse, wherein the gas from the gas purge port with the inner cup rinse move the contamination into the outlet between the inner cup and outer cup.
8. The semiconductor manufacturing device of claim 7 , wherein the gas purge port is adapted for dispensing a gas oriented toward a bottom side of a semiconductor wafer disposed on the wafer suction mount.
9. The semiconductor manufacturing device of claim 7 , wherein the inner cup rinse port dispenses the solution selected from the group consisting of containing propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, or a mixture thereof, to perform an inner cup rinse.
10. The semiconductor manufacturing device of claim 7 , wherein the gas includes a stable or inert gas.
11. The semiconductor manufacturing device of claim 7 , wherein the gas includes nitrogen.
12. A semiconductor manufacturing device, comprising:
an outer cup;
an inner cup disposed within the outer cup and adapted for mounting a semiconductor wafer;
a gas purge port disposed on the inner cup for dispensing a gas oriented toward the semiconductor wafer to move contamination into an outlet disposed between the inner cup and outer cup; and
an inner cup rinse port disposed on the inner cup to dispense a rinse solution into the inner cup to perform an inner cup rinse, wherein the gas from the gas purge port with the inner cup rinse move the contamination into the outlet between the inner cup and outer cup.
13. The semiconductor manufacturing device of claim 12 , wherein the inner cup rinse port dispenses the solution selected from the group consisting of containing propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, or a mixture thereof, to perform an inner cup rinse.
14. The semiconductor manufacturing device of claim 12 , wherein the gas includes a stable or inert gas.
15. The semiconductor manufacturing device of claim 12 , wherein the gas includes nitrogen.
16. The semiconductor manufacturing device of claim 12 , further including a wafer backside rinse port disposed on the inner cup.