Semiconductor integrated circuit device
A layout structure of a capacitance cell using a complementary FET (CFET) is provided. A capacitance part includes a first three-dimensional transistor of a first conductivity type and a second three-dimensional transistor of a second conductivity type formed above the first transistor in the depth direction. The source and drain of the first transistor are both connected to VDD or VSS, and the source and drain of the second transistor are both connected to VDD or VSS. The gates of the first and second transistors are both connected to the gate of a transistor included in a fixed-value output part, and are supplied with VDD or VSS.
1. A semiconductor integrated circuit device including a standard cell as a capacitance cell, the standard cell comprising:
a first power supply line extending in a first direction and supplying a first power supply voltage;
a second power supply line extending in the first direction and supplying a second power supply voltage different from the first power supply voltage;
a capacitance part provided between the first power supply line and the second power supply line as viewed in plan; and
a fixed-value output part provided between the first power supply line and the second power supply line as viewed in plan, for supplying the first power supply voltage or the second power supply voltage to the capacitance part,
wherein
the capacitance part has
a first transistor that is a three-dimensional transistor of a first conductivity type, and
a second transistor that is a three-dimensional transistor of a second conductivity type, formed above the first transistor in a depth direction,
a source and drain of the first transistor are both connected to one of the first and second power supply lines, and a source and drain of the second transistor are both connected to one of the first and second power supply lines,
the fixed-value output part has
a third transistor that is a three-dimensional transistor of the first conductivity type, formed on a level with the first transistor in the depth direction, and
a fourth transistor that is a three-dimensional transistor of the second conductivity type, formed on a level with the second transistor in the depth direction,
a source of the third transistor is connected to the first power supply line and a drain thereof is connected to a gate of the fourth transistor, and a source of the fourth transistor is connected to the second power supply line and a drain thereof is connected to a gate of the third transistor,
gates of the first and second transistors are both connected to the gate of the third transistor or the gate of the fourth transistor, and
the source of the third transistor is used in common with the source or drain of the first transistor, or the source of the fourth transistor is used in common with the source or drain of the second transistor.
2. The semiconductor integrated circuit device of claim 1 , wherein
the first conductivity type is p-type and the second conductivity type is n-type.
3. The semiconductor integrated circuit device of claim 1 , wherein
the first conductivity type is n-type and the second conductivity type is p-type.
4. The semiconductor integrated circuit device of claim 1 , wherein
the capacitance part has
a fifth transistor that is a three-dimensional transistor of the first conductivity type, formed on a level with the first transistor in the depth direction, and
a sixth transistor that is a three-dimensional transistor of the second conductivity type, formed on a level with the second transistor in the depth direction,
a source and drain of the fifth transistor are connected with the source and drain of the first transistor, and a gate thereof is connected with the gate of the first transistor, and
a source and drain of the sixth transistor are connected with the source and drain of the second transistor, and a gate thereof is connected with the gate of the second transistor.
5. The semiconductor integrated circuit device of claim 1 , wherein
the standard cell includes
a first local interconnect connected with the source of the second transistor, extending in a second direction perpendicular to the first direction, and
the first local interconnect extends up to positions overlapping the first power supply line and the second power supply line as viewed in plan and is connected with either one of the first power supply line and the second power supply line.
6. The semiconductor integrated circuit device of claim 1 , wherein
the gates of the first and second transistors are connected to the gate of the fourth transistor, and are supplied with the first power supply voltage.
7. The semiconductor integrated circuit device of claim 1 , wherein
the gates of the first and second transistors are connected to the gate of the third transistor, and are supplied with the second power supply voltage.
8. The semiconductor integrated circuit device of claim 1 , wherein
the source and drain of the first transistor and the source and drain of the second transistor are connected in common to one of the first and second power supply lines.
9. The semiconductor integrated circuit device of claim 1 , wherein
the fixed-value output part has
a fifth transistor that is a three-dimensional transistor of the first conductivity type, formed on a level with the third transistor in the depth direction, and
a sixth transistor that is a three-dimensional transistor of the second conductivity type, formed on a level with the fourth transistor in the depth direction,
a channel portion of the fifth transistor overlaps a channel portion of the fourth transistor as viewed in plan, and
a channel portion of the sixth transistor overlaps a channel portion of the third transistor as viewed in plan.
10. A semiconductor integrated circuit device including a standard cell as a capacitance cell, the standard cell comprising:
a first power supply line extending in a first direction and supplying a first power supply voltage;
a second power supply line extending in the first direction and supplying a second power supply voltage different from the first power supply voltage;
a capacitance part provided between the first power supply line and the second power supply line as viewed in plan; and
a fixed-value output part provided between the first power supply line and the second power supply line as viewed in plan, for supplying the first power supply voltage or the second power supply voltage to the capacitance part,
wherein
the capacitance part has
a first transistor that is a three-dimensional transistor, and
a second transistor that is a three-dimensional transistor of the same conductivity type as the first transistor, formed above the first transistor in a depth direction,
a source and drain of the first transistor and a source and drain of the second transistor are all connected to one of the first and second power supply lines,
the fixed-value output part has
a third transistor that is a three-dimensional transistor of the first conductivity type, formed on a level with the first transistor in the depth direction, and
a fourth transistor that is a three-dimensional transistor of a second conductivity type different from the first conductivity type, formed on a level with the second transistor in the depth direction,
a source of the third transistor is connected to the first power supply line and a drain thereof is connected to a gate of the fourth transistor, and a source of the fourth transistor is connected to the second power supply line and a drain thereof is connected to a gate of the third transistor,
gates of the first and second transistors are both connected to the gate of the third transistor or the gate of the fourth transistor, and
a dummy gate interconnect is placed between the first and second transistors and the third and fourth transistors.
11. The semiconductor integrated circuit device of claim 10 , wherein
the conductivity type of the first and second transistors is n-type.
12. The semiconductor integrated circuit device of claim 10 , wherein
the conductivity type of the first and second transistors is p-type.
13. The semiconductor integrated circuit device of claim 10 , wherein
the capacitance part has
a fifth transistor that is a three-dimensional transistor formed on a level with the first transistor in the depth direction, and
a sixth transistor that is a three-dimensional transistor formed on a level with the second transistor in the depth direction,
a source and drain of the fifth transistor are connected with the source and drain of the first transistor, and a gate thereof is connected with the gate of the first transistor,
a source and drain of the sixth transistor are connected with the source and drain of the second transistor, and a gate thereof is connected with the gate of the second transistor, and
the conductivity type of the fifth and sixth transistor is the same as the conductivity type of the first and second transistors.
14. The semiconductor integrated circuit device of claim 10 , wherein
the standard cell includes
a first local interconnect connected with the source of the second transistor, extending in a second direction perpendicular to the first direction, and
the first local interconnect extends up to positions overlapping the first power supply line and the second power supply line as viewed in plan and is connected with either one of the first power supply line and the second power supply line.
15. The semiconductor integrated circuit device of claim 10 , wherein
the source and drain of the first transistor and the source and drain of the second transistor are all connected to the second power supply line, and
the gates of the first and second transistors are connected to the gate of the fourth transistor, and are supplied with the first power supply voltage.
16. The semiconductor integrated circuit device of claim 10 , wherein
the source and drain of the first transistor and the source and drain of the second transistor are all connected to the first power supply line, and
the gates of the first and second transistors are connected to the gate of the third transistor, and are supplied with the second power supply voltage.
17. The semiconductor integrated circuit device of claim 10 , wherein
the fixed-value output part has
a fifth transistor that is a three-dimensional transistor of the first conductivity type, formed on a level with the third transistor in the depth direction, and
a sixth transistor that is a three-dimensional transistor of the second conductivity type, formed on a level with the fourth transistor in the depth direction,
a channel portion of the fifth transistor overlaps a channel portion of the fourth transistor as viewed in plan, and
a channel portion of the sixth transistor overlaps a channel portion of the third transistor as viewed in plan.
18. A semiconductor integrated circuit device including a first standard cell and a second standard cell that is a capacitance cell, the first standard cell comprising:
a first power supply line extending in a first direction and supplying a first power supply voltage;
a second power supply line extending in the first direction and supplying a second power supply voltage different from the first power supply voltage;
a first transistor that is a three-dimensional transistor of a first conductivity type;
a second transistor that is a three-dimensional transistor of a second conductivity type, formed above the first transistor in a depth direction;
a first local interconnect connected with a source or drain of the first transistor, extending in a second direction perpendicular to the first direction as viewed in plan;
a second local interconnect connected with a source or drain of the second transistor, extending in the second direction as viewed in plan; and
a first gate interconnect that is to be a common gate of the first and second transistors, extending in the second direction as viewed in plan,
the second standard cell comprising:
a second gate interconnect formed on a level with the first gate interconnect in the depth direction;
a third local interconnect formed on a level with the first local interconnect in the depth direction; and
a fourth local interconnect formed on a level with the second local interconnect in the depth direction,
wherein
the second gate interconnect is electrically connected with one of the first and second power supply lines, and the third and fourth local interconnects are electrically connected with the other of the first and second power supply lines, and
the third and fourth local interconnects overlap each other as viewed in plan and are adjacent to the second gate interconnect as viewed in plan.
19. The semiconductor integrated circuit device of claim 18 , wherein
the first and second power supply lines are formed in a buried wiring layer, and
the second gate interconnect extends up to a range overlapping the one of the first and second power supply lines as viewed in plan and is connected with the one of the first and second power supply lines through a contact.