Optoelectronic device arranged as a multi-spectral light sensor having a photodiode array with aligned light blocking layers and n-well regions
An optoelectronic device is disclosed, comprising: a photodiode array including a plurality of first photodiodes, each first photodiode including a respective n+ region and a respective n-well region; a guide array disposed over the photodiode array, the guide array including a plurality of guide members separated from one another by a layer of light-blocking material, the guide members being aligned with the n+ regions of the first photodiodes, such that each guide member is disposed over a different respective n+ region, and the layer of light-blocking material being aligned with the n-well regions of the first photodiodes; and a filter array disposed over the guide array, the filter array including a plurality of bandpass filters, each bandpass filter being aligned with a different one of the plurality of guide members, each bandpass filter having a different transmission band.
1. A method for manufacturing an optoelectronic device, comprising:
forming a first layer of light-transmissive material over a photodiode array, the photodiode array including a plurality of photodiodes, each photodiode having a respective n-well region;
forming a plurality of first trenches in the first layer of light-transmissive material;
forming a layer of light-blocking material in the plurality of first trenches;
forming a first metal layer over the first layer of light-transmissive material and the layer of light-blocking material;
forming a second layer of light-transmissive material over the first metal layer;
forming a plurality of second trenches in the second layer of light-transmissive material, each of the second trenches having a different depth;
forming a respective second metal layer in each of the plurality of second trenches; and
filling each of the second trenches with a light-transmissive material after the respective second trench's respective second metal layer is formed in the second trench.
2. The method of claim 1 , further comprising forming processing circuitry for processing one or more signals that are generated by the photodiode array, wherein the processing circuitry is formed on a same die as the photodiode array and the layer of light-blocking material is formed simultaneously with back end of line (BEOL) metallization that is performed on the processing circuitry.
3. The method of claim 2 , wherein the processing circuitry includes at least one of complementary metal-oxide-semiconductor (CMOS) circuitry and bipolar complementary metal-oxide-semiconductor (BiCMOS) circuitry.
4. The method of claim 2 , wherein the processing circuitry includes at least one of a switch, an analog-to-digital converter, an amplifier, a processor, and an input-output interface.
5. The method of claim 1 , wherein the plurality of first trenches define a plurality of guide members.
6. The method of claim 5 , wherein each photodiode of the plurality of photodiodes has a respective n+ region, and wherein each guide member of the plurality of guide members is aligned with the n+ region of a respective photodiode of the plurality of photodiodes.
7. The method of claim 6 , wherein each guide member is disposed over a different respective n+ region.
8. The method of claim 5 , wherein the layer of light-blocking material is formed so as to separate adjacent guide members of the plurality of guide members from each other.
9. The method of claim 1 , wherein the respective layer of light-blocking material is formed so as to be disposed over and substantially cover an entirety of an upper surface of the respective n-well region of the plurality of photodiodes.