Optical transceiver modules and heat management techniques therefor
An I/O connector includes a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body. The I/O connector includes a printed circuit board (PCB) positioned between the first surface and the second surface of the body. The PCB includes a first set of one or more electrical components mounted on a first side of the PCB. A first heatsink is disposed on the first surface. The I/O connector includes first heatpipe thermally coupled with the first heatsink and the first set of one or more electrical components, positioned between the first surface and the first side of the PCB.
1. An input/output (I/O) connector comprising:
a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body;
a printed circuit board (PCB) positioned between the first surface and the second surface of the body, the PCB comprising a first set of one or more electrical components mounted on a first side of the PCB;
a first heatsink disposed on the first surface;
a first heatpipe positioned between the first surface and the first side of the PCB, wherein the first heatpipe is thermally coupled with the first heatsink and the first set of one or more electrical components; and
a second heatpipe positioned between the second surface and a second side of the PCB, wherein the second side of the PCB is opposite to the first side of the PCB, wherein the first heatpipe and the second heatpipe are respectively located at the first side and the second side of the PCB, and a single level of pluggable portion comprising the front end of the body is connected to a cage mounted on the PCB.
2. The I/O connector of claim 1 , wherein the first surface is selected from a top surface and a bottom surface of the body.
3. The I/O connector of claim 1 , further comprising:
a second heatsink disposed on the second surface;
wherein the second heatpipe is thermally coupled with the second heatsink and a second set of one or more electrical components mounted on the second side of the PCB.
4. The I/O connector of claim 1 , further comprising a receiving element positioned within the cable entrance port, the receiving element configured to communicatively couple a cable to the PCB.
5. The I/O connector of claim 1 , wherein the I/O connector is an optical transceiver module.
6. The I/O connector of claim 1 , wherein the I/O connector comprises a pluggable portion comprising the front end of the body and an external portion comprising the rear end of the body.
7. The I/O connector of claim 3 , wherein the first heatsink comprises a first plurality of conductive fins disposed on a portion of the first surface belonging to the external portion of the I/O connector,
the second heatsink comprises a second plurality of conductive fins disposed on a portion of the second surface belonging to the external portion of the I/O connector, and
the first plurality of conductive fins are extending away from the first surface in a first direction, the second plurality of conductive fins are extending away from the second surface in a second direction, and the first direction and the second direction are two opposite directions.
8. The I/O connector of claim 1 , wherein the connector is a Quad Small Form Factor-Double Density (QSFP-DD) transceiver module.
9. The I/O connector of claim 8 , wherein dimensions of a pluggable portion of the connector comply with the QSFP-DD Multi Source Agreement (MSA) specification.
10. A chassis configured to receive one or more I/O connectors of claim 1 , the chassis comprising:
a front panel comprising perforations that allow air to pass through the front panel;
a front upper baffle that extends beyond the front panel at a front end of the chassis;
a front lower baffle that extends beyond the front panel at the front end of the chassis;
an array of one or more port openings in the front panel configured to receive one or more I/O connectors of claim 1 such that the first heatsink of the one or more I/O connectors are positioned beyond the front panel and between the front upper baffle and the front lower baffle;
a set of one or more fan mounts configured to receive a set of one or more fans that, when powered, cause an airflow from between front end of the chassis toward a rear end of the chassis, wherein the front upper baffle and the front lower baffle direct the airflow over the first heatsink of the one or more I/O connectors.
11. An optical transceiver module comprising:
a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body;
a printed circuit board (PCB) positioned between the first surface and the second surface of the body, the PCB comprising an edge connector extending from the front end of the body;
a first heatpipe positioned between the first surface and a first side of the PCB;
a second heatpipe positioned between the second surface and a second side of the PCB, wherein the second side of the PCB is opposite to the first side of the PCB, wherein the first heatpipe and the second heatpipe are respectively located at the first side and the second side of the PCB;
a pluggable portion comprising the front end of the body, the pluggable portion configured to seat within a cage defined by a standard specification, wherein the pluggable portion is a single level pluggable portion connected to the cage;
an external portion comprising the rear end of the body;
a first heatsink disposed on the first surface, the first heatsink comprising a first plurality of conductive fins disposed on a section of the first surface belonging to the external portion.
12. The optical transceiver module of claim 11 , wherein the first surface is selected from a top surface and a bottom surface of the body.
13. The optical transceiver module of claim 11 , wherein when the optical transceiver module is seated within the cage, the first plurality of conductive fins do not seat within the cage.
14. The optical transceiver module of claim 11 , wherein dimensions of the pluggable portion of the optical transceiver module comply with the standard specification.
15. The optical transceiver module of claim 11 , wherein a length of the external portion of the optical transceiver module is longer than specified by the standard specification.
16. The optical transceiver module of claim 15 , wherein a width and a height of the external portion of the optical transceiver module complies with the standard specification.
17. The optical transceiver module of claim 11 , wherein the standard specification is the Quad Small Form Factor-Double Density (QSFP-DD) Multi Source Agreement (MSA) specification.
18. The optical transceiver module of claim 11 , further comprising:
a second heatsink disposed on the second surface, the second heatsink comprising a second plurality of conductive fins disposed on a section of the second surface belonging to the external portion;
the first plurality of conductive fins are extending away from the first surface in a first direction, the second plurality of conductive fins are extending away from the second surface in a second direction, and the first direction and the second direction are two opposite directions.
19. The optical transceiver module of claim 11 ,
wherein the first heatpipe is thermally coupled with the first heatsink and a first set of one or more electrical components mounted on the first side of the PCB.
20. A chassis configured to receive one or more optical transceiver modules of claim 11 , the chassis comprising:
a front panel comprising perforations that allow air to pass through the front panel;
a front upper baffle that extends beyond the front panel at a front end of the chassis;
a front lower baffle that extends beyond the front panel at the front end of the chassis;
an array of one or more port openings in the front panel configured to receive one or more optical transceiver modules of claim 11 such that the first heatsink of the one or more of optical transceiver modules are positioned beyond the front panel and between the front upper baffle and the front lower baffle;
a set of one or more fan mounts configured to receive a set of one or more fans that, when powered, cause an airflow between the front end of the chassis toward a rear end of the chassis wherein the front upper baffle and the front lower baffle direct the airflow over the first heatsink of the one or more optical transceiver modules.