Camera module and imaging apparatus including the same
A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.
1. A camera module comprising:
a substrate;
a first camera disposed on the substrate and configured to generate a first image based on a first optical signal;
a second camera disposed on the substrate and configured to generate a second image based on a second optical signal;
a power management integrated circuit disposed on the substrate, and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera;
a metal fixing member coupled to the first camera and the second camera; and
a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.
2. The camera module of claim 1 , wherein the thermal interface material directly contacts the power management integrated circuit and the metal fixing member.
3. The camera module of claim 1 , wherein a size of the first camera is less than a size of the second camera, and
wherein the power management integrated circuit is disposed on the substrate adjacent to the first camera.
4. The camera module of claim 1 , wherein the power management integrated circuit is disposed on the substrate between the first camera and the second camera.
5. The camera module of claim 1 , wherein the power management integrated circuit is disposed inside a shield can, and the thermal interface material is disposed on and directly contacts the shield can.
6. The camera module of claim 1 , wherein the first camera comprises:
a first lens configured to collect the first optical signal; and
a first image sensor configured to convert the first optical signal into a first image signal,
wherein the second camera comprises:
a second lens configured to collect the second optical signal; and
a second image sensor configured to convert the second optical signal into a second image signal, and
wherein either one or any combination of the first camera and the second camera further comprises an actuator configured to move a corresponding lens.
7. The camera module of claim 6 , further comprising a connector electrically connected to the substrate and configured to receive the external power voltage from the external power supply.
8. The camera module of claim 7 , further comprising a radiation film attached to a lower surface of the substrate and a lower surface of the connector.
9. The camera module of claim 8 , wherein the substrate comprises:
a reference ground wire formed between the power management integrated circuit and the connector;
a first ground wire formed between the first image sensor and the power management integrated circuit;
a second ground wire extending from the first image sensor and connected to a point of the reference ground wire;
a third ground wire formed between the second image sensor and the power management integrated circuit; and
a fourth ground wire extending from the second image sensor and connected to the point of the reference ground wire.
10. The camera module of claim 9 , wherein the second ground wire is connected to the reference ground wire through a resistive element having a zero ohm resistance.
11. A camera module comprising:
a first substrate;
a first camera disposed on the first substrate and configured to generate a first image based on a first optical signal;
a first power management integrated circuit disposed on the first substrate, and configured to generate a first power voltage based on a first external power voltage received from an external power supply and provide the first power voltage to the first camera;
a metal fixing member coupled to the first camera; and
a first thermal interface material disposed between the first power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the first substrate.
12. The camera module of claim 11 , further comprising:
a connector configured to receive the external power supply; and
a connection member connected between the connector and the first substrate; and
a radiation film attached to a lower surface of the first substrate and a lower surface of the connector and extending from the lower surface of the first substrate to the lower surface of the connector.
13. The camera module of claim 11 , further comprising a second camera disposed on the first substrate and configured to generate a second image based on a second optical signal,
wherein the metal fixing member is coupled to the first camera and the second camera.
14. The camera module of claim 13 , further comprising:
a second substrate which is separated from the first substrate; and
a third camera disposed on the second substrate, and configured to generate a third image based on a third optical signal,
wherein the metal fixing member is coupled to the first camera, the second camera, and the third camera.
15. The camera module of claim 11 , further comprising:
a second substrate which is separated from the first substrate; and
a second camera disposed on the second substrate, and configured to generate a second image based on a second optical signal,
wherein the metal fixing member is coupled to the first camera and the second camera.
16. An imaging apparatus comprising:
a first camera module configured to generate a first image;
a power supply configured to provide a power voltage to the first camera module; and
a processor configured to receive the first image from the first camera module,
wherein the first camera module comprises:
a substrate;
a first camera disposed on the substrate and comprising a first lens and a first image sensor;
a connector electrically connected to the substrate and configured to receive the power voltage from the power supply and transmit the first image to the processor;
a power management integrated circuit disposed on the substrate, and configured to generate a plurality of voltages based on the power voltage and provide the plurality of voltages to the first image sensor;
a metal frame surrounding and coupled to the first camera; and
a thermal interface material disposed between the power management integrated circuit and the metal frame along a direction perpendicular to an upper surface of the substrate.
17. The imaging apparatus of claim 16 , wherein the metal frame is configured to couple the first camera module to a main substrate of the imaging apparatus.
18. The imaging apparatus of claim 16 , wherein the thermal interface material directly contacts the power management integrated circuit and the metal frame.
19. The imaging apparatus of claim 16 , wherein the first camera module comprises a plurality of cameras, each of which is disposed on the substrate, and comprises a lens and an image sensor.
20. The imaging apparatus of claim 16 , further comprising:
an optical path folding element configured to change a path of an optical signal;
a second lens configured to collect a refracted optical signal that is refracted by the optical path folding element; and
a second camera module comprising a second image sensor configured to receive the collected optical signal.