FLEXIBLE SUBSTRATE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21 , conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
1 - 10 . (canceled)
11 . An electronic device, comprising:
first and second flexible substrates, each substrate comprising:
a flexible base;
a conductive wiring formed on the flexible base and comprising a conductive organic compound; and
an electronic element connected to the conductive wiring,
wherein a first part of the conductive wiring of the first flexible substrate is in direct contact and united with a first part of the conductive wiring of the second flexible substrate to form a first connection part so that the first flexible substrate and the second flexible substrate are electrically and mechanically connected to each other via the first connection part.
12 . The electronic device according to claim 11 , wherein the conductive wirings of the first and the second substrates comprise a conductive polymer material having conductivity itself.
13 . The electronic device according to claim 12 , wherein the conductive wirings of the first and the second substrates comprise, as a main component, any one of polythiophene, polyaniline, polypyrrole and polyacetylene, or a derivative of any one of these.
14 . The electronic device according to claim 11 , wherein the conductive wirings of the first and the second substrates comprise a composite material in which conductive particles are dispersed in a polymeric binder.
15 . The electronic device according to claim 11 , wherein the electronic element comprises an organic material, and each of the first and second flexible substrate as a whole including the electronic element and the first connection part has flexibility.