Liner for a bi-layer gate helmet and the fabrication thereof
A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.
1. A method, comprising:
providing a semiconductor device that includes:
a semiconductor fin structure;
source/drain regions disposed on opposite sides of the semiconductor fin structure;
a gate structure disposed over the semiconductor fin structure, the gate structure including a gate electrode; and
gate spacers disposed on sidewalls of the gate structure;
etching the semiconductor device, wherein the gate electrode and the gate spacers are partially etched, and wherein the gate electrode is etched at a faster rate than the gate spacers during the etching;
after the etching, re-forming a portion of the gate structure; and
after the re-forming the portion of the gate structure, forming a liner over the gate structure and the gate spacers, wherein the liner defines an upwardly-facing recess.
2. The method of claim 1 , wherein:
the semiconductor device further includes an interlayer dielectric (ILD) structure disposed on sidewalls of the gate spacers; and
the gate spacers are etched at a faster etching rate than the ILD structure during the etching.
3. The method of claim 2 , wherein the forming the liner further comprises forming the liner over the ILD structure.
4. The method of claim 1 , wherein the forming the liner comprises forming a liner that contains a dielectric material having a dielectric constant greater than about 4, and wherein the liner has a thickness in a range between about 0.5 nanometers and about 5 nanometers.
5. The method of claim 1 , wherein a segment of the liner is formed to have an upper surface with a lower vertical elevation than an upper surface of the gate spacers.
6. The method of claim 1 , wherein:
the gate structure includes a work function (WF) metal layer;
the etching partially etches away the WF metal layer; and
the re-forming the portion of the gate structure comprises depositing a first metal layer over the WF metal layer, the first metal layer and the WF metal layer having different material compositions.
7. The method of claim 1 , further comprising: after the forming of the liner, depositing a dielectric material over the liner, wherein the dielectric material and the liner have different material compositions.
8. The method of claim 7 , wherein the depositing the dielectric material comprises depositing a dielectric material having a smaller dielectric constant than the liner as the dielectric material.
9. The method of claim 7 , further comprising: etching back a portion of the dielectric material, wherein an etching selectivity exists between the liner and the dielectric material during the etching back.
10. The method of claim 9 , wherein the dielectric material is a first dielectric material, and wherein the method further comprises depositing a second dielectric material over the first dielectric material after the first dielectric material has been etched back.
11. The method of claim 10 , wherein the depositing the second dielectric material comprises depositing a dielectric material having a greater dielectric constant than about 4 as the second dielectric material.
12. The method of claim 1 , wherein the gate electrode has a concave upper surface after the etching has been performed.
13. A method, comprising:
providing a semiconductor device that includes:
a semiconductor fin structure;
source/drain regions disposed on opposite sides of the semiconductor fin structure;
a gate structure disposed over the semiconductor fin structure;
gate spacers disposed on sidewalls of the gate structure, the gate structure including a work function (WF) metal layer that completely fills a space between the gate spacers; and
an interlayer dielectric (ILD) structure disposed on sidewalls of the gate spacers;
performing a first etching process to the semiconductor device, the first etching process partially etches away the WF metal layer, wherein an etching selectivity exists between the gate structure, the gate spacers, and the ILD structure during the first etching process, such that remaining portions of the gate structure, the gate spacers, and the ILD structure collectively define a T-shaped opening;
depositing a conductive material over the WF metal layer, wherein the conductive material and the WF metal layer have different material compositions; and
after the first etching process has been performed, partially filling the T-shaped opening with a liner, over the gate structure and the gate spacers.
14. The method of claim 13 , further comprising:
forming a first dielectric material over the liner, the first dielectric material filling the T-shaped opening, wherein the first dielectric material and the liner have different material compositions; and
performing a second etching process to remove the first dielectric material, wherein the liner serves as an etching-stop layer during the second etching process.
15. The method of claim 14 , further comprising, after the first dielectric material has been removed:
forming a second dielectric material to partially fill the T-shaped opening; and
forming a third dielectric material to completely fill the T-shaped opening, wherein the third dielectric material has a greater dielectric constant than the second dielectric material.
16. The method of claim 13 , wherein the gate structure is etched at a faster rate than the gate spacers during the first etching process.
17. A method, comprising:
providing a semiconductor device that includes:
a source and a drain;
a semiconductor structure disposed between the source and the drain;
a first metal layer disposed over the semiconductor structure;
an interlayer dielectric (ILD) disposed over the source and over the drain; and
spacers disposed between the ILD and the first metal layer;
performing one or more first etching processes to form an opening in the semiconductor device, wherein the opening is defined by an upper surface of the first metal layer, upper surfaces and side surfaces of the spacers, and side surfaces of the ILD;
forming a liner to partially fill the opening, wherein the liner has a first material composition;
forming a dielectric material on the liner, the dielectric material having a second material composition different from the first material composition; and
performing a second etching process to remove the dielectric material, wherein the dielectric material has a greater etching rate than the liner such that the liner protects at least the spacers from being etched during the second etching process.
18. The method of claim 17 , wherein the liner is formed to have a greater dielectric constant than the spacers, the ILD, and the dielectric material.
19. The method of claim 17 , further comprising: forming a dielectric structure in the opening after the second etching process, wherein the forming of the dielectric structure comprises forming a first portion over the liner and forming a second portion over the first portion, wherein the second portion has a greater dielectric constant than the first portion.
20. The method of claim 19 , wherein:
the forming of the first portion comprises depositing a low-k dielectric layer as the first portion, the low-k dielectric layer having a dielectric constant less than about 4; and
the forming of the second portion comprises depositing a high-k dielectric layer as the second portion, the high-k dielectric layer having a dielectric constant greater than about 4.