IP Library Patent Application 13213877
Patent Application
App. No. 13/213,877

HIGH POWERED INDUCTORS USING A MAGNETIC BIAS

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Quick Facts
Patent No.
US None
App. No.
13/213,877
Abstract

A biased gap inductor includes a first ferromagnetic plate, a second ferromagnetic plate, a conductor sandwiched between the first ferromagnetic plate and the second ferromagnetic plate, and an adhesive between the first ferromagnetic plate and the second ferromagnetic plate, the adhesive comprising magnet powder to thereby form at least one magnetic gap. A method of forming an inductor includes providing a first ferromagnetic plate and a second ferromagnetic plate and a conductor, placing the conductor between the first ferromagnetic plate and the second ferromagnetic plate, adhering the first ferromagnetic plate to the second ferromagnetic plate with a composition comprising an adhesive and a magnet powder to form magnetic gaps, and magnetizing the inductor.

Claims (33)

1 . A biased gap inductor, comprising:

a first ferromagnetic plate;

a second ferromagnetic plate;

a conductor sandwiched between the first ferromagnetic plate and the second ferromagnetic plate;

an adhesive between the first ferromagnetic plate and the second ferromagnetic plate, the adhesive comprising magnet powder to thereby form at least one magnetic gap; and

wherein the adhesive having a thickness of less than 500 um.

2 . The biased gap inductor of claim 1 wherein the adhesive is epoxy.

3 . The biased gap inductor of claim 1 wherein the magnet powder comprises spherical rare earth magnetic particulate.

4 . The bias gaped inductor of claim 3 wherein the spherical rare earth magnetic particulate comprises a neodymium-iron-boron alloy.

5 . The bias gaped inductor of claim 3 wherein the spherical rare earth magnetic particulate comprises a samarium-cobalt alloy.

6 . The bias gaped inductor of claim 1 wherein each of the first ferromagnetic plate and the second ferromagnetic plate comprises ferrite.

7 . The bias gaped inductor of claim 1 wherein the conductor comprises copper.

8 . The bias gaped inductor of claim 1 wherein the conductor is configured in a multiple loop configuration.

9 . The bias gaped inductor of claim 1 wherein the adhesive comprises an adhesive film between the first ferromagnetic plate and the second ferromagnetic plate, and the thickness is used to define inductance characteristics of the inductor.

10 . The bias gaped inductor of claim 1 wherein the thickness is less than 100 um.

11 . A method of forming an inductor, comprising:

providing a first ferromagnetic plate and a second ferromagnetic plate and a conductor;

placing the conductor between the first ferromagnetic plate and the second ferromagnetic plate;

adhering the first ferromagnetic plate to the second ferromagnetic plate with a composition comprising an adhesive and a magnet powder to form magnetic gaps;

magnetizing the inductor; and

wherein the composition having a thickness of less than 500 um.

12 . The method of claim 11 wherein the step of adhering includes curing the adhesive.

13 . The method of claim 11 wherein the adhesive is epoxy.

14 . The method of claim 11 wherein the magnet powder comprises spherical rare earth magnetic particulate.

15 . The method of claim 11 wherein the magnet powder comprises spherical ceramic particulate.

16 . The method of claim 11 further comprising determining a type of magnet powder based on desired properties for the inductor, wherein the type includes the size of particles of the magnet powder.

17 . The method of claim 11 wherein the step of adhering includes screen printing the composition.

18 . The method of claim 11 wherein the thickness is less than 100 um.

19 . A biased gap inductor, comprising:

a first ferromagnetic plate;

a second ferromagnetic plate;

a conductor sandwiched between the first ferromagnetic plate and the second ferromagnetic plate;

a magnetic material having a thickness of less than 100 um between the first ferromagnetic plate and the second ferromagnetic plate to form at least one magnetic gap, wherein the thickness being used to define inductance characteristics of the inductor.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049785/0771 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
SECURITY AGREEMENT Recorded Sep 5, 2013
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031170/0001 →