3D stacked die test architecture
This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.
1. An integrated circuit die comprising:
(a) a first surface and an opposed second surface;
(b) the first surface including:
a first test clock contact point,
a first test mode select contact point,
a first test data in contact point,
a first test data out contact point,
first parallel test data in contact points, and
first parallel test data out contact points;
(c) the second surface including:
a second test clock contact point coupled to the first test clock contact point,
a second test mode select contact point coupled to the first test mode select contact point,
a second test data out contact point coupled with the first test data in contact point,
a second test data in contact point coupled with the first test data out contact point,
second parallel test data in contact points coupled with the first parallel test data in contact points respectively, and
second parallel test data out contact points coupled with the first parallel test data out contact points respectively;
(d) test access port circuitry having inputs coupled to the first test clock contact point and the first test mode select contact point and a data input coupled to the first test data in contact point and an data output coupled to the first test data out contact point, and including an instruction register operable to shift test instruction between the data input and the data output; and
(e) parallel test circuitry having an input coupled to at least one of the first parallel test data in contact points, and an output coupled to at least one of the first parallel test data out contact points and being operable to shift test data between the input and the output.
2. The integrated circuit die of claim 1 in which the first surface is a bottom surface of the die and the second surface is a top surface of the die.
3. The integrated circuit die of claim 1 in which the test access port circuitry includes a state machine having inputs coupled to the first test clock contact point and to the first test mode select contact point, and having data register control outputs, instruction register control outputs, and a multiplexer control output.
4. The integrated circuit die of claim 1 in which the test access port circuitry includes a state machine having inputs coupled to the first test clock contact point and to the first test mode select contact point, and having outputs indicating states of Test Logic Reset, Run/Test Idle, Select-DR, and Select-IR.
5. The integrated circuit die of claim 1 in which the test access port circuitry includes data registers and an instruction register, both having inputs coupled to the first test data in contact point and outputs coupled to the first test data out contact point.
6. The integrated circuit of claim 1 in which the test access port circuitry includes:
a state machine having inputs coupled to the first test clock contact point and to the first test mode select contact point, and having data register control outputs, instruction register control outputs, and a multiplexer control output;
data registers having data inputs coupled to the first test data in contact point, data register control inputs coupled to the data register control outputs, and data outputs;
the instruction register having a data input coupled to the first test data in contact point, instruction register control inputs coupled to the instruction register control outputs, instruction outputs, and a data output; and
multiplexer circuitry having inputs coupled to the data outputs of the data registers and the instruction register, a control input coupled to the multiplexer control output, and a data output coupled to the coupled to the first test data out contact point.
7. The integrated circuit of claim 6 in which:
the first surface includes a capture contact point; and
including dual port router circuitry having a capture input coupled to the capture lead, data register control inputs coupled to the data register control outputs of the TAP state machine, instruction register inputs coupled to the instruction register outputs of the TAP state machine, and data register control outputs coupled to the data register control inputs of the data registers.
8. The integrated circuit of claim 7 in which:
the first surface includes a capture contact point;
the TAP state machine data register control outputs includes a ClockDR signal and a ShiftDR signal; and
including dual port router circuitry having:
(i) first multiplexer circuitry having an input connected to the capture contact point, an input connected to the ShiftDR signal, a control input connected to one of the instruction register instruction outputs, and an output; and
(ii) first gating circuitry having an input connected to the output of the multiplexer circuitry, an input connected to the control input of the first multiplexer circuitry, and a gated ShiftDR signal output coupled to a data register control input of the data registers.
9. The integrated circuit of claim 8 in which the dual port router circuitry includes second gating circuitry having an input connected to the ClockDR signal, an input connected to the control input of the first multiplexer circuitry, and a gated ClockDR signal output coupled to a data register control input of the data registers.
10. The integrated circuit of claim 7 in which the parallel test circuitry includes plural parallel test circuits in addition to the data registers and the instruction register.
11. The integrated circuit of claim 6 in which the state machine has the states of TEST LOGIC RESET, RUN TEST/IDLE, SELELCT-DR, and SELECT_IR.
12. The integrated circuit of claim 1 in which the parallel test circuitry includes plural parallel test circuits with each parallel test circuit having an input coupled to a first parallel test data in contact point, and an output coupled to a first parallel test data out contact point.
13. The integrated circuit of claim 1 in which the contact points on one of the surfaces are coupled to contact points on a substrate.
14. The integrated circuit of claim 1 in which the contact points on one of the surfaces are coupled to another integrated circuit die.
15. The integrated circuit of claim 1 in which the contact pints on one of the surfaces are coupled to contact points on a substrate and the contact points on the other surface are coupled to another integrated circuit die.