Ultrasound imaging probe with improved heat dissipation
An ultrasound imaging device or probe includes a tip having a heat conducting exterior housing within which an imaging element is positioned. The imaging element is engaged with a heat sink formed of an electrically insulating material that also has high thermal conductivity. The heat sink contacts and extends through and electrically insulating enclosure within which the imaging element is disposed. As a result, the heat generated by the imaging element can be readily conducted to the ambient environment via the heat sink and heat conductive exterior housing while also enabling the imaging element and other electrical components to be electrically insulated from the housing.
1. An ultrasound imaging probe comprising:
an imaging element comprising:
a transducer element; and
a heat sink operably engaged with the transducer element, the heat sink formed of an electrically insulating and heat conductive material;
an electrically insulating enclosure disposed around the imaging element and including an insulating body in which the imaging element is disposed, the insulating body having a first recess formed therein; and
a housing disposed around the electrically insulating enclosure,
wherein a portion of the heat sink extends through the electrically insulating enclosure into contact with the housing, and
wherein the portion of the heat sink directly engages the electrically insulating enclosure within the first recess formed in the insulating body.
2. The ultrasound imaging probe of claim 1 , wherein the heat sink is formed of a ceramic material with a thermal conductivity of at least 2.0 watts/meter·Kelvin.
3. The ultrasound imaging probe of claim 2 , wherein the ceramic material is selected from a group consisting of aluminum nitride, silicon nitride and silicon carbide.
4. The ultrasound imaging probe of claim 2 , wherein the imaging element further comprises a heat conductive acoustic backing layer between the transducer element and the heat sink.
5. The ultrasound imaging probe of claim 1 , wherein the electrically insulating enclosure comprises
a cover secured to the insulating body over the imaging element, the cover including a second recess aligned with the first recess to define an opening in the electrically insulating enclosure,
wherein the portion of the heat sink is positioned in engagement with the insulating body and the cover within the opening.
6. The ultrasound imaging probe of claim 1 , wherein the housing is at least partially formed of a material with a thermal conductivity of at least 2.0 W/(mK).
7. The ultrasound imaging probe of claim 6 , wherein the housing is formed of a metal.
8. The ultrasound imaging probe of claim 1 , wherein the ultrasound imaging probe is an interventional ultrasound imaging probe.
9. The ultrasound imaging probe of claim 8 , wherein the interventional ultrasound imaging probe is a transesophageal echocardiography probe.
10. The ultrasound imaging probe of claim 1 , wherein the ultrasound imaging probe is a non-interventional ultrasound imaging probe.
11. The ultrasound imaging probe of claim 10 , wherein the non-interventional ultrasound imaging probe is a transthoracic echocardiography probe.
12. An ultrasound imaging probe comprising:
an imaging element;
an electrically insulating enclosure disposed around the imaging element, the electrically insulating enclosure including an insulating body in which the imaging element is disposed, the insulating body having a recess formed therein, and a heat sink operably engaged with the imaging element, the heat sink formed of an electric insulating and heat conductive material; and
a heat conductive housing disposed around the electrically insulating enclosure and in contact with the heat sink,
wherein a portion of the heat sink extends through the electrically insulating enclosure into contact with the housing, and
wherein the portion of the heat sink directly engages the electrically insulating enclosure within the recess in the insulating body.
13. The ultrasound imaging probe of claim 12 , wherein the heat conductive housing is formed of a metal.
14. The ultrasound imaging probe of claim 12 , wherein the heat sink is formed of a ceramic material with a thermal conductivity of at least 2.0 W/(mK).
15. The ultrasound imaging probe of claim 12 , wherein the ceramic material is selected from the group consisting of aluminum nitride, silicon nitride and silicon carbide.
16. An ultrasound imaging system comprising:
a processing unit configured to receive and process acquired ultrasound image data to create ultrasound images derived from the ultrasound image data;
a display operably connected to the processing unit to present the created ultrasound images to a user; and
an ultrasound imaging probe operably connected to the processing unit to obtain the ultrasound image data, the ultrasound imaging probe comprising:
an imaging element including:
a transducer element; and
a heat sink operably engaged with the transducer element, the heat sink formed of an electrically insulating and heat conductive material;
an electrically insulating enclosure disposed around the imaging element and including an insulating body in which the imaging element is disposed, the insulating body having an opening formed therein; and
a heat conductive housing disposed around the electrically insulating enclosure, wherein a side of the heat sink is engaged by and extends through the opening in the insulating body of the electrically insulating enclosure into contact with the housing.
17. The ultrasound imaging system of claim 16 , wherein the heat sink is formed of a ceramic material.
18. The ultrasound imaging probe of claim 16 , wherein the side of the heat sink directly engages the insulating enclosure.