IP Library Granted Patent US 11,948,724
Granted Patent B2
US 11,948,724 · App. 17/351,782 · Granted Apr 2, 2024

Method for making a multi-thickness electro-magnetic device

Inventors: Benjamin Hanson (Yankton, SD); Rodney Brune (Columbus, NE); Matt Huber (Yankton, SD)
Assignee: VISHAY DALE ELECTRONICS, LLC
H01F27/2852H01F41/0246H01F41/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,948,724
App. No.
17/351,782
Granted
Apr 2, 2024
Kind
B2
Abstract

Electro-magnetic devices are provided, having conductive elements and leads of multiple thicknesses. Templates are provided for making electro-magnetic devices, formed by an extrusion process, a skiving process, a swaging process, 3D printing, or a machining process. The multi-thickness electro-magnetic devices may comprise a conductive element having an increased thickness area, and one or more leads having at least one decreased thickness area, having a thickness less than the increased thickness area. An electro-magnetic device may be provided comprising a conductive element having an increased thickness encased in a body formed from a core material, and leads or lead portions connected to the conductive element having a decreased thickness.

Claims (34)

1. A method for making a multi-thickness electro-magnetic device comprising the steps of:

providing a conductive material;

forming the conductive material into a multi-thickness sheet by performing an extrusion process, a skiving process, or a flattening process, the multi-thickness sheet comprising a first portion having a first thickness, a second portion having a second thickness, and a third portion have a third thickness; and

forming a multi-thickness template by:

forming the first portion of the multi-thickness sheet into a conductive element,

forming the second portion of the multi-thickness sheet into a first lead portion, and

forming the third portion of the multi-thickness sheet into a second lead portion;

wherein the first thickness is greater than the second thickness, and

wherein the first thickness is greater than the third thickness.

2. The method of claim 1 , wherein at least a portion of the multi-thickness template is formed by stamping the multi-thickness sheet.

3. The method of claim 1 , wherein the conductive element has a serpentine shape, a rectangular shape, an I-shape, an H-shape, or a barbell shape.

4. The method of claim 1 , wherein the conductive element, the first lead portion, and the second lead portion are formed from a continuous, non-wound piece of conductive material.

5. The method of claim 1 , wherein no portion of the conductive element crosses over or under another portion of the conductive element.

6. The method of claim 1 , wherein the first lead portion has a thickness that is uniform along substantially an entire length of the first lead portion, and the second lead portion has a thickness that is uniform along substantially an entire length of the second lead portion.

7. The method of claim 1 , wherein the first lead portion has a first width adjacent the conductive element and a second width at an end of the first lead portion, and wherein the second width is different than the first width.

8. The method of claim 1 , wherein the second lead portion has a first width adjacent the conductive element and a second width at an end of the second lead portion, and wherein the second width is greater than the first width.

9. A method for making an electro-magnetic device comprising the steps of:

providing a conductive material;

forming the conductive material into a multi-thickness sheet, the multi-thickness sheet comprising a first portion for forming a conductive element having a first thickness, a second portion for forming a first lead portion having a second thickness, and a third portion for forming a second lead portion having a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness;

forming a multi-thickness template by:

forming the first portion of the multi-thickness sheet into the conductive element,

forming the second portion of the multi-thickness sheet into the first lead portion, and

forming the third portion of the multi-thickness sheet into the second lead portion; and

pressing a core material around the conductive element and at least a portion of the first lead portion and at least a portion of the second lead portion to form a body.

10. The method of claim 9 , further comprising the steps of trimming the first lead portion and trimming the second lead portion.

11. The method of claim 10 , further comprising the steps of positioning at least a portion of the first lead portion along an outer surface of the body and extending at least a portion of the first lead portion along a bottom surface of the body, and further comprising the steps of positioning at least a portion of the second lead portion along an outer surface of the body and extending at least a portion of the second lead portion along a bottom surface of the body.

12. The method of claim 9 , wherein the step of forming the conductive material into a multi-thickness sheet comprises performing an extrusion process.

13. The method of claim 9 , wherein the step of forming the conductive material into a multi-thickness sheet comprises performing a skiving process.

14. The method of claim 9 , wherein the step of forming the conductive material into a multi-thickness sheet comprises performing a flattening process.

15. The method of claim 9 , wherein the step of forming the multi-thickness template comprises stamping the multi-thickness sheet to form the conductive element, the first lead portion, and the second lead portion.

16. The method of claim 9 , wherein the conductive element has a serpentine shape, a rectangular shape, an I-shape, an H-shape, or a barbell shape.

17. The method of claim 9 , wherein the conductive element, first lead portion, and second lead portion are formed from a continuous, non-wound piece of conductive material.

18. The method of claim 9 , wherein no portion of the conductive element crosses over or under another portion of the conductive element.

19. The method of claim 9 , further comprising the step of plating the multi-thickness sheet or the multi-thickness template with a layer of nickel or a layer of tin.

Assignments (2)
SECURITY INTEREST Recorded Sep 16, 2025
From: VISHAY DALE ELECTRONICS, INC. (N/K/A VISHAY DALE ELECTRONICS, LLC); VISHAY-SILICONIX (N/K/A SILICONIX INCORPORATED); VISHAY GENERAL SEMICONDUCTOR INC. (N/K/A VISHAY GSI, INC.); VISHAY GENERAL SEMICONDUCTOR, LLC (N/K/A VISHAY GSI, INC.); VISHAY INTERTECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 072272/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2022
From: HANSON, BENJAMIN; BRUNE, RODNEY; HUBER, MATT
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 060185/0607 →