Magnetic sensor package

1. A magnetic sensor package, comprising:

at least one integrated device die comprising:

a single turn sensor having a sensing element configured to detect the orientation of a magnetic field generated by a rotating magnet positioned in a direction along an axis relative to the single turn sensor; and

a multi-turn sensor having a sensing element configured to detect a number of turns of the rotating magnet, the multi-turn sensor comprising a different type sensor from the single turn sensor and positioned such that the sensing element of the single turn sensor at least partially overlaps the sensing element of the multi-turn sensor along the axis;

a package substrate, wherein the at least one integrated device die is mounted onto the package substrate; and

a housing, wherein the housing encases the package substrate at the at least one integrated device die.

2. A magnetic sensor package according to claim 1 , wherein the at least one integrated device die comprises a first integrated device die comprising the single turn sensor, and a second integrated device die comprising the multi-turn sensor.

3. A magnetic sensor package according to claim 2 , wherein the first integrated device die is stacked onto the second integrated device die.

4. A magnetic sensor package according to claim 3 , wherein the at least one integrated device die further comprises an application specific integrated circuit (ASIC) die coupled to the package substrate.

5. A magnetic sensor package according to claim 4 , wherein the ASIC die is disposed between the package substrate and the second integrated device die.

6. A magnetic sensor package according to claim 2 , wherein one or both of the first integrated device die and the second integrated device die are mounted to the package substrate using a die attach film.

7. A magnetic sensor package according to claim 1 , wherein the package substrate comprises a non-magnetic material.

8. A magnetic sensing system, comprising:

a rotatable magnet configured to generate a rotating magnetic field;

a magnetic sensor package, comprising:

at least one integrated device die comprising:

a single turn sensor having a sensing element configured to detect the orientation of a magnetic field generated by a rotatable magnet positioned in a direction along an axis relative to the single turn sensor; and

a multi-turn sensor having a sensing element configured to detect a number of turns of the rotatable magnet, the multi-turn sensor comprising a different type sensor from the single turn sensor and positioned such that the sensing element of the single turn sensor at least partially overlaps the sensing element of the multi-turn sensor along the axis;

a package substrate, wherein the at least one integrated device die is mounted onto the package substrate; and

a housing, wherein the housing encases the package substrate at the at least one integrated device die.

9. A magnetic sensing system according to claim 8 , wherein the magnetic sensor package is aligned with a rotational axis of the rotatable magnet.

10. A magnetic sensing system according to claim 8 , wherein a center of the single turn sensor is aligned with the rotational axis of the rotatable magnet.

11. A magnetic sensing system according to claim 8 , wherein the magnetic sensor package is offset from the rotational axis of the rotatable magnet.

12. A magnetic sensing system according to claim 8 , wherein the magnetic sensor package is at a first position within a plane perpendicular to the rotational axis of the rotatable magnet.

13. A magnetic sensing system according to claim 12 , wherein the first position experiences a constant magnetic field strength as the magnet rotates.

14. A method of manufacturing a magnetic sensor package, the method comprising:

providing a package substrate;

forming at least one integrated device die on the package substrate, the at least one integrated device die comprising a single turn sensor having a sensing element configured to detect the orientation of a magnetic field generated by a rotating magnet positioned in a direction along an axis relative to the single turn sensor, and a multi-turn sensor having a sensing element configured to detect a number of turns of the rotating magnet such that the sensing element of the single turn sensor at least partially overlaps the sensing element of the multi-turn sensor along the axis, the multi-turn sensor comprising a different type sensor from the single turn sensor; and

forming a housing around the package substrate.

15. A method of manufacture according to claim 14 , wherein forming the at least one integrated device die comprises forming a first integrated device die comprising the single turn sensor and forming a second integrated device die comprising the multi-turn sensor.

16. A method of manufacture according to claim 15 , further comprising attaching one or both of the first integrated device die and the second integrated device die to the package substrate using a die attach film.

17. A method of manufacture according to claim 15 , wherein the at least one integrated device die further comprises an application specific integrated circuit (ASIC) die coupled to the package substrate.

18. A method according to claim 17 , wherein the ASIC die is disposed between the package substrate and the second integrated device die.

19. A method of manufacture according to claim 14 , wherein the package substrate comprises a non-magnetic material.

20. A method of manufacture according to claim 14 , wherein forming the housing comprises:

providing a first molded component on a first side of the package substrate;

providing a second molded component on a second side of the package substrate; and

joining the first and second molded components to enclose the package substrate.