Multi zone spot heating in EPI
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.
1. A process chamber, comprising:
a chamber body;
a substrate support disposed in the chamber body;
a support disposed outside the chamber body;
a mounting bracket disposed on the support outside the chamber body;
a plurality of spot heating modules each comprising a movable stage and coupled to the mounting bracket, the mounting bracket including a plurality of openings formed therein, wherein each opening of the plurality of openings is positioned between a respective spot heating module of the plurality of spot heating modules and the substrate support, wherein the movable stage includes a slider and a wedge; and
a plurality of sensors disposed on the mounting bracket, each sensor of the plurality of sensors corresponding to a respective spot heating module of the plurality of spot heating modules.
2. The process chamber of claim 1 , wherein each spot heating module of the plurality of spot heating modules comprises a laser source and a plurality of collimators, wherein each collimator is optically coupled to a respective laser source by an optical fiber.
3. The process chamber of claim 1 , further comprising a reflector located adjacent to the mounting bracket.
4. The process chamber of claim 3 , wherein the reflector includes a plurality of openings formed therein, each opening of the plurality of openings of the reflector positioned between the substrate support and a respective spot heating module of the plurality of spot heating modules.
5. The process chamber of claim 1 , wherein the mounting bracket is planar.
6. The process chamber of claim 1 , wherein the mounting bracket includes an annular portion surrounding a central opening, and one or more plates extending from the annular portion.
7. The process chamber of claim 6 , wherein each sensor of the plurality of sensors is a pyrometer.
8. The process chamber of claim 1 , wherein each spot heating module of the plurality of spot heating modules is a laser source.
9. A process chamber, comprising:
a chamber body;
a substrate support disposed in the chamber body;
a support disposed outside the chamber body;
a mounting bracket disposed on the support outside the chamber body; and
a plurality of spot heating modules coupled to the mounting bracket, each spot heating module comprising a movable stage coupled to the mounting bracket, wherein a respective sensor of a plurality of sensors is mounted on each movable stage, wherein the movable state includes a slider and a wedge.
10. The process chamber of claim 9 , wherein the mounting bracket including a plurality of openings formed therein at different angular positions with respect to a center of the mounting bracket, wherein each opening of the plurality of openings is positioned between a respective spot heating module of the plurality of spot heating modules and the substrate support.
11. The process chamber of claim 10 , wherein each opening of the openings in the mounting bracket is aligned with a corresponding opening formed in the support disposed outside the chamber body.
12. The process chamber of claim 9 , wherein the mounting bracket includes an annular portion surrounding a central opening, and one or more plates extending from the annular portion.
13. A spot heating assembly, comprising:
a support;
a mounting bracket disposed on the support;
a plurality of spot heating modules coupled to the mounting bracket, wherein the mounting bracket comprises:
an annular portion surrounding a central opening;
a plurality of plates extending from the annular portion; and
a plurality of openings formed in the plurality of plates, wherein each opening of the plurality of openings is positioned adjacent to a respective spot heating module of the plurality of spot heating modules, wherein each spot heating module of the plurality of spot heating modules is disposed on a respective movable stage.
14. The spot heating assembly of claim 13 , further comprising a slider that is linearly movable on the mounting bracket.
15. The spot heating assembly of claim 13 , wherein each opening of the openings in the mounting bracket is aligned with a corresponding opening formed in the support.
16. The spot heating assembly of claim 13 , wherein each spot heating module of the plurality of spot heating modules comprises a laser source and a plurality of collimators, each collimator optically coupled to a respective laser source by an optical fiber.
17. The spot heating assembly of claim 13 , wherein each spot heating module of the plurality of spot heating modules is coupled to one of the plurality of plates.
18. The spot heating assembly of claim 17 , further comprising a plurality of sensors, wherein each sensor of the plurality of sensors is disposed on the respective movable stage.
19. The spot heating assembly of claim 18 , wherein each sensor of the plurality of sensors is a pyrometer.