Patent Assignment
Reel/Frame 031170/0001
Security Agreement
Recorded: 2013-09-05
Pages: 21
Assignors
VISHAY INTERTECHNOLOGY, INC.
Executed: 2013-08-08
VISHAY DALE ELECTRONICS, INC.
Executed: 2013-08-08
SILICONIX INCORPORATED
Executed: 2013-08-08
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 S. DEARBORN, 7TH FL, CHICAGO, ILLINOIS, 60603
Covered Properties
(45)
Gas-Based Substrate Deposition Protection
Patent:
5,925,411 →
Application:
08/487,789 →
Narrow Semiconductor Trench Structure
Complete Power Management System Implemented in a Single Surface Mount Package
Chip-Scale Schottky Device
High Mobility Power Metal-Oxide Semiconductor Field-Effect Transistors
High-Density Power Mosfet with Planarized Metalization
Ceramic Dielectric Formulation for Broad Band Uhf Antenna
High Powered Inductors Using a Magnetic Bias
Power Resistor
Precision High-Frequency Capacitor Formed on Semiconductor Substrate
Highly Coupled Inductor
Method for Making a High Current Low Profile Inductor
Application:
13/109,576 →
Publication:
US 2012/0086535
Four-Terminal Resistor with Four Resistors and Adjustable Temperature Coefficient of Resistance
Inductor with Thermally Stable Resistance
High Powered Inductors Using a Magnetic Bias
Application:
13/213,877 →
Publication:
US 2011/0298572
Flux Transfer Device
Dual Lead Frame Semiconductor Package and Method of Manufacture
Trench Polysilicon Diode
Mosfet Termination Trench
Hybrid Split Gate Semiconductor
Application:
13/460,567 →
Publication:
US 2012/0211828
Method of Forming a Hybrid Split Gate Simiconductor
Application:
13/460,600 →
Publication:
US 2012/0220092
Heat Spreader for Electrical Components
Semiconductor Device Having Reduced Gate Charges and Superior Figure of Merit
Adaptive Charge Balanced Edge Termination
Resistor with Temperature Coefficient of Resistance (Tcr) Compensation
Current Mode Boost Converter Using Slope Compensation
Circuit for Preventing Reverse Conduction
Resistor and Method for Making Same
Air Driven Reductant Delivery System
Highly Coupled Inductor
Application:
13/600,770 →
Publication:
US 2013/0055556
Breakdown Voltage Blocking Device
Power Mosfet Contact Metallization
Surface Mount Resistor with Terminals for High-Powered Dissipation and Method for Making Same
Application:
13/689,928 →
Publication:
US 2013/0091696
Method for Making Inductor Coil Structure
Application:
13/720,618 →
Publication:
US 2013/0106562
Trench Metal Oxide Semiconductor with Recessed Trench Material and Remote Contacts
Adaptive Charge Balanced Mosfet Techniques
Integrated Circuit Element and Electronic Circuit for Light Emitting Diode Applications
Application:
13/750,404 →
Publication:
US 2013/0193851
Low Profile High Current Composite Transformer
Inductor with Thermally Stable Resistance
Stack Die Package
Method for Fabricating Stack Die Package
Current Limiting Systems and Methods
Integrated Circuit Element and Electronic Circuit for Light Emitting Diode Applications
Application:
61/591,018 →
Wireless Side Charging
Application:
61/751,562 →
Electronic Module and Method for Making Same
Application:
61/752,278 →
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →
Release of Security Interest
Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION
Reel/Frame 025489/0184 →
Security Agreement
Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
Assignment of Assignor's Interest
Feb 3, 2011
From: BERSHADSKY, ELI; KRAVCHIK, MARINA; KATRARO, REUVEN; BEN-BASSAT, DAVID
To: VISHAY INTERTECHNOLOGY, INC.
Reel/Frame 025740/0282 →
Assignment of Assignor's Interest
Sep 1, 2011
From: LARSEN, JOHN T.
To: SOLID STATE MAGNETICS CORPORATION
Reel/Frame 026845/0981 →
Assignment of Assignor's Interest
Aug 7, 2012
From: HANSEN, THOMAS T.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 028739/0106 →
Assignment of Assignor's Interest
Sep 25, 2012
From: HANSEN, THOMAS T.; HOFFMAN, JEROME J.; SHAFER, TIMOTHY; SCHADE, NICHOLAS J.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 029021/0264 →
Assignment of Assignor's Interest
Oct 2, 2012
From: ZANDMAN, FELIX; SMITH, CLARK L.; WYATT, TODD L.; VEIK, THOMAS L.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 029062/0719 →
Assignment of Assignor's Interest
Oct 20, 2012
From: KUO, FRANK
To: VISHAY-SILICONIX
Reel/Frame 029163/0139 →
Assignment of Assignor's Interest
Apr 4, 2013
From: BELMAN, MICHAEL
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 030150/0003 →
Change of Name
Nov 18, 2015
From: VISHAY DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 037146/0050 →
Security Agreement
Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
Assignment of Assignor's Interest
Feb 13, 2017
From: BELANI, SURESH
To: VISHAY-SILICONIX
Reel/Frame 041243/0129 →
Security Interest
Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest
Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049826/0312 →
Release of Security Interest
Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049785/0771 →
Release of Security Interest
Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →