IP Library Assignment 072272/0193
Patent Assignment
Reel/Frame 072272/0193

Security Interest

Recorded: 2025-09-16 Pages: 13
Assignors
VISHAY INTERTECHNOLOGY, INC.
Executed: 2025-09-08
Assignee
JPMORGAN CHASE BANK, N.A.
IL-1-1145/54/63, P.O. BOX 6026, CHICAGO, ILLINOIS, 60603-6026
Covered Properties (37)
Lightning Protection Device: Wet/Dry Field Sensitive Air Terminal
Patent: 7,960,647 →
Application: 12/377,754 →
Publication: US 2010/0236808
Transistor Structure with Feed-Through Source-to-Substrate Contact
Patent: 8,604,525 →
Application: 12/917,172 →
Publication: US 2011/0266620
Sulfuration Resistant Chip Resistor and Method for Making Same
Patent: 8,514,051 →
Application: 13/185,065 →
Publication: US 2012/0126934
Semiconductor Device Having Reduced Gate Charges and Superior Figure of Merit
Application: 13/475,255 →
Publication: US 2012/0292696
Adaptive Charge Balanced Edge Termination
Patent: 9,842,911 →
Application: 13/484,114 →
Publication: US 2013/0320462
Trench-Based Device with Improved Trench Protection
Patent: 9,018,698 →
Application: 13/678,571 →
Publication: US 2014/0138764
Sulfuration Resistant Chip Resistor and Method for Making Same
Patent: 8,957,756 →
Application: 13/970,011 →
Publication: US 2013/0335191
GaN-BASED SCHOTTKY DIODE HAVING LARGE BOND PADS AND REDUCED CONTACT RESISTANCE
Patent: 9,281,417 →
Application: 14/627,013 →
Structures and Methods of Fabricating Dual Gate Devices
Application: 15/387,378 →
Publication: US 2017/0104096
Vertical Sense Devices in Vertical Trench Mosfet
Application: 15/634,739 →
Publication: US 2017/0299639
Vertical Sense Devices in Vertical Trench Mosfet
Application: 15/634,901 →
Publication: US 2017/0322239
Current Limiting Systems and Methods
Application: 15/786,437 →
Publication: US 2018/0233904
Virtual Wafer Techniques for Fabricating Semiconductor Devices
Application: 16/372,381 →
Publication: US 2020/0312657
Trench Mosfet with Self-Aligned Body Contact with Spacer
Application: 16/375,222 →
Publication: US 2019/0237403
Semiconductor Device Having Multiple Gate Pads
Application: 16/379,609 →
Publication: US 2019/0237458
Transistors with Electrically Active Chip Seal Ring and Methods of Manufacture
Application: 16/406,437 →
Publication: US 2020/0357755
High-Electron-Mobility Transistor with Buried Interconnect
Application: 16/450,513 →
Publication: US 2019/0312137
Termination for Vertical Trench Shielded Devices
Application: 16/532,001 →
Publication: US 2021/0043741
Semiconductor Device with Multiple Independent Gates
Application: 16/569,572 →
Publication: US 2021/0083660
Surface Mount Resistors and Methods of Manufacturing Same
Application: 16/572,052 →
Publication: US 2020/0185131
Resistor with Upper Surface Heat Dissipation
Application: 16/594,775 →
Publication: US 2020/0152361
Method of Making a Shielded Inductor
Application: 16/600,128 →
Publication: US 2020/0111594
Vertical Sense Devices in Vertical Trench Mosfet
Application: 16/717,802 →
Publication: US 2020/0124645
Optoelectronic Device Arranged as a Multi-Spectral Light Sensor Having a Photodiode Array with Aligned Light Blocking Layers and N-Well Regions
Application: 17/012,683 →
Publication: US 2020/0403013
Resistor with Temperature Coefficient of Resistance (Tcr) Compensation
Application: 17/063,235 →
Publication: US 2021/0020339
Inductor Having High Current Coil with Low Direct Current Resistance
Application: 17/106,718 →
Publication: US 2021/0193360
Methods of Manufacture of Termination for Vertical Trench Shielded Devices
Application: 17/203,546 →
Publication: US 2021/0210607
Nested Flat Wound Coils Forming Windings for Transformers and Inductors
Application: 17/306,476 →
Publication: US 2021/0358680
Resistors, Current Sense Resistors, Battery Shunts, Shunt Resistors, and Methods of Making
Application: 17/317,233 →
Publication: US 2022/0057436
Method for Making a Multi-Thickness Electro-Magnetic Device
Application: 17/351,782 →
Publication: US 2022/0406517
Semiconductor Device with Multiple Independent Gates
Application: 17/561,046 →
Publication: US 2022/0123740
Transformer Inductor Combination Device
Application: 17/831,778 →
Publication: US 2022/0293328
Method of Assembling a Combined Transformer/Inductor Device
Application: 18/110,039 →
Publication: US 2023/0197330
Resistor with Temperature Coefficient of Resistance (Tcr) Compensation
Application: 18/158,289 →
Publication: US 2023/0343495
Inductor Package
Patent: 1,034,462 →
Application: 29/772,318 →
Resistor
Patent: 1,069,711 →
Application: 29/783,076 →
Electro-Magnetic Device
Patent: 1,094,325 →
Application: 29/804,957 →
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 1, 2010
From: TERRILL, KYLE
To: VISHAY-SILICONIX
Reel/Frame 025229/0155 →
Assignment of Assignor's Interest May 18, 2012
From: TERILL, KYLE
To: VISHAY-SILICONIX
Reel/Frame 028234/0014 →
Assignment of Assignor's Interest May 30, 2012
From: PATTANAYAK, DEVA N.
To: VISHAY-SILICONIX
Reel/Frame 028292/0157 →
Assignment of Assignor's Interest Dec 8, 2012
From: HSU, CHIH WEI; CHEN, MAX
To: VISHAY GENERAL SEMICONDUCTOR LLC
Reel/Frame 029431/0125 →
Security Agreement Sep 5, 2013
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031170/0001 →
Assignment of Assignor's Interest Sep 12, 2013
From: TIPIRNENI, NAVEEN
To: VISHAY-SILICONIX
Reel/Frame 031196/0015 →
Assignment of Assignor's Interest Apr 6, 2015
From: PARK, CHANHO
To: VISHAY-SILICONIX
Reel/Frame 035370/0989 →
Assignment of Assignor's Interest Sep 25, 2015
From: LIN, YIH-YIN
To: VISHAY GENERAL SEMICONDUCTOR LLC
Reel/Frame 036657/0552 →
Assignment of Assignor's Interest Apr 1, 2019
From: SHIBIB, M. AYMAN; TERRILL, KYLE
To: SILICONIX INCORPORATED
Reel/Frame 048760/0470 →
Assignment of Assignor's Interest May 8, 2019
From: SHIBIB, M. AYMAN; TERRILL, KYLE
To: SILICONIX INCORPORATED
Reel/Frame 049115/0213 →
Security Interest Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049785/0771 →