Wafer and backplane connector having the wafer

1. A wafer, comprising:

a plurality of conductive terminals, the conductive terminals comprising differential signal terminals, a first ground terminal and a second ground terminal, the differential signal terminals being located between the first ground terminal and the second ground terminal; each conductive terminal comprising a contact portion and a connection portion; and

an insulating frame, at least parts of the connection portions of the conductive terminals being fixed to the insulating frame, the contact portions of the conductive terminals extending beyond the insulating frame;

wherein the connection portions of the differential signal terminals, the connection portion of the first ground terminal and the connection portion of the second ground terminal are located in a first plane; and

wherein the first ground terminal comprises a first torsion portion connecting the connection portion of the first ground terminal and the contact portion of the first ground terminal; the second ground terminal comprises a second torsion portion connecting the connection portion of the second ground terminal and the contact portion of the second ground terminal; the contact portions of the differential signal terminals are located between the contact portion of the first ground terminal and the contact portion of the second ground terminal; and the contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane.

2. The wafer according to claim 1 , wherein the first torsion portion and the second torsion portion are insert-molded with the insulating frame.

3. The wafer according to claim 1 , wherein the contact portion of the first ground terminal and the contact portion of the second ground terminal are parallel; and wherein either a width of the contact portion of the first ground terminal or a width of the contact portion of the second ground terminal is larger than a width of the contact portion of each differential signal terminal.

4. The wafer according to claim 1 , wherein the first ground terminal and the second ground terminal are stamped and twisted from a metal plate; and wherein a thickness of the connection portion of the first ground terminal, a thickness of the contact portion of the first ground terminal, a thickness of the connection portion of the second ground terminal and a thickness of the contact portion of the second ground terminal are the same.

5. The wafer according to claim 1 , further comprising:

a first metal shield comprising a first extension portion located on one side of the contact portions of the conductive terminals; and

a second metal shield comprising a second extension portion located on the other side of the contact portions of the conductive terminals;

wherein the first extension portion comprises a first bulge protruding toward the first ground terminal and a second bulge protruding toward the second ground terminal;

wherein the second extension portion comprises a third bulge protruding toward the first ground terminal and a fourth bulge protruding toward the second ground terminal; and

wherein the first bulge and the third bulge are in contact with opposite side surfaces of the contact portion of the first ground terminal, respectively; the second bulge and the fourth bulge are in contact with opposite side surfaces of the contact portion of the second ground terminal; the first extension portion, the second extension portion, the contact portion of the first ground terminal and the contact portion of the second ground terminal jointly form a shielding space enclosing the contact portions of the differential signal terminals.

6. The wafer according to claim 5 , wherein the first extension portion and/or the second extension portion comprise a limiting structure for limiting the contact portion of the first ground terminal and/or the contact portion of the second ground terminal.

7. The wafer according to claim 6 , wherein the limiting structure comprises a first limiting protrusion disposed on the first extension portion, and the contact portion of the first ground terminal comprises a first limiting slot to mate with the first limiting protrusion;

wherein the limiting structure comprises a second limiting protrusion disposed on the first extension portion, and the contact portion of the second ground terminal comprises a second limiting slot to mate with the second limiting protrusion;

wherein the limiting structure comprises a third limiting protrusion disposed on the second extension portion, and the contact portion of the first ground terminal comprises a third limiting slot to mate with the third limiting protrusion; and

wherein the limiting structure comprises a fourth limiting protrusion disposed on the second extension portion, and the contact portion of the second ground terminal comprises a fourth limiting slot to mate with the fourth limiting protrusion.

8. The wafer according to claim 7 , wherein the first limiting protrusion and the second limiting protrusion form an angle of 45 degrees with respect to a vertical plane; the third limiting protrusion and the fourth limiting protrusion form an angle of 45 degrees with respect to the vertical plane; the first limiting protrusion and the third limiting protrusion are symmetrically disposed on opposite sides of the contact portion of the first ground terminal; and the second limiting protrusion and the fourth limiting protrusion are symmetrically disposed on opposite sides of the contact portion of the second ground terminal.

9. The wafer according to claim 6 , wherein the limiting structure comprises two first clamping blocks disposed on the first extension portion, and the two first clamping blocks form a first clamping groove to limit the contact portion of the first ground terminal in a vertical direction; and

the limiting structure comprises two third clamping blocks disposed on the second extension portion, and the two third clamping blocks form a third clamping groove to limit the contact portion of the first ground terminal in the vertical direction.

10. A backplane connector, comprising:

a plurality of wafers;

a header to install the wafers; and

a spacer combining the wafers into a whole;

each wafer comprising:

a plurality of conductive terminals comprising differential signal terminals, a first ground terminal and a second ground terminal, the differential signal terminals being located between the first ground terminal and the second ground terminal; each conductive terminal comprising a contact portion and a connection portion; and

an insulating frame, at least parts of the connection portions of the conductive terminals being fixed to the insulating frame, the contact portions of the conductive terminals extending beyond the insulating frame;

wherein the connection portions of the differential signal terminals, the connection portion of the first ground terminal and the connection portion of the second ground terminal are located in a first plane; and

wherein the first ground terminal comprises a first torsion portion connecting the connection portion of the first ground terminal and the contact portion of the first ground terminal; the second ground terminal comprises a second torsion portion connecting the connection portion of the second ground terminal and the contact portion of the second ground terminal; the contact portions of the differential signal terminals are located between the contact portion of the first ground terminal and the contact portion of the second ground terminal; and the contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane.