IP Library Assignment 029163/0139
Patent Assignment
Reel/Frame 029163/0139

Assignment of Assignor's Interest

Recorded: 2012-10-20 Pages: 2
Assignor
KUO, FRANK
Executed: 2011-12-12
Assignee
VISHAY-SILICONIX
2201 LAURELWOOD ROAD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Dual Lead Frame Semiconductor Package and Method of Manufacture
Patent: 8,822,273 →
Application: 13/229,667 →
Publication: US 2012/0112331
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Sep 5, 2013
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031170/0001 →
Assignment of Assignor's Interest Feb 13, 2017
From: BELANI, SURESH
To: VISHAY-SILICONIX
Reel/Frame 041243/0129 →
Security Interest Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
Release of Security Interest Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED
Reel/Frame 049785/0771 →