Backplane connector with improved shielding effect

1. A backplane connector, comprising a wafer, the wafer comprising:

a plurality of conductive terminals, each conductive terminal comprising a connection portion and a contact portion;

an insulating frame fixed with the connection portions of the conductive terminals;

a first metal shield comprising a first extension portion located on one side of the contact portions of the conductive terminals; and

a second metal shield comprising a second extension portion located on the other opposite side of the contact portions of the conductive terminals;

wherein the conductive terminals comprise differential signal terminals, a first ground terminal and a second ground terminal, and the differential signal terminals are located between the first ground terminal and the second ground terminal;

wherein the first extension portion comprises a first bulge protruding toward the first ground terminal and a second bulge protruding toward the second ground terminal;

wherein the second extension portion comprises a third bulge protruding toward the first ground terminal and a fourth bulge protruding toward the second ground terminal; and

wherein the first bulge and the third bulge are in contact with two opposite side surfaces of the contact portion of the first ground terminal, respectively; the second bulge and the fourth bulge are in contact two opposite side surfaces of the contact portion of the second ground terminal, respectively; and the first extension portion, the second extension portion, the first ground terminal and the second ground terminal jointly form a shielding space which encloses the contact portions of the differential signal terminals.

2. The backplane connector according to claim 1 , wherein the connection portions of the differential signal terminals, the connection portion of the first ground terminal and the connection portion of the second ground terminal are located in a first plane; the first ground terminal comprises a first torsion portion connecting the connection portion of the first ground terminal and the contact portion of the first ground terminal; the second ground terminal comprises a second torsion portion connecting the connection portion of the second ground terminal and the contact portion of the second ground terminal; and the contact portion of the first ground terminal and the contact portion of the second ground terminal are parallel and perpendicular to the first plane.

3. The backplane connector according to claim 2 , wherein the contact portion of the first ground terminal comprises two first wide surfaces and two first narrow surfaces, the contact portion of the second ground terminal comprises two second wide surfaces and two second narrow surfaces, the first bulge and the third bulge are in contact with the two first narrow surfaces of the first ground terminal, and the second bulge and the fourth bulge are in contact with the two second narrow surfaces of the second ground terminal, respectively.

4. The backplane connector of claim 1 , wherein the first bulge and the second bulge are formed by stamping the first extension portion, and the third bulge and the fourth bulge are formed by stamping the second extension portion.

5. The backplane connector of claim 4 , wherein a wall thickness of the first bulge, a wall thickness of the second bulge, and a wall thickness of a portion of the first extension portion located between the first bulge and the second bulge are the same; and

wherein a wall thickness of the third bulge, a wall thickness of the fourth bulge, and a wall thickness of a portion of the second extension portion located between the third bulge and the fourth bulge are the same.

6. The backplane connector according to claim 1 , wherein the conductive terminals comprise multiple pairs of differential signal terminals, and each pair of differential signal terminals is located between one first ground terminal and one second ground terminal; and

wherein there are multiple shielding spaces, and two adjacent shielding spaces share one first ground terminal or one second ground terminal.

7. The backplane connector according to claim 1 , wherein there are a plurality of wafers, and the shielding spaces at the same position of two adjacent wafers are staggered.

8. The backplane connector of claim 1 , wherein the conductive terminals are insert-molded with the insulating frame, and the insulating frame defines a hollow portion in which the connection portions of the conductive terminals are partially exposed; and

wherein each conductive terminal comprises a tail portion connected to the connection portion, and the contact portion and the tail portion extend beyond of the insulating frame.

9. The backplane connector according to claim 1 , wherein the first extension portion comprises a first elastic piece located between the first bulge and the second bulge;

wherein the second extension portion comprises a second elastic piece located between the third bulge and the fourth bulge; and

wherein the first elastic piece and the second elastic piece extend into the shielding space.

10. The backplane connector according to claim 9 , wherein the first extension portion comprises two first protruding tabs located at opposite ends of the first elastic piece, and the first elastic piece extends along a direction opposite to extending directions of the first protruding tabs;

the second extension portion comprises two second protruding tabs located at opposite ends of the second elastic piece, and the second elastic piece extends along a direction opposite to extending directions of the second protruding tabs; and

wherein the first protruding tabs and the second protruding tabs protrude along directions away from the shielding space in order to contact adjacent wafers.