Isolation regions including two layers and method forming same
A method includes etching a semiconductor substrate to form trenches extending into the semiconductor substrate, and depositing a first dielectric layer into the trenches. The first dielectric layer fills lower portions of the trenches. A Ultra-Violet (UV) treatment is performed on the first dielectric layer in an oxygen-containing process gas. The method further includes depositing a second dielectric layer into the trenches. The second dielectric layer fills upper portions of the trenches. A thermal treatment is performed on the second dielectric layer in an additional oxygen-containing process gas. After the thermal treatment, an anneal is performed on the first dielectric layer and the second dielectric layer.
1. A method comprising:
etching a semiconductor substrate to form a first trench and a second trench in the semiconductor substrate;
forming a first shallow trench isolation (STI) region in the first trench, wherein the forming the first STI region comprises:
forming a first dielectric layer;
forming a second dielectric layer over the first dielectric layer; and
etching the first STI region, until topmost surfaces of both of the first dielectric layer and the second dielectric layer are lower than a top surface of a portion of the semiconductor substrate that adjoins the first STI region, wherein the portion of the semiconductor substrate adjoining the STI region comprises semiconductor materials continuously extending from the top surface of the portion of the semiconductor substrate to a bottom level of the first trench, and wherein in the etching, both of the first dielectric layer and the second dielectric layer are etched simultaneously by a same etching chemical, and the second dielectric layer has a higher etching rate than the first dielectric layer.
2. The method of claim 1 , wherein the forming the first dielectric layer comprises a chemical vapor deposition process or an atomic layer deposition process, and the forming the second dielectric layer comprises a flowable chemical vapor deposition process.
3. The method of claim 1 , wherein both of the forming the first dielectric layer and the forming the second dielectric layer comprise flowable chemical vapor deposition processes.
4. The method of claim 3 , wherein the forming the first dielectric layer and the forming the second dielectric layer are performed using a same precursor, and different curing methods.
5. The method of claim 4 , wherein the forming the first dielectric layer comprises a first curing process using Ultra Violet (UV) light, and the forming the second dielectric layer comprises a second curing process without using Ultra Violet (UV) light.
6. The method of claim 1 , wherein the forming the first dielectric layer and the forming the second dielectric layer are performed using different precursors.
7. The method of claim 1 , wherein the first dielectric layer comprises a recess therein, and the second dielectric layer fills the recess.
8. The method of claim 1 further comprising forming a second STI region in the semiconductor substrate, wherein the forming the second STI region comprises:
forming a third dielectric layer, wherein the first dielectric layer and the second dielectric layer are formed in first common processes;
forming a fourth dielectric layer, wherein the second dielectric layer and the fourth dielectric layer are formed in second common processes; and
performing an etching process to recess the first STI region and the second STI region, wherein when the etching process is stopped, the second dielectric layer is fully removed, and a portion of the fourth dielectric layer remains.
9. The method of claim 8 further comprising:
forming a first gate stack extending on the first STI region and a first semiconductor region on a side of the first STI region; and
forming a second gate stack extending on the second STI region and a second semiconductor region on a side of the second STI region.
10. The method of claim 1 , wherein the first dielectric layer has more Si—O bonds than the second dielectric layer, and the second dielectric layer has more Si—N bonds than the first dielectric layer.
11. The method of claim 1 , wherein before the first STI region is etched, the topmost surfaces of both of the first dielectric layer and the second dielectric layer are higher than the top surface of a portion of the semiconductor substrate.
12. The method of claim 1 further comprising continuing etching the first STI region to fully remove the second dielectric layer in the first STI region.
13. A method comprising:
etching a semiconductor substrate to form trenches in the semiconductor substrate;
depositing a plurality of dielectric layers into the trenches, wherein the plurality of dielectric layers fill the trenches to form a first shallow trench isolation (STI) region and a second STI region, and wherein the plurality of dielectric layers comprise:
a liner dielectric layer contacting the semiconductor substrate;
a first dielectric layer over the liner dielectric layer; and
a second dielectric layer over the first dielectric layer;
recessing the first STI region and the second STI region simultaneously, wherein after the recessing, the second dielectric layer is fully removed from the first STI region, and a portion of the second dielectric layer is left in the second STI region;
forming a first gate stack over and contacting the first STI region and a first protruding semiconductor fin aside of the first STI region; and
forming a second gate stack over and contacting the second STI region and a second protruding semiconductor fin aside of the second STI region.
14. The method of claim 13 , wherein the forming the plurality of dielectric layers comprise:
depositing the first dielectric layer;
performing a first post treatment process on the first dielectric layer;
after the first post treatment process, depositing the second dielectric layer over the first dielectric layer; and
performing a second post treatment process on the second dielectric layer.
15. The method of claim 14 further comprising:
after the second post treatment process, performing an annealing process on both of the first dielectric layer and the second dielectric layer.
16. The method of claim 13 , wherein the first dielectric layer has more Si—O bonds than the second dielectric layer.
17. The method of claim 13 , wherein the second dielectric layer has more Si—N bonds than the first dielectric layer.
18. A method comprising:
etching a semiconductor substrate to form a trench extending into the semiconductor substrate;
depositing a first dielectric layer into the trench using first precursors;
performing a first curing process on the first dielectric layer using a first process condition;
after the first curing process, depositing a second dielectric layer into the trench using second precursors same as the first precursors, wherein the second dielectric layer is over the first dielectric layer;
performing a second curing process on the second dielectric layer using a second process condition different from the first process condition;
after the second curing process, performing an annealing process on both of the first dielectric layer and the second dielectric layer using oxygen (O 2 ) as a process gas; and
performing a recessing process, wherein both of the first dielectric layer and the second dielectric layer are recessed in the recessing process, and wherein during the recessing process, the second dielectric layer has a higher etching rate than the first dielectric layer.
19. The method of claim 18 , wherein the first process condition comprises UV light, and the second process condition is free from UV light.
20. The method of claim 18 , wherein the first curing process and the second curing process result in the first dielectric layer to have more Si—O bonds than the second dielectric layer, and the second dielectric layer to have more Si—N bonds than the first dielectric layer.