Methods and systems for printed circuit board design based on automatic corrections

1. A method comprising, by a computing system:

accessing design data of a printed circuit board to be produced by a manufacturing process;

determining one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board; and

automatically adjusting one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections, wherein the adjusted parameters are associated with an impedance of the printed circuit board, and wherein the one or more corrections cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

2. The method of claim 1 , wherein the one or more correction rules are determined based on X-ray inspection data associated with previous printed circuit boards that are produced by the manufacturing process.

3. The method of claim 1 , wherein the one or more correction rules are determined based on a difference between previous design data and previous printed circuit boards that are produced by the manufacturing process based on the previous design data.

4. The method of claim 3 , wherein the one or more correction rules are based on a root cause associated with the difference between the previous design data and the previous printed circuit boards that are produced by the manufacturing process based on the previous design data.

5. The method of claim 1 , further comprising:

providing the design data with the adjusted parameters to one or more computing systems associated with a manufacturing tool used in the manufacturing process, wherein the printed circuit board is produced based on the design data with the adjusted parameters by the manufacturing process using the manufacturing tool.

6. The method of claim 5 , further comprising:

determining a difference between the design data with the adjusted parameters and the printed circuit board produced by the manufacturing process;

generating feedback information based on the determined difference between the design data with the adjusted parameters and the printed circuit board produced by the manufacturing process; and

providing the feedback information to a manufacturing tool used in the manufacturing process to cause the manufacturing tool to adjust one or more manufacturing parameters associated with the manufacturing process.

7. The method of claim 5 , further comprising,

determining a difference between the design data with the adjusted parameters and the printed circuit board produced by the manufacturing process;

generating feedforward information based on the determined difference between the design data with the adjusted parameters and the printed circuit board produced by the manufacturing process; and

providing the feedforward information to a manufacturing tool used in a downstream process of the manufacturing process to cause the manufacturing tool to adjust one or more manufacturing parameters associated with the downstream process.

8. The method of claim 1 , wherein the one or more parameters comprise one or more of:

a width of a metal arm or conductive trace,

a length of a metal arm or conductive trace,

a local thickness of conductive trace,

a distance between conductive traces,

a roughness of a conductive trace surface,

a sheet layer thickness,

a distance or spacing between layers,

a corner radius of a conductive trace path,

a location of a plated-through via, or

a dimension associated with a plated-through via.

9. The method of claim 1 , wherein the one or more parameters are associated with one or more performance parameters of the printed circuit board comprising one or more of:

a signal transmission speed,

a data transmission rate,

a number of layers,

a design layout,

a design pattern of conductive traces,

a layer thickness, or

a layer thickness variation trend.

10. The method of claim 1 , wherein the one or more correction rules are associated with a plurality of pre-determined parameters of the manufacturing process.

11. The method of claim 1 , wherein the one or more correction rules are determined based on experiential knowledge or theoretical knowledge associated with the manufacturing process.

12. The method of claim 1 , wherein the one or more correction rules are determined based on X-ray inspection data of previous printed circuit boards produced by the manufacturing process.

13. The method of claim 1 , wherein the one or more corrections are generated based on a combination of the one or more correction rules and inference results of a machine-learning model that is trained based on X-ray inspection data of previous printed circuit boards produced by the manufacturing process.

14. The method of claim 1 , wherein the one or more correction rules are updated based on subsequently obtained knowledge associated with the manufacturing process, and wherein the subsequently obtained knowledge comprises experiential knowledge about a difference between the design data of the printed circuit board and subsequent printed circuit boards produced by the manufacturing process based on the design data of the printed circuit board.

15. The method of claim 1 , wherein the one or more correction rules are updated based on subsequent X-ray inspection data of subsequent printed circuit boards produced by the manufacturing process.

16. The method of claim 1 , wherein the one or more correction rules are generated by a machine-learning model that is trained based on X-ray inspection data of previous printed circuit boards produced by the manufacturing process.

17. The method of claim 16 , wherein the one or more correction rules are updated by the machine-learning model after the machine-learning model is trained based on subsequent X-ray inspection data of subsequent printed circuit boards produced by the manufacturing process.

18. The method of claim 1 , wherein the one or more correction rules are customized to the manufacturing process.

19. One or more computer-readable non-transitory storage media embodying software that is operable when executed to:

access design data of a printed circuit board to be produced by a manufacturing process;

determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board; and

automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections, wherein the adjusted parameters are associated with an impedance of the printed circuit board, and wherein the one or more corrections cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

20. A system comprising one or more processors; and one or more computer-readable non-transitory storage media coupled to one or more of the processors and comprising instructions operable when executed by one or more of the processors to cause the system to:

access design data of a printed circuit board to be produced by a manufacturing process;

determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board; and

automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections, wherein the adjusted parameters are associated with an impedance of the printed circuit board, and wherein the one or more corrections cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.