FinFET device and method
A semiconductor device includes a fin extending from a substrate, a gate stack over and along a sidewall of the fin, a spacer along a first sidewall of the gate stack and the sidewall of the fin, a dummy gate material along the sidewall of the fin, wherein the dummy gate material is between the spacer and the gate stack, and a first epitaxial source/drain region in the fin and adjacent the gate stack.
1. A semiconductor device, comprising:
a fin extending from a substrate;
a gate stack over a top and along a sidewall of the fin;
a spacer along a first sidewall of the gate stack and the sidewall of the fin;
a dummy gate material along the sidewall of the fin, wherein the dummy gate material and the spacer are different layers, wherein the dummy gate material is between the spacer and the gate stack; and
a first epitaxial source/drain region in the fin and adjacent the gate stack.
2. The semiconductor device of claim 1 , wherein the dummy gate material is between the first epitaxial source/drain region and the gate stack.
3. The semiconductor device of claim 1 , wherein the dummy gate material comprises silicon oxide.
4. The semiconductor device of claim 1 , wherein the gate stack comprises a second sidewall that extends along the dummy gate material at an angle that is between 20 degrees and 60 degrees with respect to the sidewall of the fin.
5. The semiconductor device of claim 1 , wherein an upper surface of the fin is free of the dummy gate material.
6. The semiconductor device of claim 1 , further comprising a dummy gate dielectric material interposed between the dummy gate material and the fin.
7. The semiconductor device of claim 1 , wherein a first portion of the dummy gate material that is adjacent the fin has a first width and wherein a second portion of the dummy gate material that is away from the fin has a second width that is smaller than the first width.
8. A semiconductor device, comprising:
a fin extending from a substrate;
an isolation region along a sidewall of the fin, the fin protruding above the isolation region;
a gate structure over the fin and an upper surface of the isolation region, the gate structure extending along a sidewall of the fin;
a spacer along a first sidewall of the gate structure, the spacer contacting the gate structure;
a corner feature along the sidewall of the fin, wherein the corner feature is a different layer than the spacer, wherein the corner feature is between the spacer and the gate structure along a sidewall of the fin; and
a source/drain region in the fin and adjacent the gate structure.
9. The semiconductor device of claim 8 , wherein the spacer comprises a gate seal spacer on the fin and a first spacer on the gate seal spacer.
10. The semiconductor device of claim 8 , further comprising a dielectric layer extending along the sidewall of the fin from the gate structure to the source/drain region, wherein the dielectric layer separates the corner feature from the sidewall of the fin.
11. The semiconductor device of claim 8 , wherein an interface between the gate structure and the corner feature is curved.
12. The semiconductor device of claim 8 , wherein a width of the gate structure adjacent the sidewall of the fin is less than a width of the gate structure further away from the sidewall of the fin.
13. The semiconductor device of claim 8 , wherein the source/drain region comprises an epitaxial region, wherein a closest distance between the epitaxial region and the corner feature is less than a closest distance between the epitaxial region and the gate structure.
14. A semiconductor device, comprising:
a fin extending from a substrate;
an isolation region along a sidewall of the fin, the fin extending higher than an upper surface of the isolation region;
a gate structure over the fin and an upper surface of the isolation region, the gate structure comprising a gate dielectric layer and a gate electrode;
a spacer structure contacting a first sidewall of the gate structure;
a corner feature along the sidewall of the fin, wherein the corner feature is a separate element from the spacer structure, wherein the corner feature separates the gate structure from the spacer structure at a sidewall of the fin, wherein a width of the gate structure widens as the gate structure extends away from the sidewall of the fin; and
an epitaxial source/drain region adjacent the gate structure.
15. The semiconductor device of claim 14 , further comprising a dielectric layer interposed between the corner feature and the fin.
16. The semiconductor device of claim 15 , wherein the spacer structure comprises a gate seal spacer and a first spacer, wherein the gate seal spacer is interposed between the first spacer and the gate structure, wherein the gate seal spacer and the first spacer contacts the dielectric layer.
17. The semiconductor device of claim 16 , wherein the first spacer contacts the epitaxial source/drain region.
18. The semiconductor device of claim 15 , wherein the dielectric layer is wider than the corner feature along the sidewall of the fin.
19. The semiconductor device of claim 14 , wherein a width of the corner feature measured parallel to the sidewall of the fin is between 2 nm and 30 nm.
20. The semiconductor device of claim 19 , wherein a thickness of the corner feature measured perpendicular to the sidewall of the fin is between 2 nm and 20 nm.