IP Library Assignment 049785/0771
Patent Assignment
Reel/Frame 049785/0771

Release of Security Interest

Recorded: 2019-07-17 Pages: 83
Assignor
Assignees
VISHAY DALE ELECTRONICS, INC.
1122 23RD STREET, COLUMBUS, NEBRASKA, 68601-3647
VISHAY INTERTECHNOLOGY, INC.
63 LANCASTER AVENUE, MALVERN, PENNSYLVANIA, 19355
SILICONIX INCORPORATED
2585 JUNCTION AVENUE, SAN JOSE, CALIFORNIA, 95134
Covered Properties (45)
Gas-Based Substrate Deposition Protection
Patent: 5,925,411 →
Application: 08/487,789 →
Narrow Semiconductor Trench Structure
Patent: 9,685,524 →
Application: 11/373,630 →
Publication: US 2007/0048966
Complete Power Management System Implemented in a Single Surface Mount Package
Patent: 9,093,359 →
Application: 11/479,619 →
Publication: US 2007/0063340
Chip-Scale Schottky Device
Patent: 8,921,969 →
Application: 11/582,755 →
Publication: US 2007/0034984
High Mobility Power Metal-Oxide Semiconductor Field-Effect Transistors
Patent: 9,425,043 →
Application: 11/644,553 →
Publication: US 2007/0262360
High-Density Power Mosfet with Planarized Metalization
Patent: 9,437,729 →
Application: 11/651,258 →
Publication: US 2008/0164515
Ceramic Dielectric Formulation for Broad Band Uhf Antenna
Patent: 7,907,090 →
Application: 11/759,523 →
Publication: US 2008/0303720
High Powered Inductors Using a Magnetic Bias
Patent: 8,004,379 →
Application: 12/134,240 →
Publication: US 2009/0066454
Power Resistor
Patent: 8,319,598 →
Application: 12/950,177 →
Publication: US 2011/0063071
Precision High-Frequency Capacitor Formed on Semiconductor Substrate
Patent: 8,324,711 →
Application: 13/075,752 →
Publication: US 2011/0176247
Highly Coupled Inductor
Patent: 8,258,907 →
Application: 13/096,715 →
Publication: US 2011/0197433
Method for Making a High Current Low Profile Inductor
Application: 13/109,576 →
Publication: US 2012/0086535
Four-Terminal Resistor with Four Resistors and Adjustable Temperature Coefficient of Resistance
Patent: 8,581,687 →
Application: 13/127,838 →
Publication: US 2011/0260826
Inductor with Thermally Stable Resistance
Patent: 8,378,772 →
Application: 13/198,274 →
Publication: US 2012/0139685
High Powered Inductors Using a Magnetic Bias
Application: 13/213,877 →
Publication: US 2011/0298572
Flux Transfer Device
Patent: 8,344,843 →
Application: 13/223,894 →
Publication: US 2012/0062352
Dual Lead Frame Semiconductor Package and Method of Manufacture
Patent: 8,822,273 →
Application: 13/229,667 →
Publication: US 2012/0112331
Trench Polysilicon Diode
Patent: 9,431,550 →
Application: 13/308,375 →
Publication: US 2012/0068178
Mosfet Termination Trench
Patent: 9,614,043 →
Application: 13/370,243 →
Publication: US 2013/0207227
Hybrid Split Gate Semiconductor
Application: 13/460,567 →
Publication: US 2012/0211828
Method of Forming a Hybrid Split Gate Simiconductor
Application: 13/460,600 →
Publication: US 2012/0220092
Heat Spreader for Electrical Components
Patent: 9,001,512 →
Application: 13/462,958 →
Publication: US 2012/0281363
Semiconductor Device Having Reduced Gate Charges and Superior Figure of Merit
Application: 13/475,255 →
Publication: US 2012/0292696
Adaptive Charge Balanced Edge Termination
Patent: 9,842,911 →
Application: 13/484,114 →
Publication: US 2013/0320462
Resistor with Temperature Coefficient of Resistance (Tcr) Compensation
Patent: 8,525,637 →
Application: 13/493,402 →
Publication: US 2012/0293299
Current Mode Boost Converter Using Slope Compensation
Patent: 9,423,812 →
Application: 13/551,516 →
Publication: US 2013/0169243
Circuit for Preventing Reverse Conduction
Patent: 8,836,404 →
Application: 13/565,672 →
Publication: US 2014/0035657
Resistor and Method for Making Same
Patent: 8,686,828 →
Application: 13/569,721 →
Publication: US 2012/0299694
Air Driven Reductant Delivery System
Patent: 8,881,507 →
Application: 13/592,091 →
Publication: US 2014/0053537
Highly Coupled Inductor
Application: 13/600,770 →
Publication: US 2013/0055556
Breakdown Voltage Blocking Device
Patent: 9,722,041 →
Application: 13/622,997 →
Publication: US 2014/0077287
Power Mosfet Contact Metallization
Patent: 8,697,571 →
Application: 13/654,230 →
Publication: US 2013/0040457
Surface Mount Resistor with Terminals for High-Powered Dissipation and Method for Making Same
Application: 13/689,928 →
Publication: US 2013/0091696
Method for Making Inductor Coil Structure
Application: 13/720,618 →
Publication: US 2013/0106562
Trench Metal Oxide Semiconductor with Recessed Trench Material and Remote Contacts
Patent: 8,883,580 →
Application: 13/728,997 →
Publication: US 2014/0235023
Adaptive Charge Balanced Mosfet Techniques
Patent: 9,853,140 →
Application: 13/732,284 →
Publication: US 2014/0183624
Integrated Circuit Element and Electronic Circuit for Light Emitting Diode Applications
Application: 13/750,404 →
Publication: US 2013/0193851
Low Profile High Current Composite Transformer
Application: 13/750,762 →
Publication: US 2014/0210584
Inductor with Thermally Stable Resistance
Patent: 8,975,994 →
Application: 13/768,039 →
Publication: US 2013/0285784
Stack Die Package
Patent: 9,966,330 →
Application: 13/829,623 →
Publication: US 2014/0264804
Method for Fabricating Stack Die Package
Patent: 9,589,929 →
Application: 13/830,041 →
Publication: US 2014/0273344
Current Limiting Systems and Methods
Patent: 9,793,706 →
Application: 13/867,964 →
Publication: US 2013/0279057
Integrated Circuit Element and Electronic Circuit for Light Emitting Diode Applications
Application: 61/591,018 →
Wireless Side Charging
Application: 61/751,562 →
Electronic Module and Method for Making Same
Application: 61/752,278 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 7, 2006
From: CHAU, THE-TU; LE, HOANG; CHEN, KUO-IN
To: VISHAY-SILICONIX
Reel/Frame 018508/0335 →
Assignment of Assignor's Interest Dec 4, 2006
From: OWYANG, KING; KASEM, MOHAMMED; BAI, YUMING; KUO, FRANK
To: VISHAY-SILICONIX
Reel/Frame 018651/0758 →
Assignment of Assignor's Interest Dec 22, 2006
From: PATTANAYAK, DEVA; CHEN, KUO-IN
To: VISHAY-SILICONIX
Reel/Frame 018737/0437 →
Assignment of Assignor's Interest Jan 8, 2007
From: LI, JIAN
To: VISHAY-SILICONIX
Reel/Frame 018791/0552 →
Assignment of Assignor's Interest Jun 7, 2007
From: BERSHADSKY, ELI; KRAVCHIK, MARINA; KATRARO, REUVEN; BEN-BASSAT, DAVID
To: VISHAY INTERTECHNOLOGY, INC.
Reel/Frame 019396/0012 →
Assignment of Assignor's Interest Jul 30, 2007
From: CHAU, THE-TU
To: VISHAY SILICONIX
Reel/Frame 019663/0374 →
Assignment of Assignor's Interest Aug 1, 2007
From: INTERNATIONAL RECTIFIER CORPORATION
To: SILICONIX TECHNOLOGY C. V.
Reel/Frame 019658/0714 →
Merger May 15, 2008
From: VISHAY VITRAMON, INCORPORATED
To: VISHAY SPRAGUE, INC.
Reel/Frame 020951/0047 →
Assignment of Assignor's Interest Jun 6, 2008
From: HANSEN, THOMAS T.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 021056/0494 →
Security Agreement Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →
Release of Security Interest Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION
Reel/Frame 025489/0184 →
Security Agreement Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
Assignment of Assignor's Interest Feb 3, 2011
From: BERSHADSKY, ELI; KRAVCHIK, MARINA; KATRARO, REUVEN; BEN-BASSAT, DAVID
To: VISHAY INTERTECHNOLOGY, INC.
Reel/Frame 025740/0282 →
Assignment of Assignor's Interest Sep 1, 2011
From: LARSEN, JOHN T.
To: SOLID STATE MAGNETICS CORPORATION
Reel/Frame 026845/0981 →
Assignment of Assignor's Interest Aug 7, 2012
From: HANSEN, THOMAS T.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 028739/0106 →
Assignment of Assignor's Interest Sep 25, 2012
From: HANSEN, THOMAS T.; HOFFMAN, JEROME J.; SHAFER, TIMOTHY; SCHADE, NICHOLAS J.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 029021/0264 →
Assignment of Assignor's Interest Oct 2, 2012
From: ZANDMAN, FELIX; SMITH, CLARK L.; WYATT, TODD L.; VEIK, THOMAS L.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 029062/0719 →
Assignment of Assignor's Interest Oct 20, 2012
From: KUO, FRANK
To: VISHAY-SILICONIX
Reel/Frame 029163/0139 →
Assignment of Assignor's Interest Apr 4, 2013
From: BELMAN, MICHAEL
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 030150/0003 →
Security Agreement Sep 5, 2013
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031170/0001 →
Change of Name Nov 18, 2015
From: VISHAY DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 037146/0050 →
Security Agreement Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
Assignment of Assignor's Interest Feb 13, 2017
From: BELANI, SURESH
To: VISHAY-SILICONIX
Reel/Frame 041243/0129 →
Security Interest Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049826/0312 →